KR970025802U - 웨이퍼 식각장치 - Google Patents

웨이퍼 식각장치

Info

Publication number
KR970025802U
KR970025802U KR2019950032608U KR19950032608U KR970025802U KR 970025802 U KR970025802 U KR 970025802U KR 2019950032608 U KR2019950032608 U KR 2019950032608U KR 19950032608 U KR19950032608 U KR 19950032608U KR 970025802 U KR970025802 U KR 970025802U
Authority
KR
South Korea
Prior art keywords
etching device
wafer etching
wafer
etching
Prior art date
Application number
KR2019950032608U
Other languages
English (en)
Other versions
KR0136817Y1 (ko
Inventor
김혜동
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950032608U priority Critical patent/KR0136817Y1/ko
Publication of KR970025802U publication Critical patent/KR970025802U/ko
Application granted granted Critical
Publication of KR0136817Y1 publication Critical patent/KR0136817Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
KR2019950032608U 1995-11-08 1995-11-08 웨이퍼 식각장치 KR0136817Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950032608U KR0136817Y1 (ko) 1995-11-08 1995-11-08 웨이퍼 식각장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950032608U KR0136817Y1 (ko) 1995-11-08 1995-11-08 웨이퍼 식각장치

Publications (2)

Publication Number Publication Date
KR970025802U true KR970025802U (ko) 1997-06-20
KR0136817Y1 KR0136817Y1 (ko) 1999-03-20

Family

ID=19428329

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950032608U KR0136817Y1 (ko) 1995-11-08 1995-11-08 웨이퍼 식각장치

Country Status (1)

Country Link
KR (1) KR0136817Y1 (ko)

Also Published As

Publication number Publication date
KR0136817Y1 (ko) 1999-03-20

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Legal Events

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E701 Decision to grant or registration of patent right
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Payment date: 20041018

Year of fee payment: 7

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