KR960025373U - 웨이퍼의 테이프 제거장치 - Google Patents

웨이퍼의 테이프 제거장치

Info

Publication number
KR960025373U
KR960025373U KR2019940036814U KR19940036814U KR960025373U KR 960025373 U KR960025373 U KR 960025373U KR 2019940036814 U KR2019940036814 U KR 2019940036814U KR 19940036814 U KR19940036814 U KR 19940036814U KR 960025373 U KR960025373 U KR 960025373U
Authority
KR
South Korea
Prior art keywords
removal device
wafer tape
tape removal
wafer
tape
Prior art date
Application number
KR2019940036814U
Other languages
English (en)
Other versions
KR200177256Y1 (ko
Inventor
안희원
Original Assignee
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대반도체주식회사 filed Critical 현대반도체주식회사
Priority to KR2019940036814U priority Critical patent/KR200177256Y1/ko
Publication of KR960025373U publication Critical patent/KR960025373U/ko
Application granted granted Critical
Publication of KR200177256Y1 publication Critical patent/KR200177256Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR2019940036814U 1994-12-28 1994-12-28 웨이퍼의 테이프 제거장치 KR200177256Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940036814U KR200177256Y1 (ko) 1994-12-28 1994-12-28 웨이퍼의 테이프 제거장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940036814U KR200177256Y1 (ko) 1994-12-28 1994-12-28 웨이퍼의 테이프 제거장치

Publications (2)

Publication Number Publication Date
KR960025373U true KR960025373U (ko) 1996-07-22
KR200177256Y1 KR200177256Y1 (ko) 2000-04-15

Family

ID=19403539

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940036814U KR200177256Y1 (ko) 1994-12-28 1994-12-28 웨이퍼의 테이프 제거장치

Country Status (1)

Country Link
KR (1) KR200177256Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100386633B1 (ko) * 1999-12-30 2003-06-02 앰코 테크놀로지 코리아 주식회사 반도체칩 부착용 접착부재의 커버 필름 제거장치 및 이를이용한 커버 필름 제거 방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030077782A (ko) * 2002-03-27 2003-10-04 주식회사 칩팩코리아 테이프 볼 그리드 어레이 패키지 제조용 보호막 분리기 및이를 이용한 보호막 분리방법
KR100741168B1 (ko) 2006-07-05 2007-07-20 주식회사 다이나테크 필링바를 이용한 디테이핑 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100386633B1 (ko) * 1999-12-30 2003-06-02 앰코 테크놀로지 코리아 주식회사 반도체칩 부착용 접착부재의 커버 필름 제거장치 및 이를이용한 커버 필름 제거 방법

Also Published As

Publication number Publication date
KR200177256Y1 (ko) 2000-04-15

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