SE8702704L - Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid genomfoerande av saettet - Google Patents

Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid genomfoerande av saettet

Info

Publication number
SE8702704L
SE8702704L SE8702704A SE8702704A SE8702704L SE 8702704 L SE8702704 L SE 8702704L SE 8702704 A SE8702704 A SE 8702704A SE 8702704 A SE8702704 A SE 8702704A SE 8702704 L SE8702704 L SE 8702704L
Authority
SE
Sweden
Prior art keywords
locations
conductor paths
pct
interruptions
substrate material
Prior art date
Application number
SE8702704A
Other languages
English (en)
Other versions
SE8702704D0 (sv
SE458248B (sv
Inventor
Lars-Goeran Svensson
Original Assignee
Svensson Lars Goeran
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Svensson Lars Goeran filed Critical Svensson Lars Goeran
Priority to SE8702704A priority Critical patent/SE458248B/sv
Publication of SE8702704D0 publication Critical patent/SE8702704D0/sv
Priority to EP88906177A priority patent/EP0367785A1/en
Priority to PCT/SE1988/000336 priority patent/WO1989000374A1/en
Priority to US07/438,409 priority patent/US5139924A/en
Publication of SE8702704L publication Critical patent/SE8702704L/sv
Publication of SE458248B publication Critical patent/SE458248B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
SE8702704A 1987-06-30 1987-06-30 Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid tillverkning av moensterkort SE458248B (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE8702704A SE458248B (sv) 1987-06-30 1987-06-30 Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid tillverkning av moensterkort
EP88906177A EP0367785A1 (en) 1987-06-30 1988-06-17 A method for producing a circuit board and a circuit-board preform for use in carrying out the method
PCT/SE1988/000336 WO1989000374A1 (en) 1987-06-30 1988-06-17 A method for producing a circuit board and a circuit-board preform for use in carrying out the method
US07/438,409 US5139924A (en) 1987-06-30 1988-06-17 Method for producing a circuit board and a circuit-board preform for use in carrying out the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8702704A SE458248B (sv) 1987-06-30 1987-06-30 Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid tillverkning av moensterkort

Publications (3)

Publication Number Publication Date
SE8702704D0 SE8702704D0 (sv) 1987-06-30
SE8702704L true SE8702704L (sv) 1988-12-31
SE458248B SE458248B (sv) 1989-03-06

Family

ID=20369023

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8702704A SE458248B (sv) 1987-06-30 1987-06-30 Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid tillverkning av moensterkort

Country Status (4)

Country Link
US (1) US5139924A (sv)
EP (1) EP0367785A1 (sv)
SE (1) SE458248B (sv)
WO (1) WO1989000374A1 (sv)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100205497B1 (ko) * 1997-04-08 1999-07-01 윤종용 모듈용 기판 지지용 받침대 및 그를 이용한 스크린 프린트 방법
US6353190B1 (en) 1998-10-09 2002-03-05 Sumitomo Wiring Systems, Ltd. Lattice-shaped circuit board
US6360435B1 (en) * 1999-08-25 2002-03-26 Qualcomm Incorporated Bidirectional interface tool for PWB development
JP3694200B2 (ja) * 1999-10-29 2005-09-14 株式会社オートネットワーク技術研究所 バスバーの接続構造
DE10259634B4 (de) * 2002-12-18 2008-02-21 Qimonda Ag Verfahren zur Herstellung von Kontakten auf einem Wafer
EP2716437B1 (de) * 2012-10-04 2020-04-29 Magna Steyr Fahrzeugtechnik AG & Co KG Verwendung eines Verbundbauteilsmit mit elektrischen Leitungen

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1143957A (en) * 1965-07-13 1969-02-26 Int Computers Ltd Improvements in or relating to electrical circuit structures
CA919819A (en) * 1967-04-05 1973-01-23 P. Burr Robert Electric wiring assemblies
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
US4544801A (en) * 1982-06-28 1985-10-01 International Business Machines Corporation Circuit board including multiple wire photosensitive adhesive
US4427478A (en) * 1982-06-28 1984-01-24 International Business Machines Corporation Process for making an encapsulated circuit board and products made thereby
US4528261A (en) * 1983-03-28 1985-07-09 E. I. Du Pont De Nemours And Company Prelamination, imagewise exposure of photohardenable layer in process for sensitizing, registering and exposing circuit boards
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
US4642160A (en) * 1985-08-12 1987-02-10 Interconnect Technology Inc. Multilayer circuit board manufacturing
US4667404A (en) * 1985-09-30 1987-05-26 Microelectronics Center Of North Carolina Method of interconnecting wiring planes

Also Published As

Publication number Publication date
US5139924A (en) 1992-08-18
SE8702704D0 (sv) 1987-06-30
SE458248B (sv) 1989-03-06
WO1989000374A1 (en) 1989-01-12
EP0367785A1 (en) 1990-05-16

Similar Documents

Publication Publication Date Title
ATE270491T1 (de) Verfahren zum herstellen einer gegen störstrahlung abgeschirmten gedruckten leiterplatte
ATE63191T1 (de) Verfahren und beschichtungsmittel zum aufbringen elektrisch leitender druckbilder auf isolierende substrate.
ATE45902T1 (de) Serienloetsystem.
ATE207689T1 (de) Verfahren zur herstellung von abstandshaltern auf einer elektrischen leiterplatte
SE8702704L (sv) Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid genomfoerande av saettet
IT1195120B (it) Procedimento per la fabbricazione di strutture dicroiche d antenna
DE3586422D1 (de) Elektrisch leitende kupferschichten und verfahren zur herstellung derselben.
DE3688255D1 (de) Verfahren zur herstellung von mehrschichtleiterplatten.
JPS57155819A (en) Printed circuit mounted with resonator and method of producing printed circuit
ES514171A0 (es) "procedimiento para la fabricacion de placas de circuitos que contienen en estado integrado resistencias electricas y-o lugares de contactos de conmutacion".
DE59004181D1 (de) Aus Kupfer- und Keramikschichten bestehendes Substrat für Leiterplatten elektrischer Schaltungen.
JPS57180155A (en) Vessel for electronic circuit
DE3785358D1 (de) Vorrichtung und verfahren zur herstellung eines gestempelten substrats.
JPS5636147A (en) Semiconductor device and its manufacture
DE3885457D1 (de) Verfahren zum Herstellen von durchkontaktierten Leiterplatten mit sehr kleinen oder keinen Löträndern um die Durchkontaktierungslöcher.
WO1990012482A3 (en) Printed circuit boards
SU374776A1 (ru) ВСЕСОЮЗНАЯШ^НИ^-^ТГтег''.-:-?;,;^; LSI I ut*'' ;..*!..•;;!•', .-^ -}.;•;;';,
JPS54104564A (en) Method of producing printed circuit board having electronic component elements on internal layer
JPS6464292A (en) Manufacture of printed board
FR2426334A1 (fr) Dispositif de connexion de semi-conducteurs et son procede de fabrication
FR2647294B1 (fr) Procede de soudage de composants electriques sur un circuit conducteur imprime sur un substrat metallise isole
CH630221GA3 (en) Electronic device, method for producing it, and use of same
FR2412226A1 (fr) Procede de fabrication d'un module electronique pour piece d'horlogerie et module electronique obtenu par la mise en oeuvre de ce procede
NL7805359A (en) Semiconductor device with insulating layer on substrate - has printed wiring with additional metallic lead on power supply bus=bars
JPS6480097A (en) Manufacture of printed wiring board

Legal Events

Date Code Title Description
NAL Patent in force

Ref document number: 8702704-1

Format of ref document f/p: F

NUG Patent has lapsed

Ref document number: 8702704-1

Format of ref document f/p: F