DE3301673A1 - Elektrisches bzw. elektronisches mehrschichtbauelement - Google Patents

Elektrisches bzw. elektronisches mehrschichtbauelement

Info

Publication number
DE3301673A1
DE3301673A1 DE19833301673 DE3301673A DE3301673A1 DE 3301673 A1 DE3301673 A1 DE 3301673A1 DE 19833301673 DE19833301673 DE 19833301673 DE 3301673 A DE3301673 A DE 3301673A DE 3301673 A1 DE3301673 A1 DE 3301673A1
Authority
DE
Germany
Prior art keywords
components
capacitor
electrical
substrate
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19833301673
Other languages
German (de)
English (en)
Inventor
Hermann 6902 Sandhausen Birnbreier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Germany
Original Assignee
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Germany filed Critical BBC Brown Boveri AG Germany
Priority to DE19833301673 priority Critical patent/DE3301673A1/de
Priority to GB08400678A priority patent/GB2133933B/en
Priority to FR8400795A priority patent/FR2539915A1/fr
Priority to JP59006389A priority patent/JPS59138359A/ja
Publication of DE3301673A1 publication Critical patent/DE3301673A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10045—Mounted network component having plural terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
DE19833301673 1983-01-20 1983-01-20 Elektrisches bzw. elektronisches mehrschichtbauelement Withdrawn DE3301673A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19833301673 DE3301673A1 (de) 1983-01-20 1983-01-20 Elektrisches bzw. elektronisches mehrschichtbauelement
GB08400678A GB2133933B (en) 1983-01-20 1984-01-11 Electrical or electronic multi-layer circuit component
FR8400795A FR2539915A1 (fr) 1983-01-20 1984-01-19 Composant electrique ou electronique a plusieurs couches
JP59006389A JPS59138359A (ja) 1983-01-20 1984-01-19 多層素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833301673 DE3301673A1 (de) 1983-01-20 1983-01-20 Elektrisches bzw. elektronisches mehrschichtbauelement

Publications (1)

Publication Number Publication Date
DE3301673A1 true DE3301673A1 (de) 1984-07-26

Family

ID=6188658

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833301673 Withdrawn DE3301673A1 (de) 1983-01-20 1983-01-20 Elektrisches bzw. elektronisches mehrschichtbauelement

Country Status (4)

Country Link
JP (1) JPS59138359A (enrdf_load_stackoverflow)
DE (1) DE3301673A1 (enrdf_load_stackoverflow)
FR (1) FR2539915A1 (enrdf_load_stackoverflow)
GB (1) GB2133933B (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4031289A1 (de) * 1990-10-04 1992-04-09 Telefunken Electronic Gmbh Oszillator
DE4304437A1 (de) * 1993-02-13 1994-08-18 Ego Elektro Blanc & Fischer Integrierte Schaltung, insbesondere für Berührungsschalter, sowie Verfahren zur Herstellung einer integrierten Schaltung
DE19930609A1 (de) * 1999-04-13 2000-11-30 Delta Electronics Inc Verfahren und Anordnung zur Frequenzeinstellung eines spannungsgesteuerten Oszillators
US6184579B1 (en) 1998-07-07 2001-02-06 R-Amtech International, Inc. Double-sided electronic device
DE10004649A1 (de) * 2000-02-03 2001-08-09 Infineon Technologies Ag Verfahren und Vorrichtung zur Anpassung/Abstimmung von Signallaufzeiten auf Leitungssystemen oder Netzen zwischen integrierten Schaltungen

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2231728A (en) * 1989-05-16 1990-11-21 Lucas Ind Plc Trimming a variable resistor
EP0725981B1 (en) * 1994-08-25 2002-01-02 National Semiconductor Corporation Component stacking in multi-chip semiconductor packages
SE516152C2 (sv) 1999-03-17 2001-11-26 Ericsson Telefon Ab L M Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning
DE10310434A1 (de) 2003-03-11 2004-09-30 Krone Gmbh Verfahren zum HF-Abstimmen einer elektrischen Anordnung sowie eine hierzu geeignete Leiterplatte
US8202128B2 (en) 2008-11-25 2012-06-19 Adc Gmbh Telecommunications jack with adjustable crosstalk compensation
CN107734848B (zh) * 2017-11-16 2020-03-13 珠海市魅族科技有限公司 印制电路板封装结构、制备方法、pcb板和终端

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2417466A1 (de) * 1974-04-10 1975-10-23 Draloric Electronic Abgleichbares elektrisches bauelement
GB1420825A (en) * 1972-05-08 1976-01-14 Siemens Ag Electrical rc elements
US3988824A (en) * 1972-05-22 1976-11-02 Hewlett-Packard Company Method for manufacturing thin film circuits
CH589996A5 (enrdf_load_stackoverflow) * 1974-08-30 1977-07-29 Ebauches Sa
DE7602001U1 (de) * 1976-01-26 1978-05-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Abgleichbarer widerstand
DE2903025A1 (de) * 1979-01-26 1980-07-31 Siemens Ag Rc-netzwerk

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3268773A (en) * 1963-11-21 1966-08-23 Union Carbide Corp Laminate of alternate conductive and dielectric layers
DE2247279A1 (de) * 1972-09-27 1974-04-04 Siemens Ag Verfahren zur kontaktierung und/oder verdrahtung von elektrischen bauelementen
DE2622324C3 (de) * 1976-05-19 1980-10-02 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung eines genau abgeglichenen elektrischen Netzwerkes
US4301439A (en) * 1978-12-26 1981-11-17 Electro Materials Corp. Of America Film type resistor and method of producing same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1420825A (en) * 1972-05-08 1976-01-14 Siemens Ag Electrical rc elements
US3988824A (en) * 1972-05-22 1976-11-02 Hewlett-Packard Company Method for manufacturing thin film circuits
DE2417466A1 (de) * 1974-04-10 1975-10-23 Draloric Electronic Abgleichbares elektrisches bauelement
CH589996A5 (enrdf_load_stackoverflow) * 1974-08-30 1977-07-29 Ebauches Sa
DE7602001U1 (de) * 1976-01-26 1978-05-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Abgleichbarer widerstand
DE2903025A1 (de) * 1979-01-26 1980-07-31 Siemens Ag Rc-netzwerk
GB2040591A (en) * 1979-01-26 1980-08-28 Siemens Ag Rc-networks

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4031289A1 (de) * 1990-10-04 1992-04-09 Telefunken Electronic Gmbh Oszillator
DE4304437A1 (de) * 1993-02-13 1994-08-18 Ego Elektro Blanc & Fischer Integrierte Schaltung, insbesondere für Berührungsschalter, sowie Verfahren zur Herstellung einer integrierten Schaltung
US6184579B1 (en) 1998-07-07 2001-02-06 R-Amtech International, Inc. Double-sided electronic device
DE19930609A1 (de) * 1999-04-13 2000-11-30 Delta Electronics Inc Verfahren und Anordnung zur Frequenzeinstellung eines spannungsgesteuerten Oszillators
DE10004649A1 (de) * 2000-02-03 2001-08-09 Infineon Technologies Ag Verfahren und Vorrichtung zur Anpassung/Abstimmung von Signallaufzeiten auf Leitungssystemen oder Netzen zwischen integrierten Schaltungen
EP1130408A3 (de) * 2000-02-03 2006-04-12 Infineon Technologies AG Verfahren und Vorrichtung zur Anpassung/Abstimmung von Signallaufzeiten auf Leitungssystemen oder Netzen zwischen integrierten Schaltungen

Also Published As

Publication number Publication date
GB2133933A (en) 1984-08-01
JPS59138359A (ja) 1984-08-08
FR2539915A1 (fr) 1984-07-27
FR2539915B3 (enrdf_load_stackoverflow) 1985-05-17
GB8400678D0 (en) 1984-02-15
GB2133933B (en) 1987-01-28

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Legal Events

Date Code Title Description
8101 Request for examination as to novelty
8105 Search report available
8127 New person/name/address of the applicant

Owner name: BBC BROWN BOVERI AG, 6800 MANNHEIM, DE

8139 Disposal/non-payment of the annual fee