DE3443789A1 - Elektrische leitende klebstoffmasse - Google Patents

Elektrische leitende klebstoffmasse

Info

Publication number
DE3443789A1
DE3443789A1 DE19843443789 DE3443789A DE3443789A1 DE 3443789 A1 DE3443789 A1 DE 3443789A1 DE 19843443789 DE19843443789 DE 19843443789 DE 3443789 A DE3443789 A DE 3443789A DE 3443789 A1 DE3443789 A1 DE 3443789A1
Authority
DE
Germany
Prior art keywords
particles
resin
electrically conductive
solvent
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19843443789
Other languages
German (de)
English (en)
Other versions
DE3443789C2 (https=
Inventor
Taro Yokohama Kanagawa Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osaka Soda Co Ltd
Original Assignee
Osaka Soda Co Ltd Osaka
Osaka Soda Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP22705783A external-priority patent/JPS60121604A/ja
Priority claimed from JP19513984A external-priority patent/JPS6174205A/ja
Application filed by Osaka Soda Co Ltd Osaka, Osaka Soda Co Ltd filed Critical Osaka Soda Co Ltd Osaka
Publication of DE3443789A1 publication Critical patent/DE3443789A1/de
Application granted granted Critical
Publication of DE3443789C2 publication Critical patent/DE3443789C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE19843443789 1983-12-02 1984-11-30 Elektrische leitende klebstoffmasse Granted DE3443789A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22705783A JPS60121604A (ja) 1983-12-02 1983-12-02 異方導電性組成物
JP19513984A JPS6174205A (ja) 1984-09-17 1984-09-17 異方導電性組成物

Publications (2)

Publication Number Publication Date
DE3443789A1 true DE3443789A1 (de) 1985-06-27
DE3443789C2 DE3443789C2 (https=) 1991-04-25

Family

ID=26508946

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843443789 Granted DE3443789A1 (de) 1983-12-02 1984-11-30 Elektrische leitende klebstoffmasse

Country Status (3)

Country Link
US (1) US4696764A (https=)
DE (1) DE3443789A1 (https=)
GB (1) GB2152060B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
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DE3814764A1 (de) * 1988-04-30 1989-11-09 Felten & Guilleaume Energie Trockenmittel zum entfernen der letzten wasserreste aus einem verschlossenen fertigprodukt, insbesondere einem elektrischen geraet
EP0721209A3 (en) * 1995-01-06 1998-09-09 Matsushita Electric Industrial Co., Ltd Method of testing semiconductor devices and conductive adhesive thereby used
US7524893B2 (en) 2004-02-13 2009-04-28 Harima Chemicals, Inc. Conductive adhesive

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US4880570A (en) * 1986-03-31 1989-11-14 Harris Corporation Electroconductive adhesive
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JPH0628269B2 (ja) * 1987-07-15 1994-04-13 株式会社巴川製紙所 ダイボンデイング用接着テ−プ
DE3802881A1 (de) * 1987-11-16 1989-05-24 Utz Ag Georg Mikrowellenaktivierbarer schmelzklebstoff
US5011872A (en) * 1987-12-21 1991-04-30 The Carborudum Company Thermally conductive ceramic/polymer composites
CA1331245C (en) * 1987-12-21 1994-08-02 Carol Ann Latham Thermally conductive ceramic/polymer composites
JPH0817269B2 (ja) * 1988-05-11 1996-02-21 株式会社ソフィアシステムズ 回路ライター
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JP5217639B2 (ja) * 2008-05-30 2013-06-19 富士通株式会社 コア基板およびプリント配線板
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KR20170105873A (ko) 2016-03-10 2017-09-20 삼성에스디아이 주식회사 리튬 이차 전지용 양극 활물질 조성물, 및 이를 포함하는 양극 및 리튬 이차 전지
FR3054146B1 (fr) 2016-07-19 2018-07-13 Compagnie Generale Des Etablissements Michelin Procede de depot d'un revetement adhesif au metal, hydrophobe et electriquement conducteur
JP1617872S (https=) * 2018-01-12 2018-11-12
JP1617873S (https=) * 2018-01-12 2018-11-12
TW202328265A (zh) * 2021-10-26 2023-07-16 日商阪田油墨股份有限公司 導電性樹脂組成物、導電膜、導電性油墨、導電性接著劑及電路連接材料
CN114656161B (zh) * 2022-03-24 2023-03-14 南京航空航天大学 一种低逾渗电热-超疏水薄膜的制备方法

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3814764A1 (de) * 1988-04-30 1989-11-09 Felten & Guilleaume Energie Trockenmittel zum entfernen der letzten wasserreste aus einem verschlossenen fertigprodukt, insbesondere einem elektrischen geraet
DE3814764C2 (de) * 1988-04-30 1998-07-23 Felten & Guilleaume Energie Verwendung von ein galvanisches Element bildenden Stoffen zum Entfernen von letzten Wasserresten aus einem verschlossenen Fertigprodukt
EP0721209A3 (en) * 1995-01-06 1998-09-09 Matsushita Electric Industrial Co., Ltd Method of testing semiconductor devices and conductive adhesive thereby used
US5940679A (en) * 1995-01-06 1999-08-17 Matsushita Electric Industrial Co., Ltd. Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage
US7524893B2 (en) 2004-02-13 2009-04-28 Harima Chemicals, Inc. Conductive adhesive

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GB8430356D0 (en) 1985-01-09
GB2152060A (en) 1985-07-31
DE3443789C2 (https=) 1991-04-25
US4696764A (en) 1987-09-29
GB2152060B (en) 1987-05-13

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