CN212746956U - Semiconductor local refrigeration equipment based on thermoelectric effect - Google Patents
Semiconductor local refrigeration equipment based on thermoelectric effect Download PDFInfo
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- CN212746956U CN212746956U CN202021405663.9U CN202021405663U CN212746956U CN 212746956 U CN212746956 U CN 212746956U CN 202021405663 U CN202021405663 U CN 202021405663U CN 212746956 U CN212746956 U CN 212746956U
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Abstract
The utility model discloses a local refrigeration plant of semiconductor based on thermoelectric effect. The apparatus comprises: the cooling device comprises a cooling surface, a thermoelectric semiconductor cooling piece, a heat dissipation assembly, a temperature sensor and a temperature controller; the thermoelectric semiconductor refrigerating piece comprises a low-temperature end and a high-temperature end; the surface of the refrigerating surface is divided into an A surface and a B surface, the B surface of the refrigerating surface is connected with the low-temperature end of the thermoelectric semiconductor refrigerating piece, and the heat dissipation assembly is connected with the high-temperature end of the thermoelectric semiconductor refrigerating piece; the temperature sensor is connected with the surface A of the refrigerating surface; the temperature controller is respectively connected with the temperature sensor, the low-temperature end of the thermoelectric semiconductor refrigeration piece and the heat dissipation assembly. The utility model discloses can be fresh-keeping for scientific research laboratory local refrigeration, medical treatment cooling treatment, food cooling, biotechnology etc. need provide portable, miniature refrigeration plant in open space local refrigerated occasion.
Description
Technical Field
The utility model belongs to the technical field of the refrigeration, concretely relates to local refrigeration plant of semiconductor based on thermoelectric effect.
Background
At present, refrigeration is used in many fields such as daily life, industrial production, food preservation and the like. The refrigeration method is to compress the easily liquefied gas by a compressor to liquefy the gas, and then to absorb heat by evaporation of the liquid to lower the temperature of the environment. Generally, this conventional refrigeration method requires a compressor, so that a certain noise is generated during operation, and the volume of the refrigerator cannot be made small. In addition, the refrigerating method needs refrigerant as medium, and the chemical substances leak to a certain extent in the operation process of the refrigerator, especially when the refrigerator is abandoned, the refrigerant can leak into the environment completely, thereby causing a certain degree of environmental pollution, such as greenhouse effect, ozone layer destruction and the like.
A thermoelectric material is a material that can convert a potential difference into a temperature difference. When a voltage is established across the thermoelectric material, one end of the material will cool and the other end will heat up, converting the potential difference into a temperature difference, which is the principle of semiconductor cooling based on the thermoelectric effect. This refrigeration principle is a physical process. In the presence of an applied voltage, carriers within the semiconductor material migrate from one end to the other under the influence of an electric field, while also transferring heat from one end to the other. The end that loses heat drops in temperature, commonly referred to as the cold end; and the end that receives the heat, often referred to as the hot end, will increase in temperature. The cold end of the material is now available for refrigeration. The advantages of this refrigeration principle are: the whole device has no movable parts, so that the device has no noise when running, runs stably, almost does not need maintenance, and can be used for more than 10 years. And no gas harmful to the environment is generated in the operation process, and the refrigeration speed is high and can reach-2 ℃ within 1 minute. The semiconductor refrigerator has small volume and is very convenient to carry, can be used for manufacturing portable refrigerators similar to vehicle-mounted refrigerators and the like, and is also convenient for providing cold sources for occasions needing local refrigeration.
However, the semiconductor refrigeration equipment based on thermoelectric effect in the prior art is mostly used for refrigerating a closed space, the temperature control is not accurate enough, and the refrigeration precision is low. The refrigerating surface of the common semiconductor refrigerating equipment is single, the equipment volume is large, and the application is limited.
SUMMERY OF THE UTILITY MODEL
The utility model provides a local refrigeration plant of semiconductor, equipment includes: the cooling device comprises a cooling surface, a thermoelectric semiconductor cooling piece, a heat dissipation assembly, a temperature sensor and a temperature controller;
the thermoelectric semiconductor refrigerating piece comprises a low-temperature end and a high-temperature end;
the surface of the refrigerating surface is divided into an A surface and a B surface, the B surface of the refrigerating surface is connected with the low-temperature end of the thermoelectric semiconductor refrigerating piece, and the heat dissipation assembly is connected with the high-temperature end of the thermoelectric semiconductor refrigerating piece; the temperature sensor is connected with the surface A of the refrigerating surface;
the temperature controller is respectively connected with the temperature sensor, the low-temperature end of the thermoelectric semiconductor refrigeration piece and the heat dissipation assembly.
According to an embodiment of the present invention, the a side and the B side are opposite sides of the refrigerating side, such as two sides opposite from each other up and down or two sides opposite from each other inside and outside.
According to the embodiment of the present invention, the temperature sensor may be disposed on the a surface of the refrigeration surface or a position close to the a surface, such as the geometric center of the a surface and/or may be disposed on other different positions of the a surface of the refrigeration surface, so as to achieve uniform temperature distribution at each position of the a surface; in addition, different parts of the refrigerating surface can reach different temperatures through the temperature controller, so that designed temperature gradient distribution is formed.
According to an embodiment of the present invention, the number of the temperature sensors is at least one, for example, two, three or more. When the number of the temperature sensors is more than or equal to 2, the temperature sensors are in parallel connection.
According to the utility model discloses an embodiment, the B face of refrigeration face passes through the temperature of refrigeration face body transmission to the A face of refrigeration face with the temperature of low temperature end, detects the temperature of A face by temperature sensor.
According to an embodiment of the present invention, the number of the thermoelectric semiconductor cooling fins is at least one, and for example, may be two, three or more. When the number of the thermoelectric semiconductor refrigerating pieces is more than or equal to 2, the thermoelectric semiconductor refrigerating pieces are connected in parallel. And each refrigeration piece is controlled by the temperature controller alone, so the temperature of the refrigeration surface can be regulated and controlled, and the temperature of each part is uniformly distributed. In addition, different parts of the refrigerating surface can reach different temperatures through the temperature controller, so that designed temperature gradient distribution is formed. Preferably, the low-temperature ends of the thermoelectric semiconductor refrigeration pieces are uniformly distributed on the surface B of the refrigeration surface.
According to the utility model discloses an embodiment, the material of thermoelectric semiconductor refrigeration piece can be Bi2Te3And Sb2Te3And the like.
According to the utility model discloses an embodiment, the shape of refrigeration face can be adjusted according to the shape of treating the cooling object. For example, the refrigeration surface can be a plane, a curved surface, a spherical surface, a grating plate, an array and other irregularly-shaped surfaces; illustratively, the cooling surface may be any one of a flat surface, a rod-like surface, a popsicle-like surface, an arc-shaped surface (e.g., a hemispherical surface), a square barrel-shaped surface, a cylindrical surface, and the like. As another example, the refrigeration surface may be perforated or non-perforated; further, the holes may be through holes or non-through holes.
According to an embodiment of the present invention, the a side may also be in contact with an object to be cooled.
According to the embodiment of the present invention, the material of the refrigerating surface is a metal with excellent heat transfer performance, such as a5052 aluminum alloy, 304 stainless steel, brass, and the like.
According to the utility model discloses an embodiment, the refrigeration face is metal plate surface or metal bar surface. The surface A and the surface B of the refrigeration surface are two surfaces which are opposite up and down. The temperature sensors are arranged at the geometric center position of the A surface of the metal flat plate or the metal rod and/or at two sides of the geometric center. The number of the thermoelectric semiconductor refrigerating pieces can be three, and the thermoelectric semiconductor refrigerating pieces are distributed on the surface B of the metal flat plate or the metal bar at uniform intervals so as to enable heat transfer to be uniform.
According to the utility model discloses an embodiment, the refrigeration face is the metal block surface that has at least one through-hole or non-through hole. The size of the hole can be determined according to the size and the shape of the test tube or other liquid containers, and the test tube or other liquid containers can be placed in the hole of the refrigerating plate, so that samples in the test tube or other liquid containers can be better cooled. Wherein the temperature sensor is arranged on the surface A close to the through hole of the metal block. Wherein the number of the thermoelectric semiconductor chilling plates can be the same as the number of the holes; preferably, the thermoelectric semiconductor chilling plates are disposed directly below the aperture.
According to one embodiment of the present invention, the refrigeration surface is a popsicle-like surface. The surface A of the refrigeration surface is the inner surface of the refrigeration surface, and the surface B of the refrigeration surface is the outer surface of the refrigeration surface. Can be used for a portable ice cream maker, can simply and quickly make ice cream in a camping place, or can be used for cooling carbonated beverages and the like.
According to the utility model discloses an embodiment, the refrigeration face is half spherical face. Wherein, the temperature sensors are arranged at four ends of the semi-spherical surface and the position where the semi-spherical surface is tangent with the horizontal plane. The number of the thermoelectric semiconductor refrigerating pieces can be five, and the thermoelectric semiconductor refrigerating pieces are respectively arranged at four hemispherical ends and at the positions where the hemispherical surfaces are tangent to the horizontal plane. Preferably, the temperature sensor is located close to the a-side, and the thermoelectric semiconductor cooling plate is generally located behind the temperature sensor, but not limited to the rear, and is partially embedded in the B-side. The surface A is the inner surface facing the center of a circle, and the surface B is the opposite surface to the surface A. The hemispherical refrigeration surface can be used for cooling a laboratory round-bottom flask. For example, some organic reactions are carried out in a round-bottom flask and require ice bath cooling, generally, the round-bottom flask is continuously provided with a cold source by the aid of a spherical cooling platform to keep the reaction temperature at the temperature of the ice bath, and ice blocks do not need to be added manually. And the apparatus may be set to a temperature other than the deicing bath temperature (0 ℃).
According to the utility model discloses an embodiment, the refrigeration face is square barrel face. The surface A of the refrigeration surface is the inner surface of the refrigeration surface, and the surface B of the refrigeration surface is the outer surface of the refrigeration surface. The temperature sensor can be arranged on the surface A of the refrigeration surface, which is vertical to the horizontal plane, and the surface A which is parallel to the horizontal plane. The thermoelectric semiconductor refrigeration piece can be arranged on a surface B of the refrigeration surface, which is vertical to the horizontal plane, and a surface B which is parallel to the horizontal plane. The square barrel-shaped cooling surface is used for cooling a square reactor or other relatively general reactions.
According to the utility model discloses an embodiment, the refrigeration face is the drum face. The surface A of the refrigeration surface is the inner surface of the refrigeration surface, and the surface B of the refrigeration surface is the outer surface of the refrigeration surface. The temperature sensors are arranged at the center of the bottom surface of the cylindrical surface and the cylinder wall of the surface A. The thermoelectric semiconductor refrigerating pieces are uniformly dispersed and arranged around the surface B. The cylindrical cooling surface is used for cooling a cylindrical reactor or other relatively general reaction.
According to the utility model discloses an embodiment, thermoelectric semiconductor refrigeration piece with the B face direct contact of refrigeration face, perhaps thermoelectric semiconductor refrigeration piece with set up the heat conduction material layer, for example heat conduction glue film between the B face of refrigeration face.
According to the utility model discloses an embodiment, radiator unit can be air-cooled cooler or water-cooled cooler. For example, the heat dissipation assembly includes a heat sink, a heat dissipation fan connected to the heat sink, and a fixing bracket for fixing the heat dissipation fan. Wherein the heat sink is a metal heat sink, such as a copper heat sink, an aluminum heat sink, or an alloy heat sink. Further, the heat dissipation fan is electrically connected with the temperature controller. Further, the heat sink is directly connected to the high-temperature end of the thermoelectric semiconductor refrigeration plate, or a heat conductive material layer, such as a heat conductive adhesive layer, is disposed between the heat sink and the high-temperature end of the thermoelectric semiconductor refrigeration plate.
According to the utility model discloses an embodiment, the quantity of radiator unit with the quantity of thermoelectric semiconductor refrigeration piece is the same or different.
According to the utility model discloses an embodiment, temperature controller is connected with external power supply for provide the potential difference for thermoelectric semiconductor refrigeration piece.
According to the utility model discloses an embodiment, temperature controller can also be connected with the computer, through the temperature that sets up of computer control temperature controller to the computer can set up the temperature of different thermoelectric semiconductor refrigeration pieces, makes the refrigeration face have different temperatures, thereby can make the refrigerator reach the cryogenic purpose of gradient.
According to the utility model discloses an embodiment, temperature controller with the low temperature end and the radiator unit of temperature sensor, thermoelectric semiconductor refrigeration piece are connected through control circuit respectively. The control circuit comprises a temperature setter, a temperature sensor, a logic arithmetic unit and a control switch which are connected in sequence. Preferably, the control switch comprises a fan control switch and a thermoelectric semiconductor refrigeration chip control switch which are connected in parallel.
The utility model also provides a refrigerating method of above-mentioned semiconductor local refrigeration plant, including following step: after the power is switched on, voltage is applied to the two ends of the thermoelectric semiconductor refrigerating piece, the temperature of the high-temperature end of the thermoelectric semiconductor refrigerating piece rises, and the temperature of the low-temperature end of the thermoelectric semiconductor refrigerating piece falls; the temperature of the low-temperature end is transmitted to the refrigerating surface, the temperature sensor arranged on the refrigerating surface feeds back temperature data to the temperature controller, the temperature controller feeds back a control signal to the thermoelectric semiconductor refrigerating sheet according to the difference value of the set temperature and the temperature obtained by testing, and finally the temperature on the surface of the refrigerating surface reaches the set temperature. After the refrigerating sheet is opened, the high-temperature end of the refrigerating sheet needs to dissipate heat, and meanwhile, the cooling fan and/or the cooler is/are opened, so that the heat dissipation speed of the high-temperature end is accelerated, and the refrigerating efficiency of the refrigerating sheet is improved.
According to the utility model discloses an embodiment, temperature controller can link to each other with the computer to through the temperature that sets up of computer control temperature controller, and the computer can set up the temperature of different semiconductor refrigeration pieces, make the refrigeration face have different temperatures, thereby can make refrigeration plant reach the cryogenic purpose of gradient.
The utility model discloses still provide the application of above-mentioned refrigeration plant in open space local refrigeration. The method is preferably applied to local refrigeration in scientific research laboratories, medical cooling treatment, food cooling and fresh keeping, biological refrigeration and the like which need to be applied to the local refrigeration in open spaces.
The utility model has the advantages that:
the utility model provides a local refrigeration plant based on thermoelectric semiconductor refrigeration principle, the refrigeration face can be adjusted according to the shape of waiting to cool off the thing, has greatly enlarged the range of application of this equipment. The equipment can provide portable and small refrigeration equipment for local refrigeration, medical cooling treatment, food cooling and fresh keeping in scientific research laboratories, biotechnology and other occasions requiring local refrigeration in open spaces. The refrigeration equipment has the effect of rapid refrigeration, the refrigeration equipment can cool the refrigeration surface from room temperature to minus 2 ℃ within 1 minute according to the embodiment, and the temperature control accuracy is 1 ℃. In addition, the equipment can be controlled by a computer, the temperature of the controller is set by the computer, and meanwhile, the data of the temperature of the refrigerating surface changing along with time are recorded. The temperature of different semiconductor refrigerating sheets can be set, so that the refrigerating surfaces have different temperatures, and the aim of gradient refrigeration of the refrigerating equipment can be fulfilled.
Drawings
Fig. 1 is a schematic view of an apparatus structure of a plate-type refrigerating surface provided in embodiment 1 of the present invention.
Fig. 2 is an apparatus structure schematic diagram of the perforated refrigerating surface provided in embodiment 2 of the present invention.
Fig. 3 is an apparatus structure schematic diagram of a rod-shaped refrigerating surface provided in embodiment 3 of the present invention.
Fig. 4 is a schematic view of an apparatus structure of an ice cream type refrigerating surface provided in embodiment 4 of the present invention.
Fig. 5 is an apparatus structure schematic diagram of a hemispherical refrigeration surface provided in embodiment 5 of the present invention.
Fig. 6 is a schematic view of an apparatus structure of a square-barrel-shaped refrigerating surface provided in embodiment 6 of the present invention.
Fig. 7 is an apparatus structural schematic diagram of a cylindrical refrigerating surface provided in embodiment 7 of the present invention.
Fig. 8 is a control logic diagram of the refrigeration apparatus.
Fig. 9 is a control circuit diagram of the refrigeration apparatus.
Description of reference numerals: the system comprises a thermoelectric semiconductor refrigerating sheet 1, a temperature sensor 2, a refrigerating surface 3, a radiating fin 4, a fan fixing frame 5, a fan 6, a temperature controller 7, a computer 8, a power supply 9, a temperature setter 10, a logic arithmetic unit 11, a thermoelectric semiconductor refrigerating sheet control switch 12, a fan control switch 13 and a through hole 14.
Detailed Description
The technical solution of the present invention will be further described in detail with reference to the following embodiments. It is to be understood that the following examples are illustrative only and are not to be construed as limiting the scope of the invention. All the technologies realized based on the above mentioned contents of the present invention are covered in the protection scope of the present invention.
Unless otherwise indicated, the raw materials and reagents used in the following examples are all commercially available products or can be prepared by known methods.
Example 1
The horizontal panel refrigerator shown in fig. 1 comprises a refrigerating surface 3, a thermoelectric semiconductor refrigerating sheet 1, a heat dissipation assembly, a temperature sensor 2 and a temperature controller 7;
the refrigeration face 3 is a metal horizontal panel, and the material of the refrigeration face 3 is aluminum alloy with the thickness of 10 mm. The thermoelectric semiconductor refrigerating chip 1 comprises a low-temperature end and a high-temperature end; the surface of the refrigerating surface 3 is divided into a surface A and a surface B, the surface A and the surface B are two surfaces which are opposite up and down of a metal horizontal panel, the surface B of the refrigerating surface is connected with the low-temperature end of the thermoelectric semiconductor refrigerating piece 1, and the heat dissipation assembly is connected with the high-temperature end of the thermoelectric semiconductor refrigerating piece 1; the three temperature sensors 2 are respectively arranged at the center of the surface A of the refrigerating surface and at two symmetrical sides of the center;
the B surface of the refrigeration surface transmits the temperature of the low-temperature end to the A surface of the refrigeration surface through the refrigeration surface body, and the temperature of the A surface is detected by the temperature sensor.
The temperature controller 7 is respectively connected with the temperature sensor 2, the low-temperature end of the thermoelectric semiconductor refrigerating sheet 1 and the heat dissipation assembly.
The number of the thermoelectric semiconductor refrigerating pieces 1 is three, and the thermoelectric semiconductor refrigerating pieces are distributed on the surface B of the refrigerating surface at uniform intervals so as to ensure that heat transfer is uniform.
The heat dissipation assembly includes a heat sink 4, a fan 6 connected to the heat sink 4, and a fixing bracket 5 for fixing the fan. The heat sink 4 is a metal heat sink, and the fan 6 is electrically connected to the temperature controller 7. The heat sink 4 is directly connected with the high-temperature end of the thermoelectric semiconductor refrigerating chip 1.
The temperature controller 7 is connected with a power supply 9 and is used for providing potential difference for the thermoelectric semiconductor chilling plate 1.
The temperature controller 7 is also connected with the computer 8, the temperature setting of the temperature controller is controlled by the computer 8, and the computer can set the temperature of different thermoelectric semiconductor refrigerating sheets to enable the refrigerating surfaces to have different temperatures, so that the purpose of gradient refrigeration of the refrigerator is achieved.
The model of the temperature sensor is PT100, the temperature controller is a Watlow temperature controller (PM6C1CJ-1RAADAA), and the model of the thermoelectric semiconductor refrigerating sheet is TEC 1-12706. The temperature of the refrigerating equipment can reach-2 ℃ within 1 minute, but the temperature of-2 ℃ is not the lowest temperature.
Example 2
The refrigeration equipment as shown in fig. 2 mainly differs from the embodiment 1 in that:
the refrigeration surface 3 is the surface of a metal block with through holes 14. The through-hole 14 can be sized according to the size and shape of the tube or other liquid container that can be placed into the bore of the cold plate to better cool the sample in the tube or other liquid container.
The temperature sensor 2 is disposed on the a-face near the through-hole of the metal block. The number of the thermoelectric semiconductor chilling plates 1 is the same as or different from that of the through holes 14, and the thermoelectric semiconductor chilling plates 1 are arranged right below the through holes 14. And set up different refrigeration temperatures for the temperature sensor of through-hole below through temperature controller: from left to right are 5, 0 and-5 ℃ respectively, so that the through holes from left to right establish a temperature gradient of 5, 0 and-5 ℃.
Example 3
The refrigeration equipment as shown in fig. 3 mainly differs from the embodiment 1 in that:
the refrigerating surface 3 is a metal bar surface. The number of the temperature sensors 2 is 1, and the temperature sensors are disposed at the center position of the a-face of the metal bar. The number of the thermoelectric semiconductor refrigerating pieces 1 is 1, and the thermoelectric semiconductor refrigerating pieces are arranged on the surface B of the metal rod.
Example 4
The refrigeration equipment shown in fig. 4 mainly differs from the refrigeration equipment of embodiment 1 in that:
the refrigerating surface 3 is an ice cream-shaped surface. The surface A of the refrigeration surface is the inner surface of the refrigeration surface, and the surface B of the refrigeration surface is the outer surface of the refrigeration surface. The number of the temperature sensors 2 is 1, and the temperature sensors are provided at the center position of the a-plane of the cooling surface. The number of the thermoelectric semiconductor refrigerating pieces 1 is 1, and the thermoelectric semiconductor refrigerating pieces are arranged on the surface B of the metal rod.
The portable ice cream maker is used for simply and quickly making ice cream in a camping place in the open air or cooling carbonated beverages and the like.
Example 5
The refrigeration equipment shown in fig. 5 mainly differs from embodiment 1 in that:
the refrigerating surface 3 is a semi-spherical surface. The number of the temperature sensors 2 is 5, and the temperature sensors are respectively arranged at four ends of the hemispherical surface and the positions where the hemispherical surface is tangent to the horizontal plane. The number of the thermoelectric semiconductor refrigerating pieces 1 is five, and the thermoelectric semiconductor refrigerating pieces are respectively arranged at four hemispherical ends and at the positions where hemispherical surfaces are tangent to a horizontal plane. The temperature sensor is located close to the A surface, and the thermoelectric semiconductor chilling plate is usually located behind the temperature sensor, but not limited to the rear, and is partially embedded in the B surface. The surface A is the inner surface facing the center of a circle, and the surface B is the opposite surface to the surface A.
The hemispherical refrigeration surface is used for cooling a laboratory round-bottomed flask, and the equipment can set the temperature except the temperature of a deicing bath (0 ℃).
As shown in fig. 9, the control circuit structure includes a temperature setter 10, a temperature sensor 2, a logic operator 11 and a control switch, which are connected in sequence, and the control switch includes a fan control switch 13 and a thermoelectric semiconductor cooling plate control switch 12 connected in parallel.
Example 6
The refrigeration equipment shown in fig. 6 mainly differs from embodiment 1 in that:
the refrigerating surface 3 is a square barrel-shaped surface. The surface A of the refrigeration surface is the inner surface of the refrigeration surface, and the surface B of the refrigeration surface is the outer surface of the refrigeration surface. The number of the temperature sensors is 5, and the temperature sensors are respectively arranged on the surface A of the refrigeration surface perpendicular to the horizontal plane and the surface A parallel to the horizontal plane. The number of the thermoelectric semiconductor refrigerating pieces is 6, and the thermoelectric semiconductor refrigerating pieces are respectively arranged on a B surface of the refrigerating surface vertical to the horizontal plane and a B surface parallel to the horizontal plane. The square barrel-shaped cooling surface is used for cooling a square reactor or other relatively general reactions.
Example 7
The refrigeration equipment shown in fig. 7 mainly differs from embodiment 1 in that:
the refrigerating surface 3 is a cylindrical surface. The surface A of the refrigeration surface is the inner surface of the refrigeration surface, and the surface B of the refrigeration surface is the outer surface of the refrigeration surface. The number of the temperature sensors is 5, and the temperature sensors are respectively arranged at the circle center of the bottom surface of the cylindrical surface and the cylindrical wall of the surface A. The number of the thermoelectric semiconductor refrigerating pieces is 8, and the thermoelectric semiconductor refrigerating pieces are uniformly distributed around the surface B. The cylindrical cooling surface is used for cooling a cylindrical reactor or other relatively general reaction.
Example 8
Embodiment 1-7 a method for cooling a semiconductor local cooling device, comprising the steps of (as shown in fig. 8): after the power is switched on, voltage is applied to the two ends of the thermoelectric semiconductor refrigerating piece, the temperature of the high-temperature end of the thermoelectric semiconductor refrigerating piece rises, and the temperature of the low-temperature end of the thermoelectric semiconductor refrigerating piece falls; the temperature of the low-temperature end is transmitted to the refrigerating surface, the temperature sensor arranged on the refrigerating surface feeds back temperature data to the temperature controller, the temperature controller feeds back a control signal to the thermoelectric semiconductor refrigerating sheet according to the difference value of the set temperature and the temperature obtained by testing, and finally the temperature on the surface of the refrigerating surface reaches the set temperature. After the refrigerating sheet is opened, the high-temperature end of the refrigerating sheet needs to dissipate heat, and meanwhile, the cooling fan and/or the cooler is/are opened, so that the heat dissipation speed of the high-temperature end is accelerated, and the refrigerating efficiency of the refrigerating sheet is improved.
The temperature controller is connected with the computer, the temperature setting of the temperature controller is controlled by the computer, and the computer sets the temperatures of different semiconductor refrigerating sheets, so that the refrigerating surfaces have different temperatures, and the aim of gradient refrigeration of the refrigerating equipment is fulfilled.
The embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiment. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A semiconductor local cooling device, characterized in that the device comprises: the cooling device comprises a cooling surface, a thermoelectric semiconductor cooling piece, a heat dissipation assembly, a temperature sensor and a temperature controller;
the thermoelectric semiconductor refrigerating piece comprises a low-temperature end and a high-temperature end;
the surface of the refrigerating surface is divided into an A surface and a B surface, the B surface of the refrigerating surface is connected with the low-temperature end of the thermoelectric semiconductor refrigerating piece, and the heat dissipation assembly is connected with the high-temperature end of the thermoelectric semiconductor refrigerating piece; the temperature sensor is connected with the surface A of the refrigerating surface;
the surface A and the surface B are two opposite surfaces of the refrigerating surface: two surfaces which are opposite up and down or two surfaces which are opposite inside and outside;
the temperature controller is respectively connected with the temperature sensor, the low-temperature end of the thermoelectric semiconductor refrigeration piece and the heat dissipation assembly.
2. The semiconductor local refrigerating device of claim 1, wherein the temperature sensor is arranged at the geometric center of the surface A of the refrigerating surface and/or at different positions of the surface A of the refrigerating surface, so that each part of the surface A can achieve uniform temperature distribution;
the number of the temperature sensors is at least one; when the number of the temperature sensors is more than or equal to 2, the temperature sensors are in parallel connection;
the surface B of the refrigeration surface transmits the temperature of the low-temperature end to the surface A of the refrigeration surface through the refrigeration surface body, and the temperature of the surface A is detected by the temperature sensor.
3. The semiconductor local cooling device of claim 1, wherein the number of thermoelectric semiconductor cooling fins is at least one; when the number of the thermoelectric semiconductor refrigerating pieces is more than or equal to 2, all the thermoelectric semiconductor refrigerating pieces are in parallel connection;
each refrigerating sheet is independently controlled by a temperature controller to regulate and control the temperature of the refrigerating surface, so that the temperature of each part is uniformly distributed; the low-temperature ends of the thermoelectric semiconductor refrigeration pieces are uniformly distributed on the surface B of the refrigeration surface.
4. The semiconductor local refrigerating device of claim 1, wherein the thermoelectric semiconductor refrigerating sheet is made of a thermoelectric material, and the refrigerating surface is made of a metal having excellent heat transfer performance.
5. The semiconductor local refrigerating device of any one of claims 1 to 4, wherein the shape of the refrigerating surface is adjusted according to the shape of an object to be cooled, and the refrigerating surface is a plane, a curved surface, a spherical surface, a grating plate, an array or an irregular surface; the refrigeration surface is provided with holes or not; the holes are through holes or non-through holes;
the A surface is also contacted with an object to be cooled.
6. The semiconductor local refrigerating device of claim 5, wherein the refrigerating surface is a metal flat plate surface or a metal bar surface; the surface A and the surface B of the refrigeration surface are two opposite surfaces up and down; the temperature sensors are arranged at the geometric center of the surface A of the metal flat plate or the metal bar and/or at two sides of the geometric center; the number of the thermoelectric semiconductor refrigerating pieces is three, and the thermoelectric semiconductor refrigerating pieces are distributed on the surface B of the metal flat plate or the metal bar at uniform intervals so as to ensure that heat is transferred uniformly;
or the refrigeration surface is a metal block surface with at least one through hole or non-through hole; the temperature sensor is arranged on the surface A close to the through hole of the metal block; the thermoelectric semiconductor refrigerating piece is arranged right below the hole;
or the refrigeration surface is an ice cream-shaped surface; the surface A of the refrigeration surface is the inner surface of the refrigeration surface, and the surface B of the refrigeration surface is the outer surface of the refrigeration surface;
or the refrigeration surface is a hemispherical surface; the number of the temperature sensors is five, and the temperature sensors are respectively arranged at four ends of the hemispherical surface and at the positions where the hemispherical surface is tangent to the horizontal plane; the number of the thermoelectric semiconductor refrigerating pieces is five, and the thermoelectric semiconductor refrigerating pieces are respectively arranged at four hemispherical ends and at the positions where hemispherical surfaces are tangent to a horizontal plane;
or the refrigerating surface is a square barrel-shaped surface, the surface A of the refrigerating surface is the inner surface of the refrigerating surface, and the surface B of the refrigerating surface is the outer surface of the refrigerating surface; the temperature sensors are arranged on a surface A of the refrigeration surface, which is vertical to the horizontal plane, and a surface A of the refrigeration surface, which is parallel to the horizontal plane; the thermoelectric semiconductor refrigerating pieces are arranged on a surface B of the refrigerating surface, which is vertical to the horizontal plane, and a surface B which is parallel to the horizontal plane;
or the refrigerating surface is a cylindrical surface, the surface A of the refrigerating surface is the inner surface of the refrigerating surface, and the surface B of the refrigerating surface is the outer surface of the refrigerating surface; the temperature sensors are arranged at the center of the bottom surface of the cylindrical surface and the cylindrical wall of the surface A; the thermoelectric semiconductor refrigerating pieces are uniformly distributed around the surface B.
7. The semiconductor local refrigeration device of claim 6, wherein the thermoelectric semiconductor refrigeration piece is in direct contact with the B side of the refrigeration surface, or a layer of heat conducting material is disposed between the thermoelectric semiconductor refrigeration piece and the B side of the refrigeration surface.
8. The semiconductor local cooling device according to claim 6, wherein the heat dissipation assembly is an air-cooled cooler or a water-cooled cooler;
when the heat dissipation assembly is an air-cooled cooler, the heat dissipation assembly includes: the heat dissipation device comprises a heat dissipation fin, a heat dissipation fan connected with the heat dissipation fin and a fixing frame for fixing the heat dissipation fan; the radiating fins are metal radiating fins; the heat dissipation fan is electrically connected with the temperature controller; the heat radiating fin is directly connected with the high-temperature end of the thermoelectric semiconductor refrigerating piece, or a heat conducting material layer is arranged between the heat radiating fin and the high-temperature end of the thermoelectric semiconductor refrigerating piece; the heat dissipation assembly is electrically connected with the temperature controller.
9. The semiconductor local refrigeration equipment as claimed in claim 6, wherein the temperature controller is connected with an external power supply and used for providing a potential difference for the thermoelectric semiconductor refrigeration chip;
the temperature controller is also connected with the computer, the temperature setting of the temperature controller is controlled by the computer, and the computer sets the temperatures of different thermoelectric semiconductor refrigerating sheets, so that the refrigerating surfaces have different temperatures, and the aim of gradient refrigeration of the refrigerator is fulfilled.
10. The semiconductor local refrigerating device of claim 9, wherein the temperature controller is connected with the temperature sensor, the low temperature end of the thermoelectric semiconductor refrigerating sheet and the heat dissipation assembly through control circuits respectively; the control circuit comprises a temperature setter, a temperature sensor, a logic arithmetic unit and a control switch which are connected in sequence; the control switch comprises a fan control switch and/or a thermoelectric semiconductor refrigeration piece control switch which are connected in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021405663.9U CN212746956U (en) | 2020-07-16 | 2020-07-16 | Semiconductor local refrigeration equipment based on thermoelectric effect |
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| CN113945024A (en) * | 2020-07-16 | 2022-01-18 | 厦门稀土材料研究所 | Semiconductor local refrigeration equipment based on thermoelectric effect and refrigeration method and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113945024A (en) * | 2020-07-16 | 2022-01-18 | 厦门稀土材料研究所 | Semiconductor local refrigeration equipment based on thermoelectric effect and refrigeration method and application thereof |
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