DE3751738D1 - Mehrkammer-Plasmaätzsystem - Google Patents
Mehrkammer-PlasmaätzsystemInfo
- Publication number
- DE3751738D1 DE3751738D1 DE3751738T DE3751738T DE3751738D1 DE 3751738 D1 DE3751738 D1 DE 3751738D1 DE 3751738 T DE3751738 T DE 3751738T DE 3751738 T DE3751738 T DE 3751738T DE 3751738 D1 DE3751738 D1 DE 3751738D1
- Authority
- DE
- Germany
- Prior art keywords
- plasma etching
- etching system
- chamber plasma
- chamber
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Revoked
Links
- 238000001020 plasma etching Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Robotics (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/923,125 US4715921A (en) | 1986-10-24 | 1986-10-24 | Quad processor |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3751738D1 true DE3751738D1 (de) | 1996-04-18 |
DE3751738T2 DE3751738T2 (de) | 1996-11-07 |
Family
ID=25448159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3751738T Revoked DE3751738T2 (de) | 1986-10-24 | 1987-10-22 | Mehrkammer-Plasmaätzsystem |
Country Status (6)
Country | Link |
---|---|
US (1) | US4715921A (de) |
EP (2) | EP0264945B1 (de) |
JP (1) | JPS63133532A (de) |
KR (1) | KR880005675A (de) |
CA (1) | CA1283174C (de) |
DE (1) | DE3751738T2 (de) |
Families Citing this family (113)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5013385A (en) * | 1986-04-18 | 1991-05-07 | General Signal Corporation | Quad processor |
US5102495A (en) * | 1986-04-18 | 1992-04-07 | General Signal Corporation | Method providing multiple-processing of substrates |
US5308431A (en) * | 1986-04-18 | 1994-05-03 | General Signal Corporation | System providing multiple processing of substrates |
US6214119B1 (en) | 1986-04-18 | 2001-04-10 | Applied Materials, Inc. | Vacuum substrate processing system having multiple processing chambers and a central load/unload chamber |
EP0246453A3 (de) * | 1986-04-18 | 1989-09-06 | General Signal Corporation | Kontaminierungsfreie Plasma-Ätzvorrichtung mit mehreren Behandlungsstellen |
US6103055A (en) * | 1986-04-18 | 2000-08-15 | Applied Materials, Inc. | System for processing substrates |
US5882165A (en) * | 1986-12-19 | 1999-03-16 | Applied Materials, Inc. | Multiple chamber integrated process system |
US5292393A (en) * | 1986-12-19 | 1994-03-08 | Applied Materials, Inc. | Multichamber integrated process system |
DE3789212T2 (de) * | 1986-12-19 | 1994-06-01 | Applied Materials Inc | Integriertes Bearbeitungssystem mit Vielfachkammer. |
US4951601A (en) * | 1986-12-19 | 1990-08-28 | Applied Materials, Inc. | Multi-chamber integrated process system |
JPS63204726A (ja) * | 1987-02-20 | 1988-08-24 | Anelva Corp | 真空処理装置 |
US4906328A (en) * | 1987-07-16 | 1990-03-06 | Texas Instruments Incorporated | Method for wafer treating |
US5435682A (en) * | 1987-10-15 | 1995-07-25 | Advanced Semiconductor Materials America, Inc. | Chemical vapor desposition system |
US5591267A (en) * | 1988-01-11 | 1997-01-07 | Ohmi; Tadahiro | Reduced pressure device |
US5906688A (en) * | 1989-01-11 | 1999-05-25 | Ohmi; Tadahiro | Method of forming a passivation film |
ES2163388T3 (es) * | 1988-05-24 | 2002-02-01 | Unaxis Balzers Ag | Instalacion de vacio. |
US5019233A (en) * | 1988-10-31 | 1991-05-28 | Eaton Corporation | Sputtering system |
US5683072A (en) * | 1988-11-01 | 1997-11-04 | Tadahiro Ohmi | Thin film forming equipment |
US5076205A (en) * | 1989-01-06 | 1991-12-31 | General Signal Corporation | Modular vapor processor system |
US5186718A (en) * | 1989-05-19 | 1993-02-16 | Applied Materials, Inc. | Staged-vacuum wafer processing system and method |
EP0416646B1 (de) * | 1989-09-08 | 2000-02-09 | Tokyo Electron Limited | Vorrichtung und Verfahren zum Behandeln von Substraten |
DE69120446T2 (de) * | 1990-02-19 | 1996-11-14 | Canon Kk | Verfahren zum Herstellen von abgeschiedener Metallschicht, die Aluminium als Hauptkomponente enthält, mit Anwendung von Alkylaluminiumhydrid |
US5100502A (en) * | 1990-03-19 | 1992-03-31 | Applied Materials, Inc. | Semiconductor wafer transfer in processing systems |
US5186594A (en) * | 1990-04-19 | 1993-02-16 | Applied Materials, Inc. | Dual cassette load lock |
JP2528026B2 (ja) * | 1990-07-04 | 1996-08-28 | 三菱電機株式会社 | 配線パタ―ンの形成方法およびその装置 |
US5213996A (en) * | 1990-07-04 | 1993-05-25 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for forming interconnection pattern and semiconductor device having such interconnection pattern |
US5286296A (en) * | 1991-01-10 | 1994-02-15 | Sony Corporation | Multi-chamber wafer process equipment having plural, physically communicating transfer means |
JPH0766919B2 (ja) * | 1991-02-20 | 1995-07-19 | 株式会社半導体プロセス研究所 | 半導体製造装置 |
US5171393A (en) * | 1991-07-29 | 1992-12-15 | Moffat William A | Wafer processing apparatus |
JP2598353B2 (ja) * | 1991-12-04 | 1997-04-09 | アネルバ株式会社 | 基板処理装置、基板搬送装置及び基板交換方法 |
JP2751975B2 (ja) * | 1991-12-20 | 1998-05-18 | 株式会社日立製作所 | 半導体処理装置のロードロック室 |
JP3030160B2 (ja) * | 1992-04-28 | 2000-04-10 | 東京エレクトロン株式会社 | 真空処理装置 |
US5404894A (en) * | 1992-05-20 | 1995-04-11 | Tokyo Electron Kabushiki Kaisha | Conveyor apparatus |
US5534072A (en) * | 1992-06-24 | 1996-07-09 | Anelva Corporation | Integrated module multi-chamber CVD processing system and its method for processing subtrates |
US5248371A (en) * | 1992-08-13 | 1993-09-28 | General Signal Corporation | Hollow-anode glow discharge apparatus |
JPH0828333B2 (ja) * | 1992-11-30 | 1996-03-21 | 株式会社半導体プロセス研究所 | 半導体装置の製造装置 |
JPH0828334B2 (ja) * | 1992-11-30 | 1996-03-21 | 株式会社半導体プロセス研究所 | 半導体装置の製造装置及びその使用方法 |
US5647945A (en) * | 1993-08-25 | 1997-07-15 | Tokyo Electron Limited | Vacuum processing apparatus |
US5588827A (en) * | 1993-12-17 | 1996-12-31 | Brooks Automation Inc. | Passive gas substrate thermal conditioning apparatus and method |
US6245189B1 (en) * | 1994-12-05 | 2001-06-12 | Nordson Corporation | High Throughput plasma treatment system |
GB9425349D0 (en) * | 1994-12-15 | 1995-02-15 | Oxford Plasma Technology Ltd | Substrate loading apparatus |
US6193506B1 (en) | 1995-05-24 | 2001-02-27 | Brooks Automation, Inc. | Apparatus and method for batch thermal conditioning of substrates |
US5588789A (en) * | 1995-07-06 | 1996-12-31 | Brooks Automation | Load arm for load lock |
US5613821A (en) * | 1995-07-06 | 1997-03-25 | Brooks Automation, Inc. | Cluster tool batchloader of substrate carrier |
US5607276A (en) * | 1995-07-06 | 1997-03-04 | Brooks Automation, Inc. | Batchloader for substrate carrier on load lock |
US5664925A (en) * | 1995-07-06 | 1997-09-09 | Brooks Automation, Inc. | Batchloader for load lock |
US5609459A (en) * | 1995-07-06 | 1997-03-11 | Brooks Automation, Inc. | Door drive mechanisms for substrate carrier and load lock |
JPH0936198A (ja) | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
US6672819B1 (en) | 1995-07-19 | 2004-01-06 | Hitachi, Ltd. | Vacuum processing apparatus and semiconductor manufacturing line using the same |
US5746565A (en) * | 1996-01-22 | 1998-05-05 | Integrated Solutions, Inc. | Robotic wafer handler |
US5855465A (en) * | 1996-04-16 | 1999-01-05 | Gasonics International | Semiconductor wafer processing carousel |
US5667592A (en) * | 1996-04-16 | 1997-09-16 | Gasonics International | Process chamber sleeve with ring seals for isolating individual process modules in a common cluster |
US5863170A (en) * | 1996-04-16 | 1999-01-26 | Gasonics International | Modular process system |
US5746434A (en) * | 1996-07-09 | 1998-05-05 | Lam Research Corporation | Chamber interfacing O-rings and method for implementing same |
US6714832B1 (en) * | 1996-09-11 | 2004-03-30 | Hitachi, Ltd. | Operating method of vacuum processing system and vacuum processing system |
US5928389A (en) * | 1996-10-21 | 1999-07-27 | Applied Materials, Inc. | Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool |
JP3393035B2 (ja) | 1997-05-06 | 2003-04-07 | 東京エレクトロン株式会社 | 制御装置及び半導体製造装置 |
US5944857A (en) * | 1997-05-08 | 1999-08-31 | Tokyo Electron Limited | Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
US5894760A (en) * | 1997-06-12 | 1999-04-20 | Brooks Automation, Inc. | Substrate transport drive system |
US6054688A (en) * | 1997-06-25 | 2000-04-25 | Brooks Automation, Inc. | Hybrid heater with ceramic foil serrated plate and gas assist |
US5911896A (en) * | 1997-06-25 | 1999-06-15 | Brooks Automation, Inc. | Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element |
US6123502A (en) * | 1997-07-08 | 2000-09-26 | Brooks Automation, Inc. | Substrate holder having vacuum holding and gravity holding |
US6139245A (en) * | 1997-07-11 | 2000-10-31 | Brooks Automation Inc. | Robot arm relocation system |
US6312525B1 (en) | 1997-07-11 | 2001-11-06 | Applied Materials, Inc. | Modular architecture for semiconductor wafer fabrication equipment |
US6002840A (en) * | 1997-09-30 | 1999-12-14 | Brooks Automation Inc. | Substrate transport apparatus |
JP3582330B2 (ja) * | 1997-11-14 | 2004-10-27 | 東京エレクトロン株式会社 | 処理装置及びこれを用いた処理システム |
EP1034566A1 (de) * | 1997-11-26 | 2000-09-13 | Applied Materials, Inc. | Zerstörungsfreie beschichtungsmethode |
US7253109B2 (en) | 1997-11-26 | 2007-08-07 | Applied Materials, Inc. | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system |
US6072898A (en) | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
US6067596A (en) * | 1998-09-15 | 2000-05-23 | Compaq Computer Corporation | Flexible placement of GTL end points using double termination points |
US6960057B1 (en) | 1998-09-30 | 2005-11-01 | Brooks Automation, Inc. | Substrate transport apparatus |
US6328858B1 (en) | 1998-10-01 | 2001-12-11 | Nexx Systems Packaging, Llc | Multi-layer sputter deposition apparatus |
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US6485250B2 (en) | 1998-12-30 | 2002-11-26 | Brooks Automation Inc. | Substrate transport apparatus with multiple arms on a common axis of rotation |
US6120229A (en) * | 1999-02-01 | 2000-09-19 | Brooks Automation Inc. | Substrate carrier as batchloader |
US6095741A (en) * | 1999-03-29 | 2000-08-01 | Lam Research Corporation | Dual sided slot valve and method for implementing the same |
US6267545B1 (en) | 1999-03-29 | 2001-07-31 | Lam Research Corporation | Semiconductor processing platform architecture having processing module isolation capabilities |
US6440261B1 (en) | 1999-05-25 | 2002-08-27 | Applied Materials, Inc. | Dual buffer chamber cluster tool for semiconductor wafer processing |
US6244811B1 (en) | 1999-06-29 | 2001-06-12 | Lam Research Corporation | Atmospheric wafer transfer module with nest for wafer transport robot |
DE29915696U1 (de) * | 1999-09-07 | 2001-01-18 | Bosch Gmbh Robert | Ätzanlage zum HF-Dampfätzen |
JP2001093791A (ja) | 1999-09-20 | 2001-04-06 | Hitachi Ltd | 真空処理装置の運転方法及びウエハの処理方法 |
JP2001127044A (ja) | 1999-10-29 | 2001-05-11 | Hitachi Ltd | 真空処理装置および真空処理システム |
US6265803B1 (en) * | 1999-11-10 | 2001-07-24 | Brooks Automation, Inc. | Unlimited rotation vacuum isolation wire feedthrough |
US6558509B2 (en) * | 1999-11-30 | 2003-05-06 | Applied Materials, Inc. | Dual wafer load lock |
US6913243B1 (en) * | 2000-03-30 | 2005-07-05 | Lam Research Corporation | Unitary slot valve actuator with dual valves |
US6390448B1 (en) | 2000-03-30 | 2002-05-21 | Lam Research Corporation | Single shaft dual cradle vacuum slot valve |
US6682288B2 (en) | 2000-07-27 | 2004-01-27 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
US6530733B2 (en) | 2000-07-27 | 2003-03-11 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
US6821912B2 (en) | 2000-07-27 | 2004-11-23 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
EP1217647B1 (de) * | 2000-12-21 | 2006-03-08 | Oxford Instruments Plasma Technology Limited | Substrateneinschleusenvorrichtung |
EP1220596A1 (de) | 2000-12-29 | 2002-07-03 | Icos Vision Systems N.V. | Verfahren und Einrichtung zur Lageerfassung der Anschlusskontakte elektronischer Bauelemente |
DE60137306D1 (de) * | 2001-03-02 | 2009-02-26 | Icos Vision Systems Nv | Selbsttragendes und anpassbares Messgerät |
JP4364634B2 (ja) | 2001-07-13 | 2009-11-18 | ブルックス オートメーション インコーポレイテッド | 二次元3自由度ロボットアームの軌道プラニング及び移動制御戦略 |
US7578649B2 (en) | 2002-05-29 | 2009-08-25 | Brooks Automation, Inc. | Dual arm substrate transport apparatus |
US7100954B2 (en) | 2003-07-11 | 2006-09-05 | Nexx Systems, Inc. | Ultra-thin wafer handling system |
US20060024451A1 (en) * | 2004-07-30 | 2006-02-02 | Applied Materials Inc. | Enhanced magnetic shielding for plasma-based semiconductor processing tool |
US20070134821A1 (en) * | 2004-11-22 | 2007-06-14 | Randhir Thakur | Cluster tool for advanced front-end processing |
US20070196011A1 (en) * | 2004-11-22 | 2007-08-23 | Cox Damon K | Integrated vacuum metrology for cluster tool |
US20060240680A1 (en) * | 2005-04-25 | 2006-10-26 | Applied Materials, Inc. | Substrate processing platform allowing processing in different ambients |
US9248568B2 (en) * | 2005-07-11 | 2016-02-02 | Brooks Automation, Inc. | Unequal link SCARA arm |
US7738987B2 (en) * | 2006-11-28 | 2010-06-15 | Tokyo Electron Limited | Device and method for controlling substrate processing apparatus |
US10541157B2 (en) | 2007-05-18 | 2020-01-21 | Brooks Automation, Inc. | Load lock fast pump vent |
WO2008144670A1 (en) | 2007-05-18 | 2008-11-27 | Brooks Automation, Inc. | Load lock fast pump vent |
JP2008109134A (ja) * | 2007-10-17 | 2008-05-08 | Hitachi Ltd | 真空処理装置及び真空処理方法 |
JP5253511B2 (ja) * | 2007-10-24 | 2013-07-31 | オーツェー・エリコン・バルザース・アーゲー | ワークピース製造方法及び装置 |
JP5107961B2 (ja) * | 2009-04-22 | 2012-12-26 | 株式会社日立製作所 | 真空処理装置及び真空処理方法 |
JP5698043B2 (ja) * | 2010-08-04 | 2015-04-08 | 株式会社ニューフレアテクノロジー | 半導体製造装置 |
US9202733B2 (en) | 2011-11-07 | 2015-12-01 | Persimmon Technologies Corporation | Robot system with independent arms |
US9401296B2 (en) | 2011-11-29 | 2016-07-26 | Persimmon Technologies Corporation | Vacuum robot adapted to grip and transport a substrate and method thereof with passive bias |
JP5314789B2 (ja) * | 2012-06-13 | 2013-10-16 | 株式会社日立製作所 | 真空処理装置及び真空処理方法 |
US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
US20150041062A1 (en) * | 2013-08-12 | 2015-02-12 | Lam Research Corporation | Plasma processing chamber with removable body |
US9970098B2 (en) * | 2013-12-16 | 2018-05-15 | United Technologies Corporation | Movable evaporation source |
Family Cites Families (10)
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---|---|---|---|---|
JPS55141570A (en) * | 1979-04-18 | 1980-11-05 | Anelva Corp | Dry etching apparatus |
JPS57149748A (en) * | 1981-03-12 | 1982-09-16 | Anelva Corp | Treating device for substrate |
JPS59123226A (ja) * | 1982-12-28 | 1984-07-17 | Fujitsu Ltd | 半導体装置の製造装置 |
JPS6037129A (ja) * | 1983-08-10 | 1985-02-26 | Hitachi Ltd | 半導体製造装置 |
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CA1287594C (en) * | 1986-04-04 | 1991-08-13 | Miroslav Eror | Method and apparatus for handling and processing wafer like materials |
EP0246453A3 (de) * | 1986-04-18 | 1989-09-06 | General Signal Corporation | Kontaminierungsfreie Plasma-Ätzvorrichtung mit mehreren Behandlungsstellen |
-
1986
- 1986-10-24 US US06/923,125 patent/US4715921A/en not_active Expired - Lifetime
-
1987
- 1987-10-05 CA CA000548598A patent/CA1283174C/en not_active Expired - Lifetime
- 1987-10-22 DE DE3751738T patent/DE3751738T2/de not_active Revoked
- 1987-10-22 EP EP87115508A patent/EP0264945B1/de not_active Revoked
- 1987-10-22 EP EP95111001A patent/EP0680074A3/de not_active Withdrawn
- 1987-10-23 KR KR870011816A patent/KR880005675A/ko not_active Application Discontinuation
- 1987-10-23 JP JP62268021A patent/JPS63133532A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0264945A3 (en) | 1989-09-13 |
US4715921A (en) | 1987-12-29 |
EP0680074A2 (de) | 1995-11-02 |
CA1283174C (en) | 1991-04-16 |
DE3751738T2 (de) | 1996-11-07 |
EP0264945B1 (de) | 1996-03-13 |
KR880005675A (ko) | 1988-06-30 |
JPS63133532A (ja) | 1988-06-06 |
EP0680074A3 (de) | 1995-11-15 |
EP0264945A2 (de) | 1988-04-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8331 | Complete revocation |