GB2133933A - Electrical or electronic multi-layer circuit component - Google Patents

Electrical or electronic multi-layer circuit component Download PDF

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Publication number
GB2133933A
GB2133933A GB08400678A GB8400678A GB2133933A GB 2133933 A GB2133933 A GB 2133933A GB 08400678 A GB08400678 A GB 08400678A GB 8400678 A GB8400678 A GB 8400678A GB 2133933 A GB2133933 A GB 2133933A
Authority
GB
United Kingdom
Prior art keywords
component
substrate
component part
capacitor
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB08400678A
Other versions
GB8400678D0 (en
GB2133933B (en
Inventor
Hermann Birnbreier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri France SA
Original Assignee
BBC Brown Boveri France SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri France SA filed Critical BBC Brown Boveri France SA
Publication of GB8400678D0 publication Critical patent/GB8400678D0/en
Publication of GB2133933A publication Critical patent/GB2133933A/en
Application granted granted Critical
Publication of GB2133933B publication Critical patent/GB2133933B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10045—Mounted network component having plural terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

An electrical or electronic multi- layer component in thin-film, thick-film or hybrid technology includes a substrate 1, a first component part 2 disposed on the substrate and a second component part 5 having a portion disposed directly on the first component part and a further portion disposed directly on the substrate. The component parts are a capacitor 2 and a resistor 5, the further portion of the resistor comprising trimming bars 8 which may be selectively severed by a laser beam. Alternatively the component parts may be diodes or transistors. <IMAGE>

Description

SPECIFICATION Electrical or electronic multi-layer component The invention relates to an electrical or electronic multi-layer component, in thin-film, thick-film or layer, or hybrid technology, wherein several individual components such as resistors, capacitors, diodes and transistors are disposed on a substrate.
Such a multi-layer component is known, for example, from the publication by Moschwitzer and Lunze, entitled "Halbleiterelektronik" (Semiconductor Electronics), published by Huthig Verlag, Heidelberg, 1980, pages 433 and 437. For example, resistances, capacitances, diodes and transistors can be produced in thin-film or thickfilm technology. The individual components are generally disposed side by side on a substrate. In order to increase the packaging density, it is also possible to place several components on top of each other, such as a resistor on top of a capacitor. During the calibration of the component disposed on top, for example, during the trimming of a resistor which is disposed on top by means of a laser beam, there is a danger that the component below will be damaged.
It is accordingly an object of the invention to provide an electrical or electronic component which overcomes the hereinafore-mentioned disadvantages of the heretofore-known devices of this general type, and which permits the calibration of the individual components of a multi-layer device without causing damage to the other components.
With the foregoing and other objects in view, there is provided, in accordance with the invention, an electrical or electronic multi-layer component in thin-film, thick-film or hybrid technology, comprising a substrate, a first component part disposed on the substrate, and a second component part having a portion disposed directly on the substrate.
In accordance with another feature of the invention, the first component part is a capacitor, the second component part is a resistor, and the portion of the second component part is in the form of a plurality of trimming bars disposed directly on the substrate adjacent the capacitor for calibrating the resistor.
In accordance with a further feature of the invention, there is provided, in an electrical or electronic multi-layer component in thin-film, thick-film or hybrid technology, having a plurality of component parts from the group consisting of resistors, capacitors, diodes and transistors disposed on to of each other on a substrate, the improvement comprising a portion of at least one of the component parts being disposed directly on the substrate.
In accordance with a concomitant feature of the invention, a capacitor is disposed on the substrate, the at least one component part is a resistor, and the portion of the at least one comDonent part is in the form of a plurality of trimming bars disposed directly on the substrate adjacent the capacitor for calibrating the resistor.
The advantages obtained by practising the invention are especially the capability of calibrating an individual component in a simple manner in the region which is not overlapped without destroying or doing damage to another component of the multi-layer device. The multilayer device therefore has an advantageously high packaging density.
In accordance with an added feature of the invention, the portion of the second component part disposed directly on the substrate is uncovered.
In accordance with an additional feature of the invention, the at least one component part includes another portion disposed on another of the component parts.
Other features which are considered as characteristic for the invention are set forth in the appended claims.
Although the invention is illustrated and described herein as embodied in electrical or electronic multi-layer component, it is nevertheless not intended to be limited to the details shown, since various modifications and structural changes may be made without departing from the spirit of the invention and within the scope and range of equivalents of the claims.
The construction and method of operation of the invention, however, together with additional objects and advantages thereof will be best understood from the following description of specific embodiments when read in connection with the accompanying drawings, in which: FIG. 1 is a fragmentary, diagrammatic top plan view of a multi-layer component; and FIG. 2 is a cross-sectional view of the multilayer component of FIG. 1.
Referring now to the figures of the drawing in detail, and first particularly to FIG. 1 thereof, there is seen a top plan view of a multi-layer component in which a plate-shaped capacitor 2 is applied onto a substrate 1 of a material such as ALP03 with a thin-film technique; the process is performed, for example, by a vapor deposition technique in a vacuum with the aid of masks. The capacitor 2 has two coated terminals with contact surfaces designated with reference numerals 3 and 4.
A resistor 5 formed of meander-shaped pathways is vapor deposited on the capacitor 2.
The two terminals of the resistor 5 provided with contact surfaces are designated with reference numerals 6 and 7. For trimming the resistor 5, several trimming bars 8 are vapor deposited directly onto the substrate laterally adjacent the capacitor 2.
During the trimming or calibration of the resistor 5, one or more of the trimming bars 8 are severed by means of a laser beam, in order to obtain the desired ohmic resistance value. The laser beam destroys the corresponding trimming bar 8 without damaging the capacitor 2.
In FIG. 2 is a cross-sectional view of the multi layer component. In particular, the construction of the capacitor 2 which is vapor deposited onto the substrate 1 can be seen. The capacitor is formed of a metallic base layer 2a, an insulating layer 2b serving as a dielectric, a metallic cover layer 2c and an outer insulating layer 2d for electrically separating the capacitor 2 from the resistor 5 which is vapor deposited thereon.
Instead of the structure described above, formed of a capacitor 2 and a resistor 5, other structures can be made permitting adjustment or calibration without damage, such as a transistor and a resistor, a diode and a resistor, or a transistor and a capacitor, etc. Calibration is generally not only possible with resistors in the above-described manner but also with capacitors, for example.
Beside structure formed of two superimposed components, structure formed of three or more superimposed components are also possible. In these variations, parts of the individual components are not always covered by other components but instead may lie directly on the substrate.
Besides the above-mentioned thin-film teachnique, the multi-layer components can also be produced by means of a thick-film or layer technique or a hybrid technique.
The foregoing is a description corresponding, in substance, to German application P 33 01 673.9, dated January 20, 1983, international priority of which is being claimed for the instant application, and which is hereby made part of this application.
Any material discrepancies between the foregoing specification and the specification of the aforementioned corresponding German application are to be resolved in favor of the latter.

Claims (14)

Claims
1. Electrical or electronic multi-layer component in thin-film, thick-film or hybrid technology, comprising a substrate, a first component part disposed on said substrate, and a second component part having a portion disposed directly on said substrate.
2. Electrical or electronic multi-layer component in thin-film, thick-film or hybrid technology, comprising a substrate, a first component part disposed on said substrate, and a second component part having a portion disposed on said first component part and a portion disposed directly on said substrate.
3. In an electrical or electronic multi-layer component in thin-film, thick-film or hybrid technology, having a plurality of component parts from the group consisting of resistors, capacitors, diodes and transistors disposed on top of each other on a substrate, the improvement comprising a portion of at least one of the component parts being disposed directly on the substrate.
4. Component according to claim 1, wherein said portion of said second component part disposed directly on said substrate is uncovered.
5. Component according to claim 2, wherein said portion of said second component part disposed directly on said substrate is uncovered.
6. Component according to claim 3, wherein the at least one component part includes another portion disposed on another of the component parts.
7. Component according to claim 3, wherein the portion of the at least one component disposed directly on the substrate if uncovered.
8. Component according to claim 6, wherein the portion of the at least one component disposed directly on the substrate is uncovered.
9. Component according to claim 1, wherein said first component part is a capacitor, said second component part is a resistor, and said portion of said second component part is in the form of a plurality of trimming bars disposed directly on said substrate adjacent said capacitor for calibrating said resistor.
10. Component according to claim 4, wherein said first component part is a capacitor, said second component part is a resistor, and said portion of said second component part is in the form of a plurality of trimming bars disposed directly on said substrate adjacent said capacitor for calibrating said resistor.
1 Component according to claim 9, wherein said second component part includes another portion disposed on said capacitor.
12. Component according to claim 10, wherein said second component part includes another portion disposed on said capacitor.
13. Component according to Claim 3, wherein a capacitor is disposed on said substrate, said at least one component part is a resistor, and said portion of said at least one component part is in the form of a plurality of trimming bars disposed directly on said substrate adjacent said capacitor for calibrating said resistor.
14. Component according to claim 13, wherein said resistor includes another portion disposed on said capacitor.
GB08400678A 1983-01-20 1984-01-11 Electrical or electronic multi-layer circuit component Expired GB2133933B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833301673 DE3301673A1 (en) 1983-01-20 1983-01-20 ELECTRICAL OR ELECTRONIC MULTILAYER COMPONENT

Publications (3)

Publication Number Publication Date
GB8400678D0 GB8400678D0 (en) 1984-02-15
GB2133933A true GB2133933A (en) 1984-08-01
GB2133933B GB2133933B (en) 1987-01-28

Family

ID=6188658

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08400678A Expired GB2133933B (en) 1983-01-20 1984-01-11 Electrical or electronic multi-layer circuit component

Country Status (4)

Country Link
JP (1) JPS59138359A (en)
DE (1) DE3301673A1 (en)
FR (1) FR2539915A1 (en)
GB (1) GB2133933B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2231728A (en) * 1989-05-16 1990-11-21 Lucas Ind Plc Trimming a variable resistor
WO1996006459A1 (en) * 1994-08-25 1996-02-29 National Semiconductor Corporation Component stacking in multi-chip semiconductor packages
WO2000055870A1 (en) * 1999-03-17 2000-09-21 Telefonaktiebolaget Lm Ericsson (Publ) An arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming
WO2004082343A1 (en) * 2003-03-11 2004-09-23 Adc Gmbh Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor
US8202128B2 (en) 2008-11-25 2012-06-19 Adc Gmbh Telecommunications jack with adjustable crosstalk compensation

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4031289A1 (en) * 1990-10-04 1992-04-09 Telefunken Electronic Gmbh Oscillator with amplifier, and feedback elements - has flat capacitor as frequency determining and equalising element
DE4304437A1 (en) * 1993-02-13 1994-08-18 Ego Elektro Blanc & Fischer Integrated circuit, in particular for contact switches, and method for producing an integrated circuit
RU2190284C2 (en) 1998-07-07 2002-09-27 Закрытое акционерное общество "Техно-ТМ" Two-sided electronic device
US6188295B1 (en) * 1999-04-13 2001-02-13 Delta Electronics, Inc. Frequency adjustments by patterning micro-strips to form serially connected capacitors or inductor-capacitor (LC) Circuit
DE10004649A1 (en) * 2000-02-03 2001-08-09 Infineon Technologies Ag Tuning method for signal delays on bus systems or networks between quick memory modules, involves selectively separating strip conductor run from certain capacitive load structures of printed circuit board
CN107734848B (en) * 2017-11-16 2020-03-13 珠海市魅族科技有限公司 Printed circuit board packaging structure, manufacturing method, PCB and terminal

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1082489A (en) * 1963-11-21 1967-09-06 Union Carbide Corp Laminate comprising film resistor and capacitor components
GB1439657A (en) * 1972-09-27 1976-06-16 Siemens Ag Production of electrical components
GB1521236A (en) * 1976-05-19 1978-08-16 Siemens Ag Stacked foil electrical circuit component assemblies and methods of manufacturing such components
GB2038562A (en) * 1978-12-26 1980-07-23 Electro Materials Trimming film resistors
GB2040591A (en) * 1979-01-26 1980-08-28 Siemens Ag Rc-networks

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2222546C3 (en) * 1972-05-08 1979-10-31 Siemens Ag, 1000 Berlin Und 8000 Muenchen Electrical RC component
US3988824A (en) * 1972-05-22 1976-11-02 Hewlett-Packard Company Method for manufacturing thin film circuits
CH589996A5 (en) * 1974-08-30 1977-07-29 Ebauches Sa
DE7602001U1 (en) * 1976-01-26 1978-05-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt COMPARABLE RESISTANCE

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1082489A (en) * 1963-11-21 1967-09-06 Union Carbide Corp Laminate comprising film resistor and capacitor components
GB1439657A (en) * 1972-09-27 1976-06-16 Siemens Ag Production of electrical components
GB1521236A (en) * 1976-05-19 1978-08-16 Siemens Ag Stacked foil electrical circuit component assemblies and methods of manufacturing such components
GB2038562A (en) * 1978-12-26 1980-07-23 Electro Materials Trimming film resistors
GB2040591A (en) * 1979-01-26 1980-08-28 Siemens Ag Rc-networks

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2231728A (en) * 1989-05-16 1990-11-21 Lucas Ind Plc Trimming a variable resistor
WO1996006459A1 (en) * 1994-08-25 1996-02-29 National Semiconductor Corporation Component stacking in multi-chip semiconductor packages
US5629563A (en) * 1994-08-25 1997-05-13 National Semiconductor Corporation Component stacking in multi-chip semiconductor packages
WO2000055870A1 (en) * 1999-03-17 2000-09-21 Telefonaktiebolaget Lm Ericsson (Publ) An arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming
US6664481B1 (en) 1999-03-17 2003-12-16 Telefonaktiebolaget Lm Ericsson Arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming
WO2004082343A1 (en) * 2003-03-11 2004-09-23 Adc Gmbh Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor
US7401402B2 (en) 2003-03-11 2008-07-22 Adc Gmbh Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor
US7856709B2 (en) 2003-03-11 2010-12-28 Adc Gmbh Method for high-frequency tuning an electrical device
US8413323B2 (en) 2003-03-11 2013-04-09 Adc Gmbh Method for high-frequency tuning an electrical device
US8202128B2 (en) 2008-11-25 2012-06-19 Adc Gmbh Telecommunications jack with adjustable crosstalk compensation

Also Published As

Publication number Publication date
FR2539915A1 (en) 1984-07-27
GB8400678D0 (en) 1984-02-15
GB2133933B (en) 1987-01-28
JPS59138359A (en) 1984-08-08
DE3301673A1 (en) 1984-07-26
FR2539915B3 (en) 1985-05-17

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PCNP Patent ceased through non-payment of renewal fee