JPS5562795A - Method of and device for soldering printed circuit board - Google Patents
Method of and device for soldering printed circuit boardInfo
- Publication number
- JPS5562795A JPS5562795A JP13371678A JP13371678A JPS5562795A JP S5562795 A JPS5562795 A JP S5562795A JP 13371678 A JP13371678 A JP 13371678A JP 13371678 A JP13371678 A JP 13371678A JP S5562795 A JPS5562795 A JP S5562795A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- soldering printed
- soldering
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13371678A JPS5562795A (en) | 1978-11-01 | 1978-11-01 | Method of and device for soldering printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13371678A JPS5562795A (en) | 1978-11-01 | 1978-11-01 | Method of and device for soldering printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5562795A true JPS5562795A (en) | 1980-05-12 |
JPS5721880B2 JPS5721880B2 (en) | 1982-05-10 |
Family
ID=15111224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13371678A Granted JPS5562795A (en) | 1978-11-01 | 1978-11-01 | Method of and device for soldering printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5562795A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58140662U (en) * | 1982-03-17 | 1983-09-21 | 富士通株式会社 | Printed board warpage prevention mechanism |
JPS5929492A (en) * | 1982-08-10 | 1984-02-16 | 三洋電機株式会社 | Substrate backup device for automatic electronic part mounting machine |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5990603U (en) * | 1982-12-08 | 1984-06-19 | 株式会社クボタ | Hydraulic work equipment lifting device |
JPS6338776A (en) * | 1986-07-31 | 1988-02-19 | Teijin Seiki Co Ltd | Check valve formed with orifice |
-
1978
- 1978-11-01 JP JP13371678A patent/JPS5562795A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58140662U (en) * | 1982-03-17 | 1983-09-21 | 富士通株式会社 | Printed board warpage prevention mechanism |
JPS5929492A (en) * | 1982-08-10 | 1984-02-16 | 三洋電機株式会社 | Substrate backup device for automatic electronic part mounting machine |
JPH0377679B2 (en) * | 1982-08-10 | 1991-12-11 | Sanyo Electric Co |
Also Published As
Publication number | Publication date |
---|---|
JPS5721880B2 (en) | 1982-05-10 |
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