DE69333843D1 - Ätzverfahren für Silizium-Substrat - Google Patents
Ätzverfahren für Silizium-SubstratInfo
- Publication number
- DE69333843D1 DE69333843D1 DE69333843T DE69333843T DE69333843D1 DE 69333843 D1 DE69333843 D1 DE 69333843D1 DE 69333843 T DE69333843 T DE 69333843T DE 69333843 T DE69333843 T DE 69333843T DE 69333843 D1 DE69333843 D1 DE 69333843D1
- Authority
- DE
- Germany
- Prior art keywords
- silicon substrate
- etching process
- etching
- silicon
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 238000005530 etching Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
- H01L21/30608—Anisotropic liquid etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00142—Bridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
- B81C1/00626—Processes for achieving a desired geometry not provided for in groups B81C1/00563 - B81C1/00619
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0315—Cavities
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/914—Doping
- Y10S438/924—To facilitate selective etching
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30940692 | 1992-10-23 | ||
JP30940692A JP3333560B2 (ja) | 1992-10-23 | 1992-10-23 | シリコン基板のエッチング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69333843D1 true DE69333843D1 (de) | 2005-08-25 |
DE69333843T2 DE69333843T2 (de) | 2006-04-27 |
Family
ID=17992630
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69329369T Expired - Lifetime DE69329369T2 (de) | 1992-10-23 | 1993-10-22 | Verfahren zum Ätzen eines Silizium-Substrats |
DE69333843T Expired - Lifetime DE69333843T2 (de) | 1992-10-23 | 1993-10-22 | Ätzverfahren für Silizium-Substrat |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69329369T Expired - Lifetime DE69329369T2 (de) | 1992-10-23 | 1993-10-22 | Verfahren zum Ätzen eines Silizium-Substrats |
Country Status (5)
Country | Link |
---|---|
US (2) | US5683546A (de) |
EP (2) | EP0878835B1 (de) |
JP (1) | JP3333560B2 (de) |
DE (2) | DE69329369T2 (de) |
FI (1) | FI934674A (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3333560B2 (ja) * | 1992-10-23 | 2002-10-15 | リコーエレメックス株式会社 | シリコン基板のエッチング方法 |
FR2736654B1 (fr) * | 1995-07-13 | 1997-08-22 | Commissariat Energie Atomique | Procede de fabrication d'elements de microstructures flottants rigides et dispositif equipe de tels elements |
US5935451A (en) * | 1997-02-24 | 1999-08-10 | Lucent Technologies Inc. | Fabrication of etched features |
DE19716480B4 (de) * | 1997-04-19 | 2004-03-25 | Micronas Semiconductor Holding Ag | Verfahren zum Herstellen einer Vorrichtung mit einem Hohlraum zur Aufnahme eines Lichtwellenleiters |
US6093330A (en) * | 1997-06-02 | 2000-07-25 | Cornell Research Foundation, Inc. | Microfabrication process for enclosed microstructures |
SG96541A1 (en) * | 1997-08-14 | 2003-06-16 | Inst Of Microelectronics | Design of a novel tactile sensor |
US6287885B1 (en) * | 1998-05-08 | 2001-09-11 | Denso Corporation | Method for manufacturing semiconductor dynamic quantity sensor |
EP1130631A1 (de) * | 2000-02-29 | 2001-09-05 | STMicroelectronics S.r.l. | Herstellungsverfahren eines vergrabenen Hohlraumes in einer Halbleiterscheibe |
ATE375865T1 (de) | 2001-08-10 | 2007-11-15 | Canon Kk | Verfahren zur herstellung eines flüssigkeitsausstosskopfes, substrat für einen flüssigkeitsausstosskopf und dazugehöriges herstellungsverfahren |
US7045407B2 (en) * | 2003-12-30 | 2006-05-16 | Intel Corporation | Amorphous etch stop for the anisotropic etching of substrates |
DE102005023059A1 (de) * | 2005-05-19 | 2006-11-23 | Austriamicrosystems Ag | Verfahren zum Herstellen eines mikromechanischen Strukturelementes und Halbleiteranordnung |
EP2072076A1 (de) | 2007-12-17 | 2009-06-24 | Debiotech S.A. | Herstellungsverfahren für Mikronadeln für den Außenbereich eines Flugzeugs |
JP5733616B2 (ja) * | 2011-04-21 | 2015-06-10 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
TWI478233B (zh) * | 2011-09-09 | 2015-03-21 | Univ Nat Kaohsiung Applied Sci | Preparation of Single Crystal Silicon Plate with Suspension Layer and Its Structure and Micro - heater |
CN103145094B (zh) * | 2013-03-21 | 2016-02-10 | 江苏物联网研究发展中心 | 形成mems热电堆探测器空腔结构的体硅微加工方法 |
RU2582903C1 (ru) * | 2015-02-25 | 2016-04-27 | Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА") | Способ защиты углов трёхмерных микромеханических структур на кремниевой пластине при глубинном анизотропном травлении |
US10431866B2 (en) * | 2017-09-15 | 2019-10-01 | International Business Machines Corporation | Microfabricated air bridges for planar microwave resonator circuits |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3728179A (en) * | 1970-05-20 | 1973-04-17 | Radiation Inc | Method of etching silicon crystals |
US4141765A (en) * | 1975-02-17 | 1979-02-27 | Siemens Aktiengesellschaft | Process for the production of extremely flat silicon troughs by selective etching with subsequent rate controlled epitaxial refill |
JPS524337A (en) * | 1975-06-28 | 1977-01-13 | Kiyouraku Sangyo Kk | Ball circulating device of pachinko play machine row |
JPS5243370A (en) * | 1975-10-01 | 1977-04-05 | Hitachi Ltd | Method of forming depression in semiconductor substrate |
JPS5312037A (en) * | 1976-07-20 | 1978-02-03 | Hitachi Maxell | Silver oxide *2* battery |
JPS5351970A (en) * | 1976-10-21 | 1978-05-11 | Toshiba Corp | Manufacture for semiconductor substrate |
JPS53120376A (en) * | 1977-03-30 | 1978-10-20 | Fujitsu Ltd | Production of semiconductor device |
US4147564A (en) * | 1977-11-18 | 1979-04-03 | Sri International | Method of controlled surface texturization of crystalline semiconductor material |
JPS5710073A (en) * | 1980-06-20 | 1982-01-19 | Hitachi Ltd | Open show case |
JPS5758356A (en) * | 1980-09-26 | 1982-04-08 | Toshiba Corp | Manufacture of semiconductor device |
JPS57100734A (en) * | 1980-12-15 | 1982-06-23 | Fujitsu Ltd | Etching method for semiconductor substrate |
JPS5815102A (ja) * | 1981-07-20 | 1983-01-28 | Ii R C:Kk | 連珠の同定方法 |
JPS58151027A (ja) * | 1982-03-03 | 1983-09-08 | Hitachi Ltd | エツチング方法 |
JPS6021884A (ja) * | 1983-07-18 | 1985-02-04 | 松下電器産業株式会社 | バ−ナ |
US4496322A (en) * | 1983-05-11 | 1985-01-29 | University Of Toronto Innovations Foundation | Benzoin antimicrobial dental varnishes |
JPS6031232A (ja) * | 1983-07-29 | 1985-02-18 | Toshiba Corp | 半導体基体の製造方法 |
JPS6041232A (ja) * | 1983-08-17 | 1985-03-04 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS60128622A (ja) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | エツチング法 |
JPS60218848A (ja) * | 1984-04-13 | 1985-11-01 | Fujitsu Ltd | 結晶基板のエツチング法 |
JPS6117113A (ja) * | 1984-07-02 | 1986-01-25 | Minolta Camera Co Ltd | 全長の短い写真用レンズ |
JPS61171139A (ja) * | 1985-01-24 | 1986-08-01 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
US4773034A (en) * | 1985-05-09 | 1988-09-20 | American Telephone And Telegraph Company | Adaptive equalizer utilizing a plurality of multiplier-accumulator devices |
JPS6220863A (ja) * | 1985-07-17 | 1987-01-29 | Mitsubishi Metal Corp | 切削工具用表面被覆高速度鋼部材の製造方法 |
JPS62109323A (ja) * | 1985-11-07 | 1987-05-20 | Oki Electric Ind Co Ltd | フツ化物のエツチング方法 |
JPS62208634A (ja) * | 1986-03-07 | 1987-09-12 | Mitsubishi Electric Corp | 半導体基板への凹部形成方法 |
US4682503A (en) * | 1986-05-16 | 1987-07-28 | Honeywell Inc. | Microscopic size, thermal conductivity type, air or gas absolute pressure sensor |
US4982263A (en) * | 1987-12-21 | 1991-01-01 | Texas Instruments Incorporated | Anodizable strain layer for SOI semiconductor structures |
US4808260A (en) * | 1988-02-05 | 1989-02-28 | Ford Motor Company | Directional aperture etched in silicon |
JPH01239935A (ja) * | 1988-03-22 | 1989-09-25 | Mitsubishi Electric Corp | エツチング方法 |
US5283201A (en) * | 1988-05-17 | 1994-02-01 | Advanced Power Technology, Inc. | High density power device fabrication process |
JPH0814783B2 (ja) * | 1988-06-27 | 1996-02-14 | 横河電機株式会社 | アナログ入出力装置 |
US5594172A (en) * | 1989-06-21 | 1997-01-14 | Nissan Motor Co., Ltd. | Semiconductor accelerometer having a cantilevered beam with a triangular or pentagonal cross section |
DE4000496A1 (de) * | 1989-08-17 | 1991-02-21 | Bosch Gmbh Robert | Verfahren zur strukturierung eines halbleiterkoerpers |
DE4020724A1 (de) * | 1990-06-29 | 1992-01-02 | Bosch Gmbh Robert | Verfahren zur strukturierung eines einkristallinen silizium-traegers |
DE4037202A1 (de) * | 1990-11-22 | 1992-05-27 | Asea Brown Boveri | Verfahren zum herstellen von graeben in einem einkristallinen siliziumkoerper |
DE4106933B4 (de) * | 1991-03-05 | 2004-12-16 | Robert Bosch Gmbh | Strukturierungsverfahren |
DE4134291A1 (de) * | 1991-10-17 | 1993-04-22 | Bosch Gmbh Robert | Verfahren zur exakten ausrichtung von masken zum anisotropen aetzen von dreidimensionalen strukturen aus siliziumwafern |
US5286343A (en) * | 1992-07-24 | 1994-02-15 | Regents Of The University Of California | Method for protecting chip corners in wet chemical etching of wafers |
JP3333560B2 (ja) * | 1992-10-23 | 2002-10-15 | リコーエレメックス株式会社 | シリコン基板のエッチング方法 |
DE4332653C1 (de) * | 1993-09-24 | 1994-09-01 | Hahn Schickard Ges | Monolithisch integriertes Halbleiterelement, dessen Verwendung sowie Verfahren zur Herstellung eines solchen Halbleiterelementes |
-
1992
- 1992-10-23 JP JP30940692A patent/JP3333560B2/ja not_active Expired - Fee Related
-
1993
- 1993-10-22 DE DE69329369T patent/DE69329369T2/de not_active Expired - Lifetime
- 1993-10-22 DE DE69333843T patent/DE69333843T2/de not_active Expired - Lifetime
- 1993-10-22 EP EP98111343A patent/EP0878835B1/de not_active Expired - Lifetime
- 1993-10-22 EP EP93117176A patent/EP0597302B1/de not_active Expired - Lifetime
- 1993-10-22 US US08/139,696 patent/US5683546A/en not_active Expired - Lifetime
- 1993-10-22 FI FI934674A patent/FI934674A/fi not_active Application Discontinuation
-
1997
- 1997-08-12 US US08/909,820 patent/US5888761A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0597302B1 (de) | 2000-09-06 |
JPH06140641A (ja) | 1994-05-20 |
DE69329369T2 (de) | 2001-03-29 |
JP3333560B2 (ja) | 2002-10-15 |
EP0597302A3 (de) | 1996-04-10 |
US5888761A (en) | 1999-03-30 |
FI934674A0 (fi) | 1993-10-22 |
EP0878835B1 (de) | 2005-07-20 |
DE69333843T2 (de) | 2006-04-27 |
EP0597302A2 (de) | 1994-05-18 |
US5683546A (en) | 1997-11-04 |
FI934674A (fi) | 1994-04-24 |
DE69329369D1 (de) | 2000-10-12 |
EP0878835A1 (de) | 1998-11-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |