KR870004490A - 반도체 웨이퍼 브레이크(wafer break)장치 - Google Patents

반도체 웨이퍼 브레이크(wafer break)장치

Info

Publication number
KR870004490A
KR870004490A KR1019860005420A KR860005420A KR870004490A KR 870004490 A KR870004490 A KR 870004490A KR 1019860005420 A KR1019860005420 A KR 1019860005420A KR 860005420 A KR860005420 A KR 860005420A KR 870004490 A KR870004490 A KR 870004490A
Authority
KR
South Korea
Prior art keywords
semiconductor wafer
break device
wafer break
semiconductor
wafer
Prior art date
Application number
KR1019860005420A
Other languages
English (en)
Other versions
KR900001649B1 (ko
Inventor
마사히로 이시쓰까
도시오 고메하라
이찌로 하야시
Original Assignee
미쓰비시전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시전기주식회사 filed Critical 미쓰비시전기주식회사
Publication of KR870004490A publication Critical patent/KR870004490A/ko
Application granted granted Critical
Publication of KR900001649B1 publication Critical patent/KR900001649B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool
    • Y10T225/379—Breaking tool intermediate spaced work supports
    • Y10T225/386—Clamping supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1019860005420A 1985-10-04 1986-07-04 반도체 웨이퍼 브레이크(wafer break)장치 KR900001649B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60222104A JPS6282008A (ja) 1985-10-04 1985-10-04 半導体ウエハ−ブレイク装置
JP60-222104 1985-10-04

Publications (2)

Publication Number Publication Date
KR870004490A true KR870004490A (ko) 1987-05-09
KR900001649B1 KR900001649B1 (ko) 1990-03-17

Family

ID=16777200

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860005420A KR900001649B1 (ko) 1985-10-04 1986-07-04 반도체 웨이퍼 브레이크(wafer break)장치

Country Status (3)

Country Link
US (1) US4775085A (ko)
JP (1) JPS6282008A (ko)
KR (1) KR900001649B1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07100615B2 (ja) * 1988-03-29 1995-11-01 和郎 佐藤 ガラス加工物切断装置
KR100291243B1 (ko) * 1991-08-14 2001-10-24 콜린 스미스 반도체웨이퍼를쪼개는방법및장치
US5710065A (en) * 1995-01-03 1998-01-20 Texas Instruments Incorporated Method and apparatus for breaking and separating dies from a wafer
FR2749794B1 (fr) * 1996-06-13 1998-07-31 Charil Josette Dispositif de clivage d'une plaque de materiau semi-conducteur
US6184063B1 (en) 1996-11-26 2001-02-06 Texas Instruments Incorporated Method and apparatus for breaking and separating a wafer into die using a multi-radii dome
US6685073B1 (en) 1996-11-26 2004-02-03 Texas Instruments Incorporated Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer
IL124199A (en) 1998-04-23 2001-03-19 Sela Semiconductor Enginering Apparatus for cleaving crystals
JP2001250799A (ja) * 2000-03-03 2001-09-14 Mitsubishi Electric Corp 半導体ウェハおよび半導体装置
JP4515790B2 (ja) * 2004-03-08 2010-08-04 株式会社東芝 半導体装置の製造方法及びその製造装置
JP4694795B2 (ja) * 2004-05-18 2011-06-08 株式会社ディスコ ウエーハの分割方法
JP5147230B2 (ja) * 2006-12-26 2013-02-20 三洋電機株式会社 半導体基板の割断装置及び太陽電池モジュールの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL284964A (ko) * 1961-11-10 1900-01-01
US3497948A (en) * 1967-09-05 1970-03-03 Transistor Automation Corp Method and apparatus for sorting semi-conductor devices
US3562803A (en) * 1969-08-01 1971-02-09 Centrifugal Products Inc Plate breaking apparatus
JPS5313950B2 (ko) * 1972-03-02 1978-05-13
US4005808A (en) * 1974-01-30 1977-02-01 The Fletcher-Terry Company Plastic cutting method
JPS5173871A (ja) * 1974-12-23 1976-06-26 Fujitsu Ltd Handotaisochinoseizohoho
US4195758A (en) * 1978-04-03 1980-04-01 Gte Automatic Electric Laboratories, Incorporated Apparatus for separating snapstrates into individual hybrid substrates
JPS61249709A (ja) * 1985-04-30 1986-11-06 日立電線株式会社 半導体ウエハの切断方法

Also Published As

Publication number Publication date
US4775085A (en) 1988-10-04
JPH0262367B2 (ko) 1990-12-25
JPS6282008A (ja) 1987-04-15
KR900001649B1 (ko) 1990-03-17

Similar Documents

Publication Publication Date Title
KR860006137A (ko) 반도체 집적회로
DE3650012D1 (de) Halbleitervorrichtung.
KR870004526A (ko) 실리콘 온 인슐레이터 구조를 갖는 반도체 장치
NL189326C (nl) Halfgeleiderinrichting.
KR920003832A (ko) 반도체 장치 제조 방법
KR860009491A (ko) 반도체 메모리 장치
KR860006132A (ko) 반도체 장치용 기판 구조체
KR880701023A (ko) 반도체 장치 제조 방법
KR880004552A (ko) 반도체장치 제조방법
KR900008635A (ko) 반도체 웨이퍼의 흐림 방지장치
DE3688064T2 (de) Halbleitervorrichtung.
KR860007755A (ko) 반도체 장치
KR850006779A (ko) 반도체 장치
KR890004421A (ko) 반도체집적회로장치
KR850007157A (ko) 반도체 집적 회로장치
KR860009487A (ko) 반도체장치의 용장회로
KR860012475U (ko) 반도체 레이저장치
KR870004490A (ko) 반도체 웨이퍼 브레이크(wafer break)장치
KR860007744A (ko) 반도체 메모리장치
FR2575865B1 (fr) Dispositif semi-conducteur integre
KR860004470A (ko) 반도체 장치
EP0188378A3 (en) Semiconductor circuit device
KR880701017A (ko) 반도체 장치
KR870006688A (ko) 반도체 레이저장치
KR860006136A (ko) 반도체 집적 회로 장치

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19940314

Year of fee payment: 5

LAPS Lapse due to unpaid annual fee