GB2021878A - Electrical connectors - Google Patents

Electrical connectors

Info

Publication number
GB2021878A
GB2021878A GB7917547A GB7917547A GB2021878A GB 2021878 A GB2021878 A GB 2021878A GB 7917547 A GB7917547 A GB 7917547A GB 7917547 A GB7917547 A GB 7917547A GB 2021878 A GB2021878 A GB 2021878A
Authority
GB
United Kingdom
Prior art keywords
carrier
socket
lsi device
contact
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7917547A
Other versions
GB2021878B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of GB2021878A publication Critical patent/GB2021878A/en
Application granted granted Critical
Publication of GB2021878B publication Critical patent/GB2021878B/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A system for connecting an LSI device to a printed circuit board comprising a leadless ceramic carrier 11, a leaded socket 20 and a cover member 50 wherein contact is made between the LSI device and the printed circuit board through staggered rows of closely spaced contact pads on the surface of the carrier 11 and contacts 40 contained in the socket 20. The LSI device is positioned within a recess 12 in the carrier which itself is seated within a recess 33 in the socket 20, staggered rows of contact areas 41 abutting the carrier contact pads. The cover member 50 presses the carrier 11 onto contact areas 41 and also serves to dissipate heat generated. <IMAGE>
GB7917547A 1978-05-22 1979-05-21 Electrical connectors Expired GB2021878B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US90815278A 1978-05-22 1978-05-22

Publications (2)

Publication Number Publication Date
GB2021878A true GB2021878A (en) 1979-12-05
GB2021878B GB2021878B (en) 1983-02-23

Family

ID=25425284

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7917547A Expired GB2021878B (en) 1978-05-22 1979-05-21 Electrical connectors

Country Status (5)

Country Link
JP (1) JPS54153570A (en)
CA (1) CA1116708A (en)
DE (2) DE2920943A1 (en)
FR (1) FR2427029A1 (en)
GB (1) GB2021878B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2479563A1 (en) * 1980-03-26 1981-10-02 Ouest Electronic Connecteurs Locking stirrup section for integrated circuit memory - has internal width equal to that of support and lateral sections with internal rim for contact under support to provide vibration protection
EP0047607A1 (en) * 1980-09-08 1982-03-17 AMP INCORPORATED (a New Jersey corporation) Electrical connector socket for bubble memory package
FR2494505A1 (en) * 1980-11-14 1982-05-21 Nippon Telegraph & Telephone ELECTRICAL CONNECTOR CONTACTS FOR WIRELESS CIRCUIT BOARDS
EP0279751A2 (en) * 1987-02-20 1988-08-24 Augat Inc. Minimum insertion force self-cleaning anti-overstress PLCC receiving socket
EP0549160A1 (en) * 1991-12-20 1993-06-30 Yamaichi Electronics Co., Ltd. Connector

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4351580A (en) * 1980-05-15 1982-09-28 Augat Inc. Carrier socket for leadless integrated circuit devices
US4491377A (en) * 1982-04-19 1985-01-01 Pfaff Wayne Mounting housing for leadless chip carrier
US4620761A (en) * 1985-01-30 1986-11-04 Texas Instruments Incorporated High density chip socket
JPH02113573U (en) * 1989-02-28 1990-09-11
JPH02113575U (en) * 1989-02-28 1990-09-11
JPH02113574U (en) * 1989-02-28 1990-09-11
DE102005048450B4 (en) * 2005-10-07 2010-07-15 Eads Deutschland Gmbh Sensor with an exchangeable sensor element, in particular pressure sensor

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE789688A (en) * 1971-10-06 1973-04-04 Amp Inc CONNECTOR
US3831131A (en) * 1971-11-08 1974-08-20 Bunker Ramo Integrated circuit package connectors
US3999827A (en) * 1975-10-10 1976-12-28 Burroughs Corporation Electrical connector for semiconductor device package

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2479563A1 (en) * 1980-03-26 1981-10-02 Ouest Electronic Connecteurs Locking stirrup section for integrated circuit memory - has internal width equal to that of support and lateral sections with internal rim for contact under support to provide vibration protection
EP0047607A1 (en) * 1980-09-08 1982-03-17 AMP INCORPORATED (a New Jersey corporation) Electrical connector socket for bubble memory package
FR2494505A1 (en) * 1980-11-14 1982-05-21 Nippon Telegraph & Telephone ELECTRICAL CONNECTOR CONTACTS FOR WIRELESS CIRCUIT BOARDS
EP0279751A2 (en) * 1987-02-20 1988-08-24 Augat Inc. Minimum insertion force self-cleaning anti-overstress PLCC receiving socket
EP0279751A3 (en) * 1987-02-20 1989-10-04 Augat Inc. Minimum insertion force self-cleaning anti-overstress plcc receiving socket
EP0549160A1 (en) * 1991-12-20 1993-06-30 Yamaichi Electronics Co., Ltd. Connector

Also Published As

Publication number Publication date
JPS6225262B2 (en) 1987-06-02
DE2920943C2 (en) 1989-06-08
DE2920943A1 (en) 1979-11-29
FR2427029A1 (en) 1979-12-21
JPS54153570A (en) 1979-12-03
CA1116708A (en) 1982-01-19
GB2021878B (en) 1983-02-23
FR2427029B1 (en) 1985-01-25
DE7915004U1 (en) 1979-10-31

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee