DE3381604D1 - Verfahren zum herstellen einer halbleiteranordnung mit einem basisgebiet, das einen tiefen bereich aufweist. - Google Patents
Verfahren zum herstellen einer halbleiteranordnung mit einem basisgebiet, das einen tiefen bereich aufweist.Info
- Publication number
- DE3381604D1 DE3381604D1 DE8383105802T DE3381604T DE3381604D1 DE 3381604 D1 DE3381604 D1 DE 3381604D1 DE 8383105802 T DE8383105802 T DE 8383105802T DE 3381604 T DE3381604 T DE 3381604T DE 3381604 D1 DE3381604 D1 DE 3381604D1
- Authority
- DE
- Germany
- Prior art keywords
- area
- producing
- semiconductor arrangement
- deep
- base area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/914—Polysilicon containing oxygen, nitrogen, or carbon, e.g. sipos
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Bipolar Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/392,870 US4443931A (en) | 1982-06-28 | 1982-06-28 | Method of fabricating a semiconductor device with a base region having a deep portion |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3381604D1 true DE3381604D1 (de) | 1990-06-28 |
Family
ID=23552352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8383105802T Expired - Fee Related DE3381604D1 (de) | 1982-06-28 | 1983-06-14 | Verfahren zum herstellen einer halbleiteranordnung mit einem basisgebiet, das einen tiefen bereich aufweist. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4443931A (de) |
EP (1) | EP0097866B1 (de) |
JP (1) | JPS5917283A (de) |
DE (1) | DE3381604D1 (de) |
IE (1) | IE56041B1 (de) |
MX (1) | MX153211A (de) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4983535A (en) * | 1981-10-15 | 1991-01-08 | Siliconix Incorporated | Vertical DMOS transistor fabrication process |
US4598461A (en) * | 1982-01-04 | 1986-07-08 | General Electric Company | Methods of making self-aligned power MOSFET with integral source-base short |
US4809047A (en) * | 1983-09-06 | 1989-02-28 | General Electric Company | Insulated-gate semiconductor device with improved base-to-source electrode short and method of fabricating said short |
JPS6076144A (ja) * | 1983-10-03 | 1985-04-30 | Matsushita Electronics Corp | 半導体装置の製造方法 |
DE3402867A1 (de) * | 1984-01-27 | 1985-08-01 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement mit kontaktloch |
JPS62501111A (ja) * | 1984-05-02 | 1987-04-30 | インタ−ナショナル・スタンダ−ド・エレクトリック・コ−ポレイション | 半導体装置および配置 |
IT1214805B (it) * | 1984-08-21 | 1990-01-18 | Ates Componenti Elettron | Spositivi a semiconduttore con giunprocesso per la fabbricazione di dizioni planari a concentrazione di carica variabile e ad altissima tensione di breakdown |
US4639754A (en) * | 1985-02-25 | 1987-01-27 | Rca Corporation | Vertical MOSFET with diminished bipolar effects |
GB2173037A (en) * | 1985-03-29 | 1986-10-01 | Philips Electronic Associated | Semiconductor devices employing conductivity modulation |
EP0202477A3 (de) * | 1985-04-24 | 1988-04-20 | General Electric Company | Verfahren zum Herstellen elektrischer Kurzschlüsse zwischen benachbarten Gebieten in einer Halbleiteranordnung mit isoliertem Gate |
JPS6252966A (ja) * | 1985-09-02 | 1987-03-07 | Toshiba Corp | 半導体装置の製造方法 |
US4809045A (en) * | 1985-09-30 | 1989-02-28 | General Electric Company | Insulated gate device |
DE3689680T2 (de) * | 1985-09-30 | 1994-06-23 | Toshiba Kawasaki Kk | Mittels Steuerelektrode abschaltbarer Thyristor mit unabhängigen Zünd-/Lösch-Kontrolltransistoren. |
US4963951A (en) * | 1985-11-29 | 1990-10-16 | General Electric Company | Lateral insulated gate bipolar transistors with improved latch-up immunity |
EP0229362B1 (de) * | 1986-01-10 | 1993-03-17 | General Electric Company | Halbleitervorrichtung und Methode zur Herstellung |
IT1204243B (it) * | 1986-03-06 | 1989-03-01 | Sgs Microelettronica Spa | Procedimento autoallineato per la fabbricazione di celle dmos di piccole dimensioni e dispositivi mos ottenuti mediante detto procedimento |
US4798810A (en) * | 1986-03-10 | 1989-01-17 | Siliconix Incorporated | Method for manufacturing a power MOS transistor |
US4816882A (en) * | 1986-03-10 | 1989-03-28 | Siliconix Incorporated | Power MOS transistor with equipotential ring |
US5262336A (en) * | 1986-03-21 | 1993-11-16 | Advanced Power Technology, Inc. | IGBT process to produce platinum lifetime control |
US4716126A (en) * | 1986-06-05 | 1987-12-29 | Siliconix Incorporated | Fabrication of double diffused metal oxide semiconductor transistor |
FR2605800B1 (fr) * | 1986-10-24 | 1989-01-13 | Thomson Semiconducteurs | Procede de fabrication d'un composant mos |
JP2552880B2 (ja) * | 1986-11-12 | 1996-11-13 | シリコニックス・インコーポレイテッド | 垂直dmosセル構造 |
US4883767A (en) * | 1986-12-05 | 1989-11-28 | General Electric Company | Method of fabricating self aligned semiconductor devices |
DE3790800C2 (de) * | 1986-12-05 | 1999-08-12 | Gen Electric | Verfahren zum Herstellen selbstausgerichteter Halbleiterelemente |
US4794432A (en) * | 1987-01-27 | 1988-12-27 | General Electric Company | Mosfet structure with substrate coupled source |
JPH01225164A (ja) * | 1988-03-03 | 1989-09-08 | Fuji Electric Co Ltd | 絶縁ゲートmosfetの製造方法 |
US4857983A (en) * | 1987-05-19 | 1989-08-15 | General Electric Company | Monolithically integrated semiconductor device having bidirectional conducting capability and method of fabrication |
US4888627A (en) * | 1987-05-19 | 1989-12-19 | General Electric Company | Monolithically integrated lateral insulated gate semiconductor device |
US4847671A (en) * | 1987-05-19 | 1989-07-11 | General Electric Company | Monolithically integrated insulated gate semiconductor device |
US4795716A (en) * | 1987-06-19 | 1989-01-03 | General Electric Company | Method of making a power IC structure with enhancement and/or CMOS logic |
EP0330122B1 (de) * | 1988-02-24 | 1995-10-25 | Siemens Aktiengesellschaft | Verfahren zur Herstellung eines durch Feldeffekt steuerbaren Bipolartransistors |
EP0340445B1 (de) * | 1988-04-22 | 1993-08-25 | Asea Brown Boveri Ag | Abschaltbares Leistungshalbleiterbauelement |
US4969027A (en) * | 1988-07-18 | 1990-11-06 | General Electric Company | Power bipolar transistor device with integral antisaturation diode |
US4853345A (en) * | 1988-08-22 | 1989-08-01 | Delco Electronics Corporation | Process for manufacture of a vertical DMOS transistor |
US5034346A (en) * | 1988-08-25 | 1991-07-23 | Micrel Inc. | Method for forming shorting contact for semiconductor which allows for relaxed alignment tolerance |
JP2752385B2 (ja) * | 1988-08-29 | 1998-05-18 | ニスコ株式会社 | ドリル型リベット |
US5072266A (en) | 1988-12-27 | 1991-12-10 | Siliconix Incorporated | Trench DMOS power transistor with field-shaping body profile and three-dimensional geometry |
US5119162A (en) * | 1989-02-10 | 1992-06-02 | Texas Instruments Incorporated | Integrated power DMOS circuit with protection diode |
US4931408A (en) * | 1989-10-13 | 1990-06-05 | Siliconix Incorporated | Method of fabricating a short-channel low voltage DMOS transistor |
IT1236994B (it) * | 1989-12-29 | 1993-05-12 | Sgs Thomson Microelectronics | Processo per la fabbricazione di dispositivi semiconduttori mos di potenza e dispositivi con esso ottenuti |
US5171705A (en) * | 1991-11-22 | 1992-12-15 | Supertex, Inc. | Self-aligned structure and process for DMOS transistor |
US5248627A (en) * | 1992-03-20 | 1993-09-28 | Siliconix Incorporated | Threshold adjustment in fabricating vertical dmos devices |
JP3417013B2 (ja) * | 1993-10-18 | 2003-06-16 | 株式会社デンソー | 絶縁ゲート型バイポーラトランジスタ |
US5378641A (en) * | 1993-02-22 | 1995-01-03 | Micron Semiconductor, Inc. | Electrically conductive substrate interconnect continuity region and method of forming same with an angled implant |
US5858845A (en) * | 1994-09-27 | 1999-01-12 | Micron Technology, Inc. | Electrically conductive substrate interconnect continuity region and method of forming same with an angled implant |
US5395776A (en) * | 1993-05-12 | 1995-03-07 | At&T Corp. | Method of making a rugged DMOS device |
US5471075A (en) * | 1994-05-26 | 1995-11-28 | North Carolina State University | Dual-channel emitter switched thyristor with trench gate |
US5488236A (en) * | 1994-05-26 | 1996-01-30 | North Carolina State University | Latch-up resistant bipolar transistor with trench IGFET and buried collector |
JP3279151B2 (ja) * | 1995-10-23 | 2002-04-30 | トヨタ自動車株式会社 | 半導体装置及びその製造方法 |
JP3464382B2 (ja) * | 1998-05-18 | 2003-11-10 | ローム株式会社 | 縦型二重拡散mosfetの製造方法 |
EP0993033A1 (de) * | 1998-10-06 | 2000-04-12 | STMicroelectronics S.r.l. | Gate-Isolierungsstruktur für Leistungs-MOS-Transistor und Herstellungsverfahren dafür |
DE19958234C2 (de) * | 1999-12-03 | 2001-12-20 | Infineon Technologies Ag | Anordnung eines Gebietes zur elektrischen Isolation erster aktiver Zellen von zweiten aktiven Zellen |
EP1531497A1 (de) * | 2003-11-17 | 2005-05-18 | ABB Technology AG | IGBT Kathodendesign mit verbessertem Sicherheitsbetriebsbereich |
CN111999632B (zh) * | 2019-05-27 | 2023-02-03 | 合肥晶合集成电路股份有限公司 | Pn结样品的获取方法 |
CN110176401B (zh) * | 2019-06-13 | 2022-08-30 | 深圳市锐骏半导体股份有限公司 | 一种降低vdmos生产成本的方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4181542A (en) * | 1976-10-25 | 1980-01-01 | Nippon Gakki Seizo Kabushiki Kaisha | Method of manufacturing junction field effect transistors |
JPS5432982A (en) * | 1977-08-18 | 1979-03-10 | Mitsubishi Electric Corp | Manufacture of gate turn off thyristor |
JPS54161894A (en) * | 1978-06-13 | 1979-12-21 | Toshiba Corp | Manufacture of semiconductor device |
US4199380A (en) * | 1978-11-13 | 1980-04-22 | Motorola, Inc. | Integrated circuit method |
FR2460542A1 (fr) * | 1979-06-29 | 1981-01-23 | Thomson Csf | Transistor a effet de champ vertical de puissance pour hautes frequences et procede de realisation d'un tel transistor |
US4344081A (en) * | 1980-04-14 | 1982-08-10 | Supertex, Inc. | Combined DMOS and a vertical bipolar transistor device and fabrication method therefor |
US4345265A (en) * | 1980-04-14 | 1982-08-17 | Supertex, Inc. | MOS Power transistor with improved high-voltage capability |
JPS5726467A (en) * | 1980-07-24 | 1982-02-12 | Fujitsu Ltd | Manufacture of semiconductor device |
US4593302B1 (en) * | 1980-08-18 | 1998-02-03 | Int Rectifier Corp | Process for manufacture of high power mosfet laterally distributed high carrier density beneath the gate oxide |
-
1982
- 1982-06-28 US US06/392,870 patent/US4443931A/en not_active Expired - Lifetime
-
1983
- 1983-05-24 IE IE1223/83A patent/IE56041B1/en not_active IP Right Cessation
- 1983-06-14 EP EP83105802A patent/EP0097866B1/de not_active Expired - Lifetime
- 1983-06-14 DE DE8383105802T patent/DE3381604D1/de not_active Expired - Fee Related
- 1983-06-27 MX MX197821A patent/MX153211A/es unknown
- 1983-06-28 JP JP58115291A patent/JPS5917283A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
MX153211A (es) | 1986-08-22 |
EP0097866B1 (de) | 1990-05-23 |
US4443931A (en) | 1984-04-24 |
IE831223L (en) | 1983-12-28 |
EP0097866A2 (de) | 1984-01-11 |
IE56041B1 (en) | 1991-03-27 |
EP0097866A3 (en) | 1986-10-08 |
JPS5917283A (ja) | 1984-01-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8128 | New person/name/address of the agent |
Representative=s name: SIEB, R., DIPL.-CHEM. DR.RER.NAT., PAT.-ANW., 6947 |
|
8339 | Ceased/non-payment of the annual fee |