ATE45902T1 - Serienloetsystem. - Google Patents

Serienloetsystem.

Info

Publication number
ATE45902T1
ATE45902T1 AT86301061T AT86301061T ATE45902T1 AT E45902 T1 ATE45902 T1 AT E45902T1 AT 86301061 T AT86301061 T AT 86301061T AT 86301061 T AT86301061 T AT 86301061T AT E45902 T1 ATE45902 T1 AT E45902T1
Authority
AT
Austria
Prior art keywords
soldering system
series soldering
series
electronic components
circuit boards
Prior art date
Application number
AT86301061T
Other languages
English (en)
Inventor
Matthias F Comerford
Original Assignee
Hollis Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hollis Automation Inc filed Critical Hollis Automation Inc
Application granted granted Critical
Publication of ATE45902T1 publication Critical patent/ATE45902T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Arc Welding In General (AREA)
  • Heat Treatment Of Articles (AREA)
AT86301061T 1985-02-21 1986-02-17 Serienloetsystem. ATE45902T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/703,735 US4600137A (en) 1985-02-21 1985-02-21 Method and apparatus for mass soldering with subsequent reflow soldering
EP86301061A EP0193321B1 (de) 1985-02-21 1986-02-17 Serienlötsystem

Publications (1)

Publication Number Publication Date
ATE45902T1 true ATE45902T1 (de) 1989-09-15

Family

ID=24826572

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86301061T ATE45902T1 (de) 1985-02-21 1986-02-17 Serienloetsystem.

Country Status (10)

Country Link
US (1) US4600137A (de)
EP (1) EP0193321B1 (de)
JP (1) JPS62502111A (de)
KR (1) KR870700443A (de)
CN (1) CN1003346B (de)
AT (1) ATE45902T1 (de)
BR (1) BR8605482A (de)
CA (1) CA1235823A (de)
DE (1) DE3665274D1 (de)
WO (1) WO1986004848A1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3419974A1 (de) * 1984-05-29 1985-12-05 Ernst 6983 Kreuzwertheim Hohnerlein Heizvorrichtung fuer eine transportstrasse
US4805831A (en) * 1986-04-28 1989-02-21 International Business Machines Corporation Bonding method
US4836435A (en) * 1986-05-12 1989-06-06 International Business Machines Corporation Component self alignment
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus
WO1989000905A1 (en) * 1987-08-06 1989-02-09 Gyrex Corporation Printed circuit board solder coating method and apparatus
US5046658A (en) * 1989-07-27 1991-09-10 At&T Bell Laboratories Method and apparatus for soldering articles
US5121874A (en) * 1989-11-22 1992-06-16 Electrovert Ltd. Shield gas wave soldering
US5048746A (en) * 1989-12-08 1991-09-17 Electrovert Ltd. Tunnel for fluxless soldering
US5230460A (en) * 1990-06-13 1993-07-27 Electrovert Ltd. High volume convection preheater for wave soldering
US5228614A (en) * 1990-07-09 1993-07-20 Electrovert Ltd. Solder nozzle with gas knife jet
ZA915965B (en) * 1990-07-30 1992-04-29 South Africa Ind Dev Corp Attaching integrated circuits to circuit boards
DE4342633A1 (de) * 1993-12-14 1995-06-22 Helmut Walter Leicht Vorrichtung zum Entfernen von unerwünschtem Lot vom Lötgut in einer Lötanlage
JP3241251B2 (ja) * 1994-12-16 2001-12-25 キヤノン株式会社 電子放出素子の製造方法及び電子源基板の製造方法
DE19511041A1 (de) * 1995-03-25 1996-09-26 Thomas Schwarz Verfahren zum Entlöten von Elektronikplatinen
IT1288846B1 (it) * 1996-02-07 1998-09-25 Cga Comp Gen Allumino Spa Assemblato per scambio calore e rispettivo processo ed impianto di produzione
US5794837A (en) * 1996-11-25 1998-08-18 Delco Electronics Corporation Directional flow control device for a wave soldering apparatus
KR100231152B1 (ko) * 1996-11-26 1999-11-15 윤종용 인쇄회로기판 상에 집적회로를 실장하기 위한실장방법
KR100242024B1 (ko) * 1997-03-13 2000-03-02 윤종용 집적회로 실장방법
JP3352385B2 (ja) 1997-03-21 2002-12-03 キヤノン株式会社 電子源基板およびそれを用いた電子装置の製造方法
US6164515A (en) * 1998-02-17 2000-12-26 Soltec B.V. Movable selective debridging apparatus and method of debridging soldered joints on printed circuit boards using same
US6168065B1 (en) * 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
NL1009214C2 (nl) * 1998-05-19 1999-12-07 Soltec Bv Reflowoven.
JP2002043734A (ja) * 2000-07-24 2002-02-08 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法およびその装置
EP1259101A4 (de) * 2000-09-26 2003-04-09 Matsushita Electric Ind Co Ltd Schwallötvorrichtung und -methode
DE10055178C1 (de) * 2000-11-08 2002-06-27 Vacuumschmelze Gmbh & Co Kg Verfahren zum Kontaktieren eines Wicklungsdrahtes einer Spule mit einem Anschlussstift
JP3867768B2 (ja) * 2001-03-16 2007-01-10 セイコーエプソン株式会社 ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置
JP2002329956A (ja) * 2001-04-27 2002-11-15 Ricoh Co Ltd はんだ付け方法および該はんだ付け方法を用いて製造した電子回路基板ならびに電子機器
US20040000574A1 (en) * 2002-03-08 2004-01-01 Haruo Watanabe Solder applying method and solder applying apparatus
US6768083B2 (en) 2002-09-19 2004-07-27 Speedline Technologies, Inc. Reflow soldering apparatus and method for selective infrared heating
DE102005032135A1 (de) * 2005-07-07 2007-01-18 Endress + Hauser Gmbh + Co. Kg Verfahren zum Löten einer Leiterplatte mit bleifreier Lotpaste in einem Reflow-Lötofen, Leiterplatte für solch ein Verfahren und Reflow-Lötofen
TWI268189B (en) * 2006-02-03 2006-12-11 Quanta Comp Inc Wave solder apparatus
DE102006035528A1 (de) * 2006-07-27 2008-01-31 Endress + Hauser Gmbh + Co. Kg Verfahren und Wellenlötanlage zum Löten von Bauteilen auf Ober- und Unterseite einer Leiterplatte
DE102012112546A1 (de) * 2012-12-18 2014-06-18 Endress + Hauser Gmbh + Co. Kg Verfahren zur Herstellung von mischbestückten Leiterplatten
WO2016042660A1 (ja) * 2014-09-19 2016-03-24 富士機械製造株式会社 電子部品実装システム
US10064289B2 (en) * 2016-04-26 2018-08-28 Ccl Label, Inc. High speed solder deposition and reflow for a printed flexible electronic medium
RU2698306C2 (ru) * 2018-04-04 2019-08-26 Акционерное общество "Информационные спутниковые системы" имени академика М.Ф. Решетнёва" Способ поверхностного монтажа электрорадиоизделий радиоэлектронной аппаратуры

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3500536A (en) * 1966-11-17 1970-03-17 Burroughs Corp Process for finishing solder joints on a circuit board
US3724418A (en) * 1971-08-20 1973-04-03 Lain J Mc Solder coating apparatus
US3948212A (en) * 1972-03-30 1976-04-06 Robert Bosch G.M.B.H. Coating apparatus
JPS50158550A (de) * 1974-06-12 1975-12-22
US4187974A (en) * 1978-03-13 1980-02-12 Western Electric Company, Inc. Condensation soldering facility
US4401253A (en) * 1978-04-18 1983-08-30 Cooper Industries, Inc. Mass soldering system
US4208002A (en) * 1978-08-18 1980-06-17 Hollis Engineering, Inc. Wave soldering system
US4410126A (en) * 1978-10-12 1983-10-18 Cooper Industries, Inc. Mass soldering system
US4402448A (en) * 1978-10-12 1983-09-06 Cooper Industries, Inc. Mass soldering system
DE3064754D1 (en) * 1979-07-09 1983-10-13 Electrovert Ltd Method and apparatus for vapour phase soldering
JPS6051939B2 (ja) * 1981-06-02 1985-11-16 権士 近藤 噴流式はんだ槽
US4446358A (en) * 1981-12-15 1984-05-01 Cooper Industries, Inc. Preheater for use in mass soldering apparatus
US4451000A (en) * 1982-06-11 1984-05-29 Hollis Engineering, Inc. Soldering apparatus exhaust system
US4515304A (en) * 1982-09-27 1985-05-07 Northern Telecom Limited Mounting of electronic components on printed circuit boards
US4466791A (en) * 1982-10-27 1984-08-21 At&T Technologies, Inc. Single vapor condensation soldering facility
US4460414A (en) * 1983-10-31 1984-07-17 Scm Corporation Solder paste and vehicle therefor

Also Published As

Publication number Publication date
KR870700443A (ko) 1987-12-29
JPS62502111A (ja) 1987-08-20
DE3665274D1 (en) 1989-10-05
CN86101014A (zh) 1986-09-24
BR8605482A (pt) 1987-04-22
EP0193321A3 (en) 1987-06-03
WO1986004848A1 (en) 1986-08-28
EP0193321B1 (de) 1989-08-30
CN1003346B (zh) 1989-02-15
CA1235823A (en) 1988-04-26
EP0193321A2 (de) 1986-09-03
US4600137A (en) 1986-07-15

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee