JPS6446930A - Base plate for sample - Google Patents

Base plate for sample

Info

Publication number
JPS6446930A
JPS6446930A JP8479888A JP8479888A JPS6446930A JP S6446930 A JPS6446930 A JP S6446930A JP 8479888 A JP8479888 A JP 8479888A JP 8479888 A JP8479888 A JP 8479888A JP S6446930 A JPS6446930 A JP S6446930A
Authority
JP
Japan
Prior art keywords
heat exchange
sample
heat
base plate
base section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8479888A
Other languages
Japanese (ja)
Other versions
JPH07111994B2 (en
Inventor
Masahiko Sugiyama
Masahiko Kono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP63084798A priority Critical patent/JPH07111994B2/en
Publication of JPS6446930A publication Critical patent/JPS6446930A/en
Publication of JPH07111994B2 publication Critical patent/JPH07111994B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE:To cool or heat a sample placed onto a base section rapidly and efficiently as required, and to obtain a small-sized low-cost base plate by using a liquid as a refrigerant for a heat-exchange jacket. CONSTITUTION:A sample base plate has a base section 30, on the surface side of which a sample is placed, heat exchange elements 10A, 10B, one heat exchanging sections 22 of which are brought into contact with the rear side of the base section 30 and which cool or heat the base section 30 by utilizing the Peltier effect, and a heat exchange jacket 34 fast stuck to the other heat exchanging sections 24 of the heat exchange elements 10A, 10B. The heat exchange jacket 34 is cooled or heated by a liquid circulated from the outside. That is, since a liquid having high thermal conductivity is employed as a heat exchange medium for the heat exchange jacket 34, the flow rate of the heat exchange medium required at the time of cooling or heating may be made extremely smaller than conventional devices, and the base plate 30 can be heated or cooled up to a temperature range which has not been able to be used. Accordingly, the small-sized low-cost sample base plate capable of efficiently cooling or heating the sample is acquired.
JP63084798A 1987-05-30 1988-04-06 Sample stand Expired - Lifetime JPH07111994B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63084798A JPH07111994B2 (en) 1987-05-30 1988-04-06 Sample stand

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP13706187 1987-05-30
JP62-137061 1987-05-30
JP63084798A JPH07111994B2 (en) 1987-05-30 1988-04-06 Sample stand

Publications (2)

Publication Number Publication Date
JPS6446930A true JPS6446930A (en) 1989-02-21
JPH07111994B2 JPH07111994B2 (en) 1995-11-29

Family

ID=26425792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63084798A Expired - Lifetime JPH07111994B2 (en) 1987-05-30 1988-04-06 Sample stand

Country Status (1)

Country Link
JP (1) JPH07111994B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030090281A (en) * 2002-05-22 2003-11-28 삼성전자주식회사 Electrostatic chuck
JP2004259829A (en) * 2003-02-25 2004-09-16 Hitachi High-Technologies Corp Plasma treatment device
JP2010091438A (en) * 2008-10-09 2010-04-22 Yokogawa Electric Corp Semiconductor testing apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4799365B2 (en) * 2006-10-27 2011-10-26 パナソニック株式会社 Manufacturing method of semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318967A (en) * 1976-08-05 1978-02-21 Nec Corp Wafer sucking jig
JPS5749248A (en) * 1980-09-09 1982-03-23 Fujitsu Ltd Substrate heating and retaining device
JPS61238985A (en) * 1985-04-16 1986-10-24 Teru Ramu Kk Parallel flat plate type plasma etching device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318967A (en) * 1976-08-05 1978-02-21 Nec Corp Wafer sucking jig
JPS5749248A (en) * 1980-09-09 1982-03-23 Fujitsu Ltd Substrate heating and retaining device
JPS61238985A (en) * 1985-04-16 1986-10-24 Teru Ramu Kk Parallel flat plate type plasma etching device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030090281A (en) * 2002-05-22 2003-11-28 삼성전자주식회사 Electrostatic chuck
JP2004259829A (en) * 2003-02-25 2004-09-16 Hitachi High-Technologies Corp Plasma treatment device
JP2010091438A (en) * 2008-10-09 2010-04-22 Yokogawa Electric Corp Semiconductor testing apparatus

Also Published As

Publication number Publication date
JPH07111994B2 (en) 1995-11-29

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