DE69417173T2 - Keramiksubstrat für Halbleitervorrichtung - Google Patents

Keramiksubstrat für Halbleitervorrichtung

Info

Publication number
DE69417173T2
DE69417173T2 DE69417173T DE69417173T DE69417173T2 DE 69417173 T2 DE69417173 T2 DE 69417173T2 DE 69417173 T DE69417173 T DE 69417173T DE 69417173 T DE69417173 T DE 69417173T DE 69417173 T2 DE69417173 T2 DE 69417173T2
Authority
DE
Germany
Prior art keywords
semiconductor device
ceramic substrate
ceramic
substrate
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69417173T
Other languages
English (en)
Other versions
DE69417173D1 (de
Inventor
Kazuhiro Ikuina
Mitsuru Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69417173D1 publication Critical patent/DE69417173D1/de
Application granted granted Critical
Publication of DE69417173T2 publication Critical patent/DE69417173T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/013—Thick-film circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
DE69417173T 1993-12-16 1994-12-08 Keramiksubstrat für Halbleitervorrichtung Expired - Fee Related DE69417173T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP31620593 1993-12-16
JP6231755A JP2674523B2 (ja) 1993-12-16 1994-09-27 セラミック配線基板とその製造方法

Publications (2)

Publication Number Publication Date
DE69417173D1 DE69417173D1 (de) 1999-04-22
DE69417173T2 true DE69417173T2 (de) 1999-07-29

Family

ID=26530073

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69417173T Expired - Fee Related DE69417173T2 (de) 1993-12-16 1994-12-08 Keramiksubstrat für Halbleitervorrichtung

Country Status (7)

Country Link
US (1) US5757062A (de)
EP (1) EP0658932B1 (de)
JP (1) JP2674523B2 (de)
KR (1) KR0146916B1 (de)
AU (1) AU688402B2 (de)
CA (1) CA2137388C (de)
DE (1) DE69417173T2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7279217B2 (en) * 2004-05-24 2007-10-09 Tdk Corporation Multilayer ceramic device, method for manufacturing the same, and ceramic device
US20060009036A1 (en) * 2004-07-12 2006-01-12 Bacher Rudolph J High thermal cycle conductor system

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5975603A (ja) * 1982-10-23 1984-04-28 松下電器産業株式会社 印刷抵抗
US4503090A (en) * 1983-02-23 1985-03-05 At&T Bell Laboratories Thick film resistor circuits
JPS6048201U (ja) * 1983-09-09 1985-04-04 ティーディーケイ株式会社 正特性サ−ミスタ装置
JPS60226156A (ja) * 1984-04-25 1985-11-11 Murata Mfg Co Ltd ハイブリツドｉｃ
JPS60253107A (ja) * 1984-05-28 1985-12-13 古河電気工業株式会社 耐熱性Ａｇ被覆導体
US4675644A (en) * 1985-01-17 1987-06-23 Siemens Aktiengesellschaft Voltage-dependent resistor
US4695504A (en) * 1985-06-21 1987-09-22 Matsushita Electric Industrial Co., Ltd. Thick film resistor composition
CA1264871A (en) * 1986-02-27 1990-01-23 Makoto Hori Positive ceramic semiconductor device with silver/palladium alloy electrode
JPS62265796A (ja) * 1986-05-14 1987-11-18 株式会社住友金属セラミックス セラミツク多層配線基板およびその製造法
JPS6489495A (en) * 1987-09-30 1989-04-03 Noritake Co Ltd Composite multilayer substrate for hybrid ic
JPH01136302A (ja) * 1987-11-24 1989-05-29 Sumitomo Metal Mining Co Ltd 厚膜抵抗器
US4985377A (en) * 1987-12-14 1991-01-15 Matsushita Electric Industrial Co., Ltd. Glaze resistor
JPH0735675B2 (ja) * 1987-12-15 1995-04-19 積水化学工業株式会社 ２階建木質ユニット建物
JPH0812801B2 (ja) * 1988-01-11 1996-02-07 株式会社日立製作所 ハイブリットｉｃ用基板とそれを用いたハイブリットｉｃ及びその装置
JPH01133701U (de) * 1988-03-07 1989-09-12
EP0363552B1 (de) * 1988-07-27 1993-10-13 Tanaka Kikinzoku Kogyo K.K. Verfahren zur Herstellung von Metallpulver
US5264272A (en) * 1989-06-09 1993-11-23 Asahi Glass Company Ltd. Resistor paste and ceramic substrate
US5033666A (en) * 1990-04-12 1991-07-23 E. I. Du Pont De Nemours And Company Process for brazing metallized components to ceramic substrates
JPH04342101A (ja) * 1991-05-17 1992-11-27 Sumitomo Metal Mining Co Ltd 厚膜抵抗体組成物および厚膜抵抗体形成方法
JP3112328B2 (ja) * 1992-01-29 2000-11-27 ローム株式会社 厚膜チップ抵抗器
US5427853A (en) * 1993-12-20 1995-06-27 General Motors Corporation Reinforcement preform, method of making same and reinforced composite made therefrom

Also Published As

Publication number Publication date
AU8047394A (en) 1995-06-22
EP0658932B1 (de) 1999-03-17
KR950023238A (ko) 1995-07-28
KR0146916B1 (ko) 1998-10-01
EP0658932A2 (de) 1995-06-21
JPH07226587A (ja) 1995-08-22
US5757062A (en) 1998-05-26
EP0658932A3 (de) 1995-11-22
CA2137388C (en) 1998-09-22
DE69417173D1 (de) 1999-04-22
CA2137388A1 (en) 1995-06-17
AU688402B2 (en) 1998-03-12
JP2674523B2 (ja) 1997-11-12

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee