JPS6446930A - Base plate for sample - Google Patents
Base plate for sampleInfo
- Publication number
- JPS6446930A JPS6446930A JP8479888A JP8479888A JPS6446930A JP S6446930 A JPS6446930 A JP S6446930A JP 8479888 A JP8479888 A JP 8479888A JP 8479888 A JP8479888 A JP 8479888A JP S6446930 A JPS6446930 A JP S6446930A
- Authority
- JP
- Japan
- Prior art keywords
- heat exchange
- sample
- heat
- base plate
- base section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE:To cool or heat a sample placed onto a base section rapidly and efficiently as required, and to obtain a small-sized low-cost base plate by using a liquid as a refrigerant for a heat-exchange jacket. CONSTITUTION:A sample base plate has a base section 30, on the surface side of which a sample is placed, heat exchange elements 10A, 10B, one heat exchanging sections 22 of which are brought into contact with the rear side of the base section 30 and which cool or heat the base section 30 by utilizing the Peltier effect, and a heat exchange jacket 34 fast stuck to the other heat exchanging sections 24 of the heat exchange elements 10A, 10B. The heat exchange jacket 34 is cooled or heated by a liquid circulated from the outside. That is, since a liquid having high thermal conductivity is employed as a heat exchange medium for the heat exchange jacket 34, the flow rate of the heat exchange medium required at the time of cooling or heating may be made extremely smaller than conventional devices, and the base plate 30 can be heated or cooled up to a temperature range which has not been able to be used. Accordingly, the small-sized low-cost sample base plate capable of efficiently cooling or heating the sample is acquired.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63084798A JPH07111994B2 (en) | 1987-05-30 | 1988-04-06 | Sample stand |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13706187 | 1987-05-30 | ||
JP62-137061 | 1987-05-30 | ||
JP63084798A JPH07111994B2 (en) | 1987-05-30 | 1988-04-06 | Sample stand |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6446930A true JPS6446930A (en) | 1989-02-21 |
JPH07111994B2 JPH07111994B2 (en) | 1995-11-29 |
Family
ID=26425792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63084798A Expired - Lifetime JPH07111994B2 (en) | 1987-05-30 | 1988-04-06 | Sample stand |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07111994B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030090281A (en) * | 2002-05-22 | 2003-11-28 | 삼성전자주식회사 | Electrostatic chuck |
JP2004259829A (en) * | 2003-02-25 | 2004-09-16 | Hitachi High-Technologies Corp | Plasma treatment device |
JP2010091438A (en) * | 2008-10-09 | 2010-04-22 | Yokogawa Electric Corp | Semiconductor testing apparatus |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4799365B2 (en) * | 2006-10-27 | 2011-10-26 | パナソニック株式会社 | Manufacturing method of semiconductor device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5318967A (en) * | 1976-08-05 | 1978-02-21 | Nec Corp | Wafer sucking jig |
JPS5749248A (en) * | 1980-09-09 | 1982-03-23 | Fujitsu Ltd | Substrate heating and retaining device |
JPS61238985A (en) * | 1985-04-16 | 1986-10-24 | Teru Ramu Kk | Parallel flat plate type plasma etching device |
-
1988
- 1988-04-06 JP JP63084798A patent/JPH07111994B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5318967A (en) * | 1976-08-05 | 1978-02-21 | Nec Corp | Wafer sucking jig |
JPS5749248A (en) * | 1980-09-09 | 1982-03-23 | Fujitsu Ltd | Substrate heating and retaining device |
JPS61238985A (en) * | 1985-04-16 | 1986-10-24 | Teru Ramu Kk | Parallel flat plate type plasma etching device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030090281A (en) * | 2002-05-22 | 2003-11-28 | 삼성전자주식회사 | Electrostatic chuck |
JP2004259829A (en) * | 2003-02-25 | 2004-09-16 | Hitachi High-Technologies Corp | Plasma treatment device |
JP2010091438A (en) * | 2008-10-09 | 2010-04-22 | Yokogawa Electric Corp | Semiconductor testing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH07111994B2 (en) | 1995-11-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081129 Year of fee payment: 13 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081129 Year of fee payment: 13 |