JP2010091438A - Semiconductor testing apparatus - Google Patents
Semiconductor testing apparatus Download PDFInfo
- Publication number
- JP2010091438A JP2010091438A JP2008262313A JP2008262313A JP2010091438A JP 2010091438 A JP2010091438 A JP 2010091438A JP 2008262313 A JP2008262313 A JP 2008262313A JP 2008262313 A JP2008262313 A JP 2008262313A JP 2010091438 A JP2010091438 A JP 2010091438A
- Authority
- JP
- Japan
- Prior art keywords
- signal
- test head
- heat sink
- coupler
- way valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
本発明は半導体試験装置に関するものである。
更に詳述すれば、ヒートシンクを、カプラ部分から着脱する際に循環冷却装置を停止させず、カプラ部分からの流体飛散を防止できる半導体試験装置に関するものである。
The present invention relates to a semiconductor test apparatus.
More specifically, the present invention relates to a semiconductor test apparatus capable of preventing fluid scattering from the coupler part without stopping the circulating cooling device when the heat sink is attached to or detached from the coupler part.
半導体試験装置に関連する先行技術文献としては次のようなものがある。 Prior art documents related to semiconductor test equipment include the following.
図４は従来より一般に使用されている従来例の要部構成説明図である。
図において、循環冷却装置１は、テストヘッド２に設けられたヒートシンク２１を冷却する。
ヒートシンク２１は、テストヘッド２に設けられたカップラ２２に着脱される。
循環冷却装置１は、熱交換器１１、タンク１２、ポンプ１３を有する。
この場合は、冷媒は水が使用されている。
FIG. 4 is an explanatory view showing the structure of the main part of a conventional example that is generally used.
In the figure, the circulating cooling device 1 cools a heat sink 21 provided in the test head 2.
The heat sink 21 is attached to and detached from the coupler 22 provided in the test head 2.
The circulating cooling device 1 includes a heat exchanger 11, a tank 12, and a pump 13.
In this case, water is used as the refrigerant.
このような装置においては、以下の間題点がある。
カプラ部分からヒートシンクを着脱する際、循環冷却装置１が稼動しているのでカプラ２２の内部では背圧がかかった状態である。
このために、カプラ２２の着脱時に、流体の飛散が起こる。
Such an apparatus has the following problems.
When the heat sink is attached to and detached from the coupler portion, the circulating cooling device 1 is in operation, so that back pressure is applied inside the coupler 22.
For this reason, when the coupler 22 is attached / detached, fluid scattering occurs.
本発明の目的は、上記の課題を解決するもので、循環冷却装置が稼動状態でも、カプラ内部に背圧が加わった状態とならず、ヒートシンクのカプラ着脱時に冷却流体の飛散を発生させる恐れのない半導体試験装置を提供することにある。 An object of the present invention is to solve the above-described problem, and even when the circulating cooling device is in an operating state, a back pressure is not applied to the inside of the coupler, and there is a risk that the cooling fluid may be scattered when the coupler of the heat sink is attached or detached. There is no semiconductor test equipment to provide.
このような課題を達成するために、本発明では、請求項１の半導体試験装置においては、
循環冷却装置からテストヘッドに設けられたカプラを介してヒートシンクに冷媒を供給する半導体試験装置において、前記テストヘッドに設けられ前記ヒートシンクをはずす際に第１の信号を発し前記ヒートシンクが接続された際に第２の信号を発する信号発生回路と、前記循環冷却装置の出力側と前記テストヘッドの入力側との間に設けられ前記第１の信号に基づき所定時間経過後に前記冷媒の前記テストヘッドへの入力を止めて前記循環冷却装置の入力側へ返還し、前記第２の信号に基づき前記冷媒の前記入力側への返還を止めて前記テストヘッドに入力する三方弁とを具備したことを特徴とする。
In order to achieve such a problem, in the present invention, in the semiconductor test apparatus of claim 1,
In a semiconductor test apparatus that supplies a coolant to a heat sink from a circulating cooling device via a coupler provided on the test head, when the heat sink is provided and the heat sink is connected to the test head when the heat sink is removed And a signal generation circuit for generating a second signal, and provided between the output side of the circulating cooling device and the input side of the test head, and after the predetermined time has elapsed based on the first signal, the refrigerant to the test head And a three-way valve that stops the return of the refrigerant to the input side based on the second signal and inputs the refrigerant to the test head based on the second signal. And
本発明の請求項２の半導体試験装置においては、請求項１記載の半導体試験装置において、
前記信号発生回路と前記三方弁との間に設けられ前記第１の信号に基づき所定時間後に前記三方弁に動作信号を発するタイマーを具備したことを特徴とする。
In the semiconductor test apparatus according to claim 2 of the present invention, in the semiconductor test apparatus according to claim 1,
A timer is provided between the signal generation circuit and the three-way valve and emits an operation signal to the three-way valve after a predetermined time based on the first signal.
本発明の請求項１によれば、次のような効果がある。
冷却を必要とするヒートシンクを、カプラ部分から着脱する際に経路内の循環冷却流体を循環させている循環冷却装置を停止させず、カプラ部分からの流体飛散を防止できる半導体試験装置が得られる。
According to claim 1 of the present invention, there are the following effects.
A semiconductor test apparatus capable of preventing fluid scattering from the coupler portion without stopping the circulating cooling device that circulates the circulating cooling fluid in the path when the heat sink that requires cooling is attached to or detached from the coupler portion is obtained.
ヒートシンクのカプラ着脱時に、背圧がかかった状態で流体飛散が起こるようなカプラが使用できるので、カプラ自体を、安価なカプラが使用でき、安価な半導体試験装置が得られる。
テストヘッド側での装置の変更が無いので、既往の半導体試験装置を容易に改造できる半導体試験装置が得られる。
When a heat sink coupler is attached / detached, a coupler that causes fluid scattering in a state where back pressure is applied can be used. Therefore, an inexpensive coupler can be used as the coupler itself, and an inexpensive semiconductor test apparatus can be obtained.
Since there is no change of the apparatus on the test head side, a semiconductor test apparatus capable of easily remodeling the existing semiconductor test apparatus is obtained.
本発明の請求項２によれば、次のような効果がある。
信号発生回路と三方弁との間に設けられ、第１の信号に基づき所定時間後に、三方弁に動作信号を発するタイマーが設けられたので、三方弁の動作時間を変更することが可能になり、
ヒートシンクの冷却時間を適切な時間に容易に変更できる半導体試験装置が得られる。
According to claim 2 of the present invention, there are the following effects.
A timer is provided between the signal generation circuit and the three-way valve. The timer generates an operation signal to the three-way valve after a predetermined time based on the first signal. This makes it possible to change the operation time of the three-way valve. ,
A semiconductor test apparatus that can easily change the cooling time of the heat sink to an appropriate time is obtained.
以下本発明を図面を用いて詳細に説明する。
図１は本発明の一実施例の要部構成説明図、図２は図１の動作説明図である。
図において、図４と同一記号の構成は同一機能を表す。
以下、図４との相違部分のみ説明する。
Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is a diagram illustrating the configuration of the main part of one embodiment of the present invention, and FIG. 2 is a diagram illustrating the operation of FIG.
In the figure, the same symbol structure as in FIG. 4 represents the same function.
Only differences from FIG. 4 will be described below.
図１において、
信号発生回路３１は、テストヘッド２に設けられ、ヒートシンク２１をはずす際に、第１の信号を発し、ヒートシンク２１が接続された際に、第２の信号を発する。
三方弁４１は、循環冷却装置１の出力側とテストヘッド２の入力側との間に設けられ、第１の信号に基づき、所定時間経過後に冷媒のテストヘッド２への入力を止めて、循環冷却装置１の入力側へ返還し、第２の信号に基づき、冷媒の入力側への返還を止めてテストヘッド２に入力する。
In FIG.
The signal generation circuit 31 is provided in the test head 2 and emits a first signal when the heat sink 21 is removed, and emits a second signal when the heat sink 21 is connected.
The three-way valve 41 is provided between the output side of the circulating cooling device 1 and the input side of the test head 2, and stops the input of refrigerant to the test head 2 after a predetermined time based on the first signal to circulate. Returning to the input side of the cooling device 1, based on the second signal, the return to the input side of the refrigerant is stopped and input to the test head 2.
以上の構成において、
カードを着脱しない、通常の動作状況について以下に示す。
（１）通常の動作では、図１に示す如く、ヒートシンク２１に冷却流体が流れる。
In the above configuration,
The normal operation status without the card is shown below.
(1) In normal operation, the cooling fluid flows through the heat sink 21 as shown in FIG.
カードを着脱する際の動作について以下に示す。
（１）ヒートシンク２１外す為にテストヘッド２の電源をOFFにする。
（２）テストヘッド２の電源がOFFになった信号を、循環冷却装置１が受信する。
（３）循環冷却装置１内に設置された三方弁４１によりテストヘッド２の側に流体が供給されなくなる。
（４）ヒートシンク２１をカプラ２２より外す。
The operation when inserting and removing the card is described below.
(1) Turn off the test head 2 to remove the heat sink 21.
(2) The circulating cooling device 1 receives a signal that the power of the test head 2 is turned off.
(3) The fluid is not supplied to the test head 2 side by the three-way valve 41 installed in the circulating cooling device 1.
(4) Remove the heat sink 21 from the coupler 22.
（５）メンテナンスなど終了後、ヒートシンク２１をカプラ２２に接続して、ヒートシンク２１をテストヘッド２内に設置する。この状態では、テストヘッド２側には冷却流体が供給されない。
（６）テストヘッド２を電源ONにする。自動的に三方弁４１が作動してテストヘッド２側に冷却流体を供給する。
(5) After the maintenance or the like is completed, the heat sink 21 is connected to the coupler 22 and the heat sink 21 is installed in the test head 2. In this state, the cooling fluid is not supplied to the test head 2 side.
(6) Turn on the test head 2. The three-way valve 41 is automatically activated to supply the cooling fluid to the test head 2 side.
この結果、
冷却を必要とするヒートシンク２１を、カプラ２２の部分から着脱する際に、経路内の循環冷却流体を循環させている循環冷却装置１を停止させず、カプラ２２の部分からの流体飛散を防止できる半導体試験装置が得られる。
As a result,
When the heat sink 21 that requires cooling is attached to or detached from the coupler 22 portion, the circulating cooling device 1 that circulates the circulating cooling fluid in the path is not stopped, and fluid scattering from the coupler 22 portion can be prevented. A semiconductor test apparatus is obtained.
ヒートシンク２１のカプラ２２への着脱時に、背圧がかかった状態で流体飛散が起こるようなカプラが使用できるので、カプラ２２自体を、安価なカプラが使用でき、安価な半導体試験装置が得られる。
テストヘッド１側での装置の変更が無いので、既往の半導体試験装置を容易に改造できる半導体試験装置が得られる。
When the heat sink 21 is attached to or detached from the coupler 22, a coupler that causes fluid scattering when back pressure is applied can be used. Therefore, an inexpensive coupler can be used as the coupler 22 itself, and an inexpensive semiconductor test apparatus can be obtained.
Since there is no change of the apparatus on the test head 1 side, a semiconductor test apparatus capable of easily remodeling the existing semiconductor test apparatus is obtained.
図３は、本発明の他の実施例の要部構成説明図である。
図３において、タイマー５１は、信号発生回路３１と三方弁４１との間に設けられ、第１の信号に基づき所定時間後に、三方弁４１に動作信号を発する。
FIG. 3 is an explanatory view of the main part configuration of another embodiment of the present invention.
In FIG. 3, a timer 51 is provided between the signal generation circuit 31 and the three-way valve 41, and issues an operation signal to the three-way valve 41 after a predetermined time based on the first signal.
この結果、三方弁４１の動作時間を変更することが可能になり、ヒートシンク２１の冷却時間を適切な時間に容易に変更できる半導体試験装置が得られる。 As a result, the operation time of the three-way valve 41 can be changed, and a semiconductor test apparatus that can easily change the cooling time of the heat sink 21 to an appropriate time is obtained.
なお、以上の説明は、本発明の説明および例示を目的として特定の好適な実施例を示したに過ぎない。
したがって本発明は、上記実施例に限定されることなく、その本質から逸脱しない範囲で更に多くの変更、変形をも含むものである。
The above description merely shows a specific preferred embodiment for the purpose of explanation and illustration of the present invention.
Therefore, the present invention is not limited to the above-described embodiments, and includes many changes and modifications without departing from the essence thereof.
１ 循環冷却装置
１１ 熱交換器
１２ タンク
１３ ポンプ
２ テストヘッド
２１ ヒートシンク
２２ カップラ
３１ 信号発生回路
４１ 三方弁
５１ タイマー
DESCRIPTION OF SYMBOLS 1 Circulation cooling device 11 Heat exchanger 12 Tank 13 Pump 2 Test head 21 Heat sink 22 Coupler 31 Signal generation circuit 41 Three-way valve 51 Timer
Claims (2)
前記テストヘッドに設けられ前記ヒートシンクをはずす際に第１の信号を発し前記ヒートシンクが接続された際に第２の信号を発する信号発生回路と、
前記循環冷却装置の出力側と前記テストヘッドの入力側との間に設けられ前記第１の信号に基づき所定時間経過後に前記冷媒の前記テストヘッドへの入力を止めて前記循環冷却装置の入力側へ返還し、前記第２の信号に基づき前記冷媒の前記入力側への返還を止めて前記テストヘッドに入力する三方弁と
を具備したことを特徴とする半導体試験装置。 In a semiconductor test apparatus for supplying a refrigerant to a heat sink through a coupler provided in a test head from a circulating cooling apparatus,
A signal generating circuit that is provided in the test head and emits a first signal when the heat sink is removed and a second signal when the heat sink is connected;
Provided between the output side of the circulating cooling device and the input side of the test head, the input of the refrigerant to the test head is stopped after a predetermined time based on the first signal, and the input side of the circulating cooling device And a three-way valve for stopping the return of the refrigerant to the input side based on the second signal and inputting the refrigerant to the test head.
を具備したことを特徴とする請求項１記載の半導体試験装置。 2. The semiconductor test apparatus according to claim 1, further comprising a timer that is provided between the signal generation circuit and the three-way valve and issues an operation signal to the three-way valve after a predetermined time based on the first signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008262313A JP2010091438A (en) | 2008-10-09 | 2008-10-09 | Semiconductor testing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008262313A JP2010091438A (en) | 2008-10-09 | 2008-10-09 | Semiconductor testing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2010091438A true JP2010091438A (en) | 2010-04-22 |
Family
ID=42254295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008262313A Pending JP2010091438A (en) | 2008-10-09 | 2008-10-09 | Semiconductor testing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010091438A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63192254A (en) * | 1987-02-04 | 1988-08-09 | Hitachi Ltd | Cooling of electronic apparatus |
| JPS6446930A (en) * | 1987-05-30 | 1989-02-21 | Tokyo Electron Ltd | Base plate for sample |
| JPH04208879A (en) * | 1990-11-30 | 1992-07-30 | Sharp Corp | Inspection instrument for semiconductor device |
| JPH0854443A (en) * | 1994-08-12 | 1996-02-27 | Ando Electric Co Ltd | Rotary test head for preventing falling-off of test board |
| JPH09152202A (en) * | 1995-12-01 | 1997-06-10 | Matsushita Refrig Co Ltd | Air-conditioner |
| JP2000019219A (en) * | 1998-07-02 | 2000-01-21 | Advantest Corp | Semiconductor test apparatus |
| JP2000292492A (en) * | 1999-03-31 | 2000-10-20 | Hitachi Electronics Eng Co Ltd | Cooler for electronic parts |
| JP2005259636A (en) * | 2004-03-15 | 2005-09-22 | Toyota Motor Corp | Cooling device |
| JP2008509542A (en) * | 2004-06-30 | 2008-03-27 | テラダイン・インコーポレーテッド | Parallel flow heat exchanger |
-
2008
- 2008-10-09 JP JP2008262313A patent/JP2010091438A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63192254A (en) * | 1987-02-04 | 1988-08-09 | Hitachi Ltd | Cooling of electronic apparatus |
| JPS6446930A (en) * | 1987-05-30 | 1989-02-21 | Tokyo Electron Ltd | Base plate for sample |
| JPH04208879A (en) * | 1990-11-30 | 1992-07-30 | Sharp Corp | Inspection instrument for semiconductor device |
| JPH0854443A (en) * | 1994-08-12 | 1996-02-27 | Ando Electric Co Ltd | Rotary test head for preventing falling-off of test board |
| JPH09152202A (en) * | 1995-12-01 | 1997-06-10 | Matsushita Refrig Co Ltd | Air-conditioner |
| JP2000019219A (en) * | 1998-07-02 | 2000-01-21 | Advantest Corp | Semiconductor test apparatus |
| JP2000292492A (en) * | 1999-03-31 | 2000-10-20 | Hitachi Electronics Eng Co Ltd | Cooler for electronic parts |
| JP2005259636A (en) * | 2004-03-15 | 2005-09-22 | Toyota Motor Corp | Cooling device |
| JP2008509542A (en) * | 2004-06-30 | 2008-03-27 | テラダイン・インコーポレーテッド | Parallel flow heat exchanger |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2006156711A (en) | Cooling system for power semiconductor module | |
| JP2005167248A (en) | System and method for liquid cooling electronic sub-system | |
| JP2017005141A (en) | Laser oscillation part, air cooler, and laser equipment for cooling dehumidifier by common cooling water | |
| JP2005064186A (en) | Electronic apparatus equipped with cooling system | |
| US9655286B2 (en) | Facilitating fluid level sensing | |
| JP2014053467A (en) | Cooling system | |
| WO2021120735A1 (en) | Detection apparatus and server | |
| JP2010091438A (en) | Semiconductor testing apparatus | |
| JP2008093529A (en) | Washing apparatus and washing method | |
| CN105982673B (en) | Cooling method of magnetic resonance imaging device and magnetic resonance imaging device | |
| JP2006066703A (en) | Cooling system, electronic apparatus and warning apparatus | |
| CN110099542B (en) | Method for ensuring normal operation of power supply device in electronic equipment | |
| KR20170049963A (en) | Cooling system | |
| KR101864192B1 (en) | System for supplying Cooling fresh water | |
| JP5072746B2 (en) | Hydraulic circuit cooling system | |
| US20180098460A1 (en) | Liquid cooling heat dissipation module | |
| JP2012054498A (en) | Cooling device of electronic apparatus | |
| JP2009036393A (en) | Washing device of water-cooled cooling mechanism | |
| JP2005241492A (en) | Water feed equipment for water quality measuring instruments | |
| JPH11211314A (en) | Chiller operation controller for vacuum cooler | |
| KR0137909Y1 (en) | Cooling control circuit of computer system | |
| JP2010185674A (en) | Test head | |
| JP2006085497A (en) | Cooling method, cooling system, and cooling program | |
| TW201413436A (en) | Power-supply controlling system and method | |
| KR20070013488A (en) | Semiconductor fabrication apparatus having coolant recovery system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110825 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120906 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120911 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121030 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20121031 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130108 |