DE3581251D1 - Elektronische schaltungsvorrichtung und verfahren zu ihrer herstellung. - Google Patents

Elektronische schaltungsvorrichtung und verfahren zu ihrer herstellung.

Info

Publication number
DE3581251D1
DE3581251D1 DE8585112539T DE3581251T DE3581251D1 DE 3581251 D1 DE3581251 D1 DE 3581251D1 DE 8585112539 T DE8585112539 T DE 8585112539T DE 3581251 T DE3581251 T DE 3581251T DE 3581251 D1 DE3581251 D1 DE 3581251D1
Authority
DE
Germany
Prior art keywords
melting
electronic circuit
solder
point
point solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585112539T
Other languages
German (de)
English (en)
Inventor
Ryohei Satoh
Muneo Oshima
Minoru Tanaka
Akira Murata
Suguru Sakaguchi
Kazuo Hirota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3581251D1 publication Critical patent/DE3581251D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/20—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/033—Punching metal foil, e.g. solder foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H10W70/682—
    • H10W72/07236—
    • H10W72/251—
    • H10W72/252—
    • H10W72/884—
    • H10W72/9445—
    • H10W90/724—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
DE8585112539T 1984-10-05 1985-10-03 Elektronische schaltungsvorrichtung und verfahren zu ihrer herstellung. Expired - Lifetime DE3581251D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59208072A JPS6187396A (ja) 1984-10-05 1984-10-05 電子回路装置とその製造方法

Publications (1)

Publication Number Publication Date
DE3581251D1 true DE3581251D1 (de) 1991-02-14

Family

ID=16550175

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585112539T Expired - Lifetime DE3581251D1 (de) 1984-10-05 1985-10-03 Elektronische schaltungsvorrichtung und verfahren zu ihrer herstellung.

Country Status (6)

Country Link
US (1) US4673772A (enExample)
EP (1) EP0177042B1 (enExample)
JP (1) JPS6187396A (enExample)
KR (1) KR900000183B1 (enExample)
CN (1) CN85108637B (enExample)
DE (1) DE3581251D1 (enExample)

Families Citing this family (59)

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US4875617A (en) * 1987-01-20 1989-10-24 Citowsky Elya L Gold-tin eutectic lead bonding method and structure
DE8711105U1 (de) * 1987-08-14 1987-11-26 Siemens AG, 1000 Berlin und 8000 München Leiterplatte für die Elektronik
US4912545A (en) * 1987-09-16 1990-03-27 Irvine Sensors Corporation Bonding of aligned conductive bumps on adjacent surfaces
US5161729A (en) * 1988-11-21 1992-11-10 Honeywell Inc. Package to semiconductor chip active interconnect site method
US5010387A (en) * 1988-11-21 1991-04-23 Honeywell Inc. Solder bonding material
US5066614A (en) * 1988-11-21 1991-11-19 Honeywell Inc. Method of manufacturing a leadframe having conductive elements preformed with solder bumps
US5008736A (en) * 1989-11-20 1991-04-16 Motorola, Inc. Thermal protection method for a power device
US5056216A (en) * 1990-01-26 1991-10-15 Sri International Method of forming a plurality of solder connections
JP2821229B2 (ja) * 1990-03-30 1998-11-05 株式会社日立製作所 電子回路装置
US5007163A (en) * 1990-04-18 1991-04-16 International Business Machines Corporation Non-destructure method of performing electrical burn-in testing of semiconductor chips
US5130779A (en) * 1990-06-19 1992-07-14 International Business Machines Corporation Solder mass having conductive encapsulating arrangement
US5251806A (en) * 1990-06-19 1993-10-12 International Business Machines Corporation Method of forming dual height solder interconnections
US5060844A (en) * 1990-07-18 1991-10-29 International Business Machines Corporation Interconnection structure and test method
US5075965A (en) * 1990-11-05 1991-12-31 International Business Machines Low temperature controlled collapse chip attach process
US5220200A (en) * 1990-12-10 1993-06-15 Delco Electronics Corporation Provision of substrate pillars to maintain chip standoff
US5056215A (en) * 1990-12-10 1991-10-15 Delco Electronics Corporation Method of providing standoff pillars
JPH04270092A (ja) * 1991-01-21 1992-09-25 Mitsubishi Electric Corp 半田材料及び接合方法
DE69233684D1 (de) 1991-02-22 2007-04-12 Canon Kk Elektrischer Verbindungskörper und Herstellungsverfahren dafür
KR920022482A (ko) * 1991-05-09 1992-12-19 가나이 쯔도무 전자부품 탑재모듈
US5186383A (en) * 1991-10-02 1993-02-16 Motorola, Inc. Method for forming solder bump interconnections to a solder-plated circuit trace
US5269453A (en) * 1992-04-02 1993-12-14 Motorola, Inc. Low temperature method for forming solder bump interconnections to a plated circuit trace
JP3141364B2 (ja) * 1992-05-06 2001-03-05 住友電気工業株式会社 半導体チップ
US5324892A (en) * 1992-08-07 1994-06-28 International Business Machines Corporation Method of fabricating an electronic interconnection
US5334804A (en) * 1992-11-17 1994-08-02 Fujitsu Limited Wire interconnect structures for connecting an integrated circuit to a substrate
US5540377A (en) * 1994-07-15 1996-07-30 Ito; Carl T. Solder ball placement machine
US5532612A (en) * 1994-07-19 1996-07-02 Liang; Louis H. Methods and apparatus for test and burn-in of integrated circuit devices
US5542174A (en) * 1994-09-15 1996-08-06 Intel Corporation Method and apparatus for forming solder balls and solder columns
DE19524739A1 (de) * 1994-11-17 1996-05-23 Fraunhofer Ges Forschung Kernmetall-Lothöcker für die Flip-Chip-Technik
US5601675A (en) * 1994-12-06 1997-02-11 International Business Machines Corporation Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor
JPH08250890A (ja) * 1995-03-09 1996-09-27 Nec Corp 混成集積回路装置
JP2827965B2 (ja) * 1995-05-19 1998-11-25 日本電気株式会社 ボールグリッドアレイ実装方式
US6344234B1 (en) * 1995-06-07 2002-02-05 International Business Machines Corportion Method for forming reflowed solder ball with low melting point metal cap
EP0747954A3 (en) * 1995-06-07 1997-05-07 Ibm Solder ball with a low melting point metal cap
US5675183A (en) * 1995-07-12 1997-10-07 Dell Usa Lp Hybrid multichip module and methods of fabricating same
US5777847A (en) * 1995-09-27 1998-07-07 Nec Corporation Multichip module having a cover wtih support pillar
US5812379A (en) * 1996-08-13 1998-09-22 Intel Corporation Small diameter ball grid array pad size for improved motherboard routing
US5957370A (en) * 1997-01-10 1999-09-28 Integrated Device Technology, Inc. Plating process for fine pitch die in wafer form
US5956573A (en) * 1997-01-17 1999-09-21 International Business Machines Corporation Use of argon sputtering to modify surface properties by thin film deposition
US5982038A (en) * 1997-05-01 1999-11-09 International Business Machines Corporation Cast metal seal for semiconductor substrates
US6299055B1 (en) * 1997-05-09 2001-10-09 Lear Automotive Dearborn, Inc. Manufacturing processes of service boxes and their parts
TW373197B (en) * 1997-05-14 1999-11-01 Murata Manufacturing Co Electronic device having electric wires and the manufacturing method thereof
US6025649A (en) 1997-07-22 2000-02-15 International Business Machines Corporation Pb-In-Sn tall C-4 for fatigue enhancement
US6023841A (en) * 1998-05-06 2000-02-15 Concorso; James A. Printed circuit board fixing and mounting procedure for power devices
US6119924A (en) * 1998-05-12 2000-09-19 Murata Manufacturing Co., Ltd. Electronic device having electric wires and method of producing same
US6137693A (en) * 1998-07-31 2000-10-24 Agilent Technologies Inc. High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding
EP1039527A3 (en) * 1999-03-24 2002-03-06 Shinko Electric Industries Co. Ltd. Semiconductor device mounting structure
US6578754B1 (en) * 2000-04-27 2003-06-17 Advanpack Solutions Pte. Ltd. Pillar connections for semiconductor chips and method of manufacture
US6492197B1 (en) 2000-05-23 2002-12-10 Unitive Electronics Inc. Trilayer/bilayer solder bumps and fabrication methods therefor
DE60108413T2 (de) * 2000-11-10 2005-06-02 Unitive Electronics, Inc. Verfahren zum positionieren von komponenten mit hilfe flüssiger antriebsmittel und strukturen hierfür
US6863209B2 (en) 2000-12-15 2005-03-08 Unitivie International Limited Low temperature methods of bonding components
US7531898B2 (en) * 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
AU2003256360A1 (en) * 2002-06-25 2004-01-06 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7547623B2 (en) * 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
TWI225899B (en) * 2003-02-18 2005-01-01 Unitive Semiconductor Taiwan C Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer
US7287685B2 (en) 2004-09-20 2007-10-30 International Business Machines Corporation Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders
JP4492330B2 (ja) * 2004-12-07 2010-06-30 パナソニック株式会社 電子部品実装構造体およびその製造方法
JP4555369B2 (ja) * 2008-08-13 2010-09-29 富士通メディアデバイス株式会社 電子部品モジュール及びその製造方法
FR2953679B1 (fr) * 2009-12-04 2012-06-01 Thales Sa Boitier electronique hermetique et procede d'assemblage hermetique d'un boitier
CN107486651B (zh) * 2017-08-02 2020-10-23 中国电器科学研究院股份有限公司 一种低温焊料片的制备方法

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US3512051A (en) * 1965-12-29 1970-05-12 Burroughs Corp Contacts for a semiconductor device
US3871015A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform connector joints
US3871014A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform solder wettable areas on the substrate
JPS5116260A (ja) * 1974-07-31 1976-02-09 Hitachi Ltd Rosetsuho
JPS5446365A (en) * 1977-09-20 1979-04-12 Nippon Electric Co Hybrid integrated circuit device
JPS58128749A (ja) * 1982-01-20 1983-08-01 ノ−ス・アメリカン・スペシヤリテイズ・コ−ポレイシヨン 電子的半組立部品用接続子
JPS59169694A (ja) * 1983-03-16 1984-09-25 Hitachi Ltd 半田接着方法
US4604644A (en) * 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making

Also Published As

Publication number Publication date
EP0177042A2 (en) 1986-04-09
CN85108637B (zh) 1988-03-09
CN85108637A (zh) 1986-07-09
US4673772A (en) 1987-06-16
JPS6187396A (ja) 1986-05-02
EP0177042B1 (en) 1991-01-09
KR860003756A (ko) 1986-05-28
JPH0528000B2 (enExample) 1993-04-22
EP0177042A3 (en) 1988-08-17
KR900000183B1 (ko) 1990-01-23

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