SE8702704L - Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid genomfoerande av saettet - Google Patents
Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid genomfoerande av saettetInfo
- Publication number
- SE8702704L SE8702704L SE8702704A SE8702704A SE8702704L SE 8702704 L SE8702704 L SE 8702704L SE 8702704 A SE8702704 A SE 8702704A SE 8702704 A SE8702704 A SE 8702704A SE 8702704 L SE8702704 L SE 8702704L
- Authority
- SE
- Sweden
- Prior art keywords
- locations
- conductor paths
- pct
- interruptions
- substrate material
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8702704A SE458248B (sv) | 1987-06-30 | 1987-06-30 | Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid tillverkning av moensterkort |
EP88906177A EP0367785A1 (en) | 1987-06-30 | 1988-06-17 | A method for producing a circuit board and a circuit-board preform for use in carrying out the method |
PCT/SE1988/000336 WO1989000374A1 (en) | 1987-06-30 | 1988-06-17 | A method for producing a circuit board and a circuit-board preform for use in carrying out the method |
US07/438,409 US5139924A (en) | 1987-06-30 | 1988-06-17 | Method for producing a circuit board and a circuit-board preform for use in carrying out the method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8702704A SE458248B (sv) | 1987-06-30 | 1987-06-30 | Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid tillverkning av moensterkort |
Publications (3)
Publication Number | Publication Date |
---|---|
SE8702704D0 SE8702704D0 (sv) | 1987-06-30 |
SE8702704L true SE8702704L (sv) | 1988-12-31 |
SE458248B SE458248B (sv) | 1989-03-06 |
Family
ID=20369023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8702704A SE458248B (sv) | 1987-06-30 | 1987-06-30 | Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid tillverkning av moensterkort |
Country Status (4)
Country | Link |
---|---|
US (1) | US5139924A (sv) |
EP (1) | EP0367785A1 (sv) |
SE (1) | SE458248B (sv) |
WO (1) | WO1989000374A1 (sv) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100205497B1 (ko) * | 1997-04-08 | 1999-07-01 | 윤종용 | 모듈용 기판 지지용 받침대 및 그를 이용한 스크린 프린트 방법 |
DE69929384T2 (de) | 1998-10-09 | 2006-08-31 | Sumitomo Wiring Systems, Ltd., Yokkaichi | Gitterleiterplatte |
US6360435B1 (en) * | 1999-08-25 | 2002-03-26 | Qualcomm Incorporated | Bidirectional interface tool for PWB development |
JP3694200B2 (ja) * | 1999-10-29 | 2005-09-14 | 株式会社オートネットワーク技術研究所 | バスバーの接続構造 |
DE10259634B4 (de) * | 2002-12-18 | 2008-02-21 | Qimonda Ag | Verfahren zur Herstellung von Kontakten auf einem Wafer |
EP2716437B1 (de) * | 2012-10-04 | 2020-04-29 | Magna Steyr Fahrzeugtechnik AG & Co KG | Verwendung eines Verbundbauteilsmit mit elektrischen Leitungen |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1143957A (en) * | 1965-07-13 | 1969-02-26 | Int Computers Ltd | Improvements in or relating to electrical circuit structures |
CA919819A (en) * | 1967-04-05 | 1973-01-23 | P. Burr Robert | Electric wiring assemblies |
US3674914A (en) * | 1968-02-09 | 1972-07-04 | Photocircuits Corp | Wire scribed circuit boards and method of manufacture |
US4427478A (en) * | 1982-06-28 | 1984-01-24 | International Business Machines Corporation | Process for making an encapsulated circuit board and products made thereby |
US4544801A (en) * | 1982-06-28 | 1985-10-01 | International Business Machines Corporation | Circuit board including multiple wire photosensitive adhesive |
US4528261A (en) * | 1983-03-28 | 1985-07-09 | E. I. Du Pont De Nemours And Company | Prelamination, imagewise exposure of photohardenable layer in process for sensitizing, registering and exposing circuit boards |
US4915983A (en) * | 1985-06-10 | 1990-04-10 | The Foxboro Company | Multilayer circuit board fabrication process |
US4642160A (en) * | 1985-08-12 | 1987-02-10 | Interconnect Technology Inc. | Multilayer circuit board manufacturing |
US4667404A (en) * | 1985-09-30 | 1987-05-26 | Microelectronics Center Of North Carolina | Method of interconnecting wiring planes |
-
1987
- 1987-06-30 SE SE8702704A patent/SE458248B/sv not_active IP Right Cessation
-
1988
- 1988-06-17 EP EP88906177A patent/EP0367785A1/en not_active Withdrawn
- 1988-06-17 WO PCT/SE1988/000336 patent/WO1989000374A1/en not_active Application Discontinuation
- 1988-06-17 US US07/438,409 patent/US5139924A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5139924A (en) | 1992-08-18 |
SE8702704D0 (sv) | 1987-06-30 |
SE458248B (sv) | 1989-03-06 |
EP0367785A1 (en) | 1990-05-16 |
WO1989000374A1 (en) | 1989-01-12 |
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