NL7805359A - Semiconductor device with insulating layer on substrate - has printed wiring with additional metallic lead on power supply bus=bars - Google Patents
Semiconductor device with insulating layer on substrate - has printed wiring with additional metallic lead on power supply bus=barsInfo
- Publication number
- NL7805359A NL7805359A NL7805359A NL7805359A NL7805359A NL 7805359 A NL7805359 A NL 7805359A NL 7805359 A NL7805359 A NL 7805359A NL 7805359 A NL7805359 A NL 7805359A NL 7805359 A NL7805359 A NL 7805359A
- Authority
- NL
- Netherlands
- Prior art keywords
- power supply
- substrate
- semiconductor device
- insulating layer
- printed wiring
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A semiconductor device is used which consists of a substrate with circuit elements on parts of the surface. The surface is covered with an insulating layer with holes to expose sections of the circuits. The printed wiring (4) is used to link circuit elements and incorporates a power supply line (2). There is an additional metallic lead (3) which for the main part coincides with the power supply lead. It is narrower than the power supply lead (2). It is applied by a precipitation process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7805359A NL185883C (en) | 1978-05-18 | 1978-05-18 | SEMICONDUCTOR DEVICE. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7805359A NL185883C (en) | 1978-05-18 | 1978-05-18 | SEMICONDUCTOR DEVICE. |
Publications (3)
Publication Number | Publication Date |
---|---|
NL7805359A true NL7805359A (en) | 1979-11-20 |
NL185883B NL185883B (en) | 1990-03-01 |
NL185883C NL185883C (en) | 1990-08-01 |
Family
ID=19830852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7805359A NL185883C (en) | 1978-05-18 | 1978-05-18 | SEMICONDUCTOR DEVICE. |
Country Status (1)
Country | Link |
---|---|
NL (1) | NL185883C (en) |
-
1978
- 1978-05-18 NL NL7805359A patent/NL185883C/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
NL185883C (en) | 1990-08-01 |
NL185883B (en) | 1990-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2097998B (en) | Mounting of integrated circuits | |
GB2264389B (en) | Power semiconductor device | |
GB1269592A (en) | Sub-element for electronic circuit board | |
TW535480B (en) | Printed wiring board and method of producing the same | |
ATE31376T1 (en) | DEVICE TO PREVENT DAMAGE TO MODULES OR TRACKS ON A CIRCUIT BOARD. | |
JPS52114971A (en) | Device for mounting lead electronic parts to printed circuit substrate | |
FR2426334A1 (en) | Semiconductor device with insulating layer on substrate - has printed wiring with additional metallic lead on power supply bus=bars | |
JPS5277684A (en) | Exeternal wiring of integrated circuit | |
NL7805359A (en) | Semiconductor device with insulating layer on substrate - has printed wiring with additional metallic lead on power supply bus=bars | |
JPS57155819A (en) | Printed circuit mounted with resonator and method of producing printed circuit | |
DE3377454D1 (en) | Method and apparatus for the selective and self-adjusting deposition of metal layers and application of this method | |
DE3130159C2 (en) | ||
SE8702704L (en) | SET FOR MANUFACTURE OF A PATTERN CARD AND DEVICE FOR USE IN IMPLEMENTATION OF THE SET | |
JPS53147263A (en) | Method of soldering wiring substrate of electronic part | |
JPS5643746A (en) | Lead-less hybrid integrated circuit parts | |
JPS57180155A (en) | Vessel for electronic circuit | |
JPS6464292A (en) | Manufacture of printed board | |
JPS528473A (en) | Method of manufacturing printed wiring board using tinnnickel alloy plated on substrate as etching gist | |
JPS6448493A (en) | Manufacture of flexible printed wiring board | |
ES2006071A6 (en) | Cladding of substrates with thick metal circuit patterns | |
JPS5355971A (en) | Engagement method and electronic device using said method | |
James | Improved manufacture of printed circuit conductors by a partially additive process | |
JPS52147084A (en) | Production of semiconductor device | |
JPS6457795A (en) | Manufacture of thick film circuit device | |
JPS6455295A (en) | Integrated circuit device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A1B | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
A85 | Still pending on 85-01-01 | ||
V1 | Lapsed because of non-payment of the annual fee |