JPS5562795A - Method of and device for soldering printed circuit board - Google Patents

Method of and device for soldering printed circuit board

Info

Publication number
JPS5562795A
JPS5562795A JP13371678A JP13371678A JPS5562795A JP S5562795 A JPS5562795 A JP S5562795A JP 13371678 A JP13371678 A JP 13371678A JP 13371678 A JP13371678 A JP 13371678A JP S5562795 A JPS5562795 A JP S5562795A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
soldering printed
soldering
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13371678A
Other languages
Japanese (ja)
Other versions
JPS5721880B2 (en
Inventor
Mitsutaka Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13371678A priority Critical patent/JPS5562795A/en
Publication of JPS5562795A publication Critical patent/JPS5562795A/en
Publication of JPS5721880B2 publication Critical patent/JPS5721880B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP13371678A 1978-11-01 1978-11-01 Method of and device for soldering printed circuit board Granted JPS5562795A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13371678A JPS5562795A (en) 1978-11-01 1978-11-01 Method of and device for soldering printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13371678A JPS5562795A (en) 1978-11-01 1978-11-01 Method of and device for soldering printed circuit board

Publications (2)

Publication Number Publication Date
JPS5562795A true JPS5562795A (en) 1980-05-12
JPS5721880B2 JPS5721880B2 (en) 1982-05-10

Family

ID=15111224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13371678A Granted JPS5562795A (en) 1978-11-01 1978-11-01 Method of and device for soldering printed circuit board

Country Status (1)

Country Link
JP (1) JPS5562795A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58140662U (en) * 1982-03-17 1983-09-21 富士通株式会社 Printed board warpage prevention mechanism
JPS5929492A (en) * 1982-08-10 1984-02-16 三洋電機株式会社 Substrate backup device for automatic electronic part mounting machine

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990603U (en) * 1982-12-08 1984-06-19 株式会社クボタ Hydraulic work equipment lifting device
JPS6338776A (en) * 1986-07-31 1988-02-19 Teijin Seiki Co Ltd Check valve formed with orifice

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58140662U (en) * 1982-03-17 1983-09-21 富士通株式会社 Printed board warpage prevention mechanism
JPS5929492A (en) * 1982-08-10 1984-02-16 三洋電機株式会社 Substrate backup device for automatic electronic part mounting machine
JPH0377679B2 (en) * 1982-08-10 1991-12-11 Sanyo Electric Co

Also Published As

Publication number Publication date
JPS5721880B2 (en) 1982-05-10

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