KR960025322U - 웨이퍼 에칭을 위한 씨너공급 장치 - Google Patents

웨이퍼 에칭을 위한 씨너공급 장치

Info

Publication number
KR960025322U
KR960025322U KR2019940034750U KR19940034750U KR960025322U KR 960025322 U KR960025322 U KR 960025322U KR 2019940034750 U KR2019940034750 U KR 2019940034750U KR 19940034750 U KR19940034750 U KR 19940034750U KR 960025322 U KR960025322 U KR 960025322U
Authority
KR
South Korea
Prior art keywords
supply device
wafer etching
thinner supply
thinner
wafer
Prior art date
Application number
KR2019940034750U
Other languages
English (en)
Other versions
KR0132019Y1 (ko
Inventor
이두희
길명군
구영모
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019940034750U priority Critical patent/KR0132019Y1/ko
Publication of KR960025322U publication Critical patent/KR960025322U/ko
Application granted granted Critical
Publication of KR0132019Y1 publication Critical patent/KR0132019Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
KR2019940034750U 1994-12-20 1994-12-20 웨이퍼 에칭을 위한 씨너공급 장치 KR0132019Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940034750U KR0132019Y1 (ko) 1994-12-20 1994-12-20 웨이퍼 에칭을 위한 씨너공급 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940034750U KR0132019Y1 (ko) 1994-12-20 1994-12-20 웨이퍼 에칭을 위한 씨너공급 장치

Publications (2)

Publication Number Publication Date
KR960025322U true KR960025322U (ko) 1996-07-22
KR0132019Y1 KR0132019Y1 (ko) 1999-02-01

Family

ID=19401956

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940034750U KR0132019Y1 (ko) 1994-12-20 1994-12-20 웨이퍼 에칭을 위한 씨너공급 장치

Country Status (1)

Country Link
KR (1) KR0132019Y1 (ko)

Also Published As

Publication number Publication date
KR0132019Y1 (ko) 1999-02-01

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Legal Events

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