DE3855424T2 - Haltevorrichtung für Substratscheiben - Google Patents

Haltevorrichtung für Substratscheiben

Info

Publication number
DE3855424T2
DE3855424T2 DE3855424T DE3855424T DE3855424T2 DE 3855424 T2 DE3855424 T2 DE 3855424T2 DE 3855424 T DE3855424 T DE 3855424T DE 3855424 T DE3855424 T DE 3855424T DE 3855424 T2 DE3855424 T2 DE 3855424T2
Authority
DE
Germany
Prior art keywords
holding device
substrate wafers
wafers
substrate
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3855424T
Other languages
English (en)
Other versions
DE3855424D1 (de
Inventor
Eric L Mears
Richard J Hertel
Robert V Brick
Carl James Holt Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Application granted granted Critical
Publication of DE3855424D1 publication Critical patent/DE3855424D1/de
Publication of DE3855424T2 publication Critical patent/DE3855424T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/24—Chucks or sockets by centrifugal force
    • Y10T279/243—Chucks or sockets by centrifugal force to counterbalance jaws
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/31—Jaws mounted on flexible member; i.e., diaphragm
DE3855424T 1987-05-04 1988-05-03 Haltevorrichtung für Substratscheiben Expired - Fee Related DE3855424T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/046,230 US4817556A (en) 1987-05-04 1987-05-04 Apparatus for retaining wafers

Publications (2)

Publication Number Publication Date
DE3855424D1 DE3855424D1 (de) 1996-08-22
DE3855424T2 true DE3855424T2 (de) 1996-11-21

Family

ID=21942309

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3855424T Expired - Fee Related DE3855424T2 (de) 1987-05-04 1988-05-03 Haltevorrichtung für Substratscheiben

Country Status (6)

Country Link
US (1) US4817556A (de)
EP (1) EP0290218B1 (de)
JP (1) JP2761887B2 (de)
KR (1) KR970004820B1 (de)
CA (1) CA1320741C (de)
DE (1) DE3855424T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10119570A1 (de) * 2001-04-21 2002-10-31 Schott Glas Beschichtete Maschinenteile

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US5080929A (en) * 1990-04-02 1992-01-14 Delco Electronics Corporation Method and apparatus for through hole substrate printing
GB9010833D0 (en) * 1990-05-15 1990-07-04 Electrotech Research Limited Workpiece support
US5222310A (en) * 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
JP3064409B2 (ja) * 1990-11-30 2000-07-12 株式会社日立製作所 保持装置およびそれを用いた半導体製造装置
JPH056752A (ja) * 1991-02-05 1993-01-14 Nissin High Voltage Co Ltd イオン注入装置
US5296916A (en) * 1991-04-18 1994-03-22 International Business Machines Corp. Mask alignment system for components with extremely sensitive surfaces
ATE134554T1 (de) * 1991-09-16 1996-03-15 Sig Schweiz Industrieges Greifer für einen manipulator
CH686558A5 (de) * 1992-04-06 1996-04-30 Balzers Hochvakuum Halteanordnung fur ein flochiges Werkstuck sowie Troger mit mindestens einer solchen.
US5350427A (en) * 1993-06-14 1994-09-27 Varian Associates, Inc. Wafer retaining platen having peripheral clamp and wafer lifting means
US5513594A (en) * 1993-10-20 1996-05-07 Mcclanahan; Adolphus E. Clamp with wafer release for semiconductor wafer processing equipment
US5791895A (en) * 1994-02-17 1998-08-11 Novellus Systems, Inc. Apparatus for thermal treatment of thin film wafer
JP3288554B2 (ja) * 1995-05-29 2002-06-04 株式会社日立製作所 イオン注入装置及びイオン注入方法
US5863340A (en) * 1996-05-08 1999-01-26 Flanigan; Allen Deposition ring anti-rotation apparatus
US6145849A (en) * 1998-11-18 2000-11-14 Komag, Incorporated Disk processing chuck
JP2000183139A (ja) 1998-12-17 2000-06-30 Hitachi Ltd イオン注入装置
US6452195B1 (en) * 1999-08-18 2002-09-17 Ibis Technology Corporation Wafer holding pin
US6398823B1 (en) * 1999-12-07 2002-06-04 Tru-Si Technologies, Inc. Dynamic break for non-contact wafer holder
US7312084B2 (en) 2001-07-13 2007-12-25 Ortho-Clinical Diagnostics, Inc. Tandem incubator for clinical analyzer
US6824343B2 (en) 2002-02-22 2004-11-30 Applied Materials, Inc. Substrate support
US7032287B1 (en) * 2002-07-19 2006-04-25 Nanometrics Incorporated Edge grip chuck
EP1454691A1 (de) * 2003-03-04 2004-09-08 Willemin Machines S.A. Spannvorrichtung mit elastischen Gelenken
US6794662B1 (en) * 2003-10-07 2004-09-21 Ibis Technology Corporation Thermosetting resin wafer-holding pin
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US7210246B2 (en) * 2003-11-10 2007-05-01 Blueshift Technologies, Inc. Methods and systems for handling a workpiece in vacuum-based material handling system
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US20060231388A1 (en) * 2005-04-14 2006-10-19 Ravi Mullapudi Multi-station sputtering and cleaning system
DE102005059850A1 (de) * 2005-12-15 2007-06-28 Atmel Germany Gmbh Vorrichtung zum Reinigen und Trocknen von Wafern
US9218990B2 (en) * 2011-10-07 2015-12-22 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for holding a plurality of substrates for processing
CN103137447B (zh) * 2011-11-30 2016-05-11 中国科学院微电子研究所 离子注入机
CN103137413B (zh) * 2011-11-30 2016-06-01 中国科学院微电子研究所 离子注入机控制系统
US11114329B2 (en) * 2019-04-08 2021-09-07 Semiconductor Components Industries, Llc Methods for loading or unloading substrate with evaporator planet
CN115355680B (zh) * 2022-10-19 2023-01-03 四川上特科技有限公司 一种晶圆自动甩干装置

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10119570A1 (de) * 2001-04-21 2002-10-31 Schott Glas Beschichtete Maschinenteile
DE10119570B4 (de) * 2001-04-21 2005-12-08 Schott Ag Verwendung beschichteter Maschinenteile

Also Published As

Publication number Publication date
EP0290218A2 (de) 1988-11-09
CA1320741C (en) 1993-07-27
JP2761887B2 (ja) 1998-06-04
KR890017791A (ko) 1989-12-18
US4817556A (en) 1989-04-04
KR970004820B1 (ko) 1997-04-04
EP0290218B1 (de) 1996-07-17
EP0290218A3 (en) 1990-11-22
DE3855424D1 (de) 1996-08-22
JPS6471050A (en) 1989-03-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.(N.

8339 Ceased/non-payment of the annual fee