KR860012475U - 반도체 레이저장치 - Google Patents

반도체 레이저장치

Info

Publication number
KR860012475U
KR860012475U KR2019860002759U KR860002759U KR860012475U KR 860012475 U KR860012475 U KR 860012475U KR 2019860002759 U KR2019860002759 U KR 2019860002759U KR 860002759 U KR860002759 U KR 860002759U KR 860012475 U KR860012475 U KR 860012475U
Authority
KR
South Korea
Prior art keywords
semiconductor laser
laser device
semiconductor
laser
Prior art date
Application number
KR2019860002759U
Other languages
English (en)
Other versions
KR920002914Y1 (ko
Inventor
오사무 마쓰다
Original Assignee
쏘니 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쏘니 가부시기가이샤 filed Critical 쏘니 가부시기가이샤
Publication of KR860012475U publication Critical patent/KR860012475U/ko
Application granted granted Critical
Publication of KR920002914Y1 publication Critical patent/KR920002914Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0202—Cleaving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
KR2019860002759U 1985-03-23 1986-03-10 반도체 레이저장치 KR920002914Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP85-42245(U) 1985-03-23
JP1985042245U JPH0419819Y2 (ko) 1985-03-23 1985-03-23

Publications (2)

Publication Number Publication Date
KR860012475U true KR860012475U (ko) 1986-10-10
KR920002914Y1 KR920002914Y1 (ko) 1992-05-08

Family

ID=12630639

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019860002759U KR920002914Y1 (ko) 1985-03-23 1986-03-10 반도체 레이저장치

Country Status (5)

Country Link
US (1) US4764931A (ko)
EP (1) EP0196200B1 (ko)
JP (1) JPH0419819Y2 (ko)
KR (1) KR920002914Y1 (ko)
DE (1) DE3680223D1 (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4906839A (en) * 1986-05-01 1990-03-06 Pencom International Corp. Hybrid surface emitting laser and detector
JPS63124486A (ja) * 1986-11-13 1988-05-27 Mitsubishi Electric Corp 半導体レ−ザの製造方法
US4905216A (en) * 1986-12-04 1990-02-27 Pencom International Corporation Method for constructing an optical head by varying a hologram pattern
US4945524A (en) * 1987-04-15 1990-07-31 Pioneer Electronic Corporation Compact optical pickup apparatus for optical disk player
US4999842A (en) * 1989-03-01 1991-03-12 At&T Bell Laboratories Quantum well vertical cavity laser
JPH02271586A (ja) * 1989-04-12 1990-11-06 Mitsubishi Electric Corp 半導体レーザ装置
US4980549A (en) * 1990-03-05 1990-12-25 Eastman Kodak Company Beam position sensor for a light beam scanner having emitter and detector disposed along the same optical axis
EP0510423B1 (de) * 1991-04-24 1997-01-22 Siemens Aktiengesellschaft Optoelektronische Sendevorrichtung
US5293032A (en) * 1992-02-10 1994-03-08 Sydney Urshan Digital data optical recording and playback system
US5319182A (en) * 1992-03-04 1994-06-07 Welch Allyn, Inc. Integrated solid state light emitting and detecting array and apparatus employing said array
JPH0894938A (ja) * 1994-09-21 1996-04-12 Sony Corp 共焦点顕微鏡並びに光記録再生装置
DE19742150C1 (de) * 1997-09-24 1999-04-22 Siemens Nixdorf Inf Syst Verfahren zur Herstellung einer optischen Speicherplatte und zu deren Herstellung geeigneter CD-R-Plattenrohling
US5903584A (en) * 1998-01-05 1999-05-11 Youngtek Electronics Laser diode package
JP2008004914A (ja) * 2006-05-22 2008-01-10 Toshiba Corp 半導体レーザ装置
WO2009001283A2 (en) * 2007-06-27 2008-12-31 Koninklijke Philips Electronics N.V. Optical sensor module and its manufacture
US9570648B2 (en) 2012-06-15 2017-02-14 Intersil Americas LLC Wafer level optical proximity sensors and systems including wafer level optical proximity sensors
US9721837B2 (en) 2015-04-16 2017-08-01 Intersil Americas LLC Wafer level optoelectronic device packages with crosstalk barriers and methods for making the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1073460A (en) * 1964-07-31 1967-06-28 Battelle Development Corp Semiconductor devices
DE2542174C3 (de) * 1974-09-21 1980-02-14 Nippon Electric Co., Ltd., Tokio Halbleiterlaservorrichtung
DE2737345C2 (de) * 1976-08-20 1991-07-25 Canon K.K., Tokio/Tokyo Halbleiterlaser-Vorrichtung mit einem Peltier-Element
JPS6195591A (ja) * 1984-10-16 1986-05-14 Sony Corp 半導体レ−ザ

Also Published As

Publication number Publication date
EP0196200A2 (en) 1986-10-01
DE3680223D1 (de) 1991-08-22
US4764931A (en) 1988-08-16
JPS61158969U (ko) 1986-10-02
KR920002914Y1 (ko) 1992-05-08
EP0196200A3 (en) 1988-01-13
EP0196200B1 (en) 1991-07-17
JPH0419819Y2 (ko) 1992-05-06

Similar Documents

Publication Publication Date Title
DE3687329T2 (de) Halbleiterlaser-vorrichtung.
NO171438C (no) Laseranordning
DE3650012T2 (de) Halbleitervorrichtung.
DE3685466D1 (de) Halbleiterlaser-vorrichtung.
DE3676867D1 (de) Halbleiterlaser.
NL189326C (nl) Halfgeleiderinrichting.
DE3688064D1 (de) Halbleitervorrichtung.
KR860007755A (ko) 반도체 장치
KR850006779A (ko) 반도체 장치
FR2585522B1 (fr) Laser semi-conducteur
DE3674959D1 (de) Halbleiterlaser.
KR860012475U (ko) 반도체 레이저장치
DE3688943D1 (de) Halbleiterlaservorrichtung.
DE3650379D1 (de) Halbleiterlaservorrichtung.
DE3688017T2 (de) Halbleiterlaser-vorrichtung.
GB8623226D0 (en) Semiconductor laser device
KR860004470A (ko) 반도체 장치
DE3581076D1 (de) Halbleiterlaser-vorrichtungen.
KR880701985A (ko) 레이저 장치
DE3688951T2 (de) Halbleiterlaservorrichtung.
KR870006688A (ko) 반도체 레이저장치
DE3687480T2 (de) Halbleiterlaservorrichtung.
GB8625439D0 (en) Semiconductor laser device
DE3678471D1 (de) Halbleiterlaser.
DE3681645D1 (de) Halbleiterlaser-vorrichtung.

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 19990915

Year of fee payment: 9

EXPY Expiration of term