DE3301673A1 - ELECTRICAL OR ELECTRONIC MULTILAYER COMPONENT - Google Patents

ELECTRICAL OR ELECTRONIC MULTILAYER COMPONENT

Info

Publication number
DE3301673A1
DE3301673A1 DE19833301673 DE3301673A DE3301673A1 DE 3301673 A1 DE3301673 A1 DE 3301673A1 DE 19833301673 DE19833301673 DE 19833301673 DE 3301673 A DE3301673 A DE 3301673A DE 3301673 A1 DE3301673 A1 DE 3301673A1
Authority
DE
Germany
Prior art keywords
components
capacitor
electrical
substrate
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19833301673
Other languages
German (de)
Inventor
Hermann 6902 Sandhausen Birnbreier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Germany
Original Assignee
Brown Boveri und Cie AG Germany
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brown Boveri und Cie AG Germany, BBC Brown Boveri AG Germany filed Critical Brown Boveri und Cie AG Germany
Priority to DE19833301673 priority Critical patent/DE3301673A1/en
Priority to GB08400678A priority patent/GB2133933B/en
Priority to JP59006389A priority patent/JPS59138359A/en
Priority to FR8400795A priority patent/FR2539915A1/en
Publication of DE3301673A1 publication Critical patent/DE3301673A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10045—Mounted network component having plural terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Description

BROWN,BOVERI S- CIE AKTIENGESELLSCHAFTBROWN, BOVERI S- CIE AKTIENGESELLSCHAFT

Mannheim 18. Jan.Mannheim Jan. 18

Mp.-Nr. 503/83
10Mp. No. 503/83
10

Elektrisches bzw. elektronisches MehrschichtbauelementElectrical or electronic multilayer component

Die Erfindung bezieht sich auf ein elektrisches bzw. elektronisches Mehrschichtbauelement gemäß dem Oberbegriff des Anspruchs 1.The invention relates to an electrical or electronic multilayer component according to the preamble of claim 1.

Ein solches Mehrschichtbauelement ist beisDieisweise aus Möschwitzer/Lunze, "Halbleiterelektronik", Hüthig-Verlag, Heidelberg, 1980, Seite H33 bis 437 bekannt. In Dünnschicht- oder Dickschicht-Technik können beispielsweise Widerstände, Kapazitäten, Dioden und Transistoren hergestellt werden. Dabei sind die einzelnen Bauelemente im allgemeinen nebeneinander auf einem Substrat angeordnet. Zur Erhöhung der Packungsdichte ist es auch möglich, mehrere Bauelemente übereinander zu legen, z.B. einen Widerstand auf einen Kondensator. Bei Abgleich des obenliegenden Bauelementes, beispielsweise beim Trimmen eines obenliegenden Widerstandes mittels eines Laserstrahles, besteht die Gefahr, das darunterliegende Bauelement zu beschädigen.Such a multi-layer component is currently off Möschwitzer / Lunze, "Semiconductor Electronics", Hüthig-Verlag, Heidelberg, 1980, page H33 to 437 known. In Thin-film or thick-film technology can be, for example, resistors, capacitors, diodes and transistors getting produced. Here are the individual components generally arranged side by side on a substrate. To increase the packing density, it is also possible Laying several components on top of each other, e.g. a resistor on a capacitor. When comparing the overhead component, for example when trimming an overhead resistor using a laser beam, there is a risk of damaging the underlying component.

Der Erfindung liegt die Aufgabe zugrunde, ein elektri-The invention is based on the object of an electrical

sches bzw. elektronisches Mehrschichtbauelement tier eingangs genannten Art anzugeben, das einen Abgleich der einzelnen Bauelemente der Mehrschichtanordnung ohne Beschädigung der weiteren Bauelemente ermöglicht.indicate ULTRASONIC or electronic multilayer component animal type mentioned above that allows an alignment of the individual components of the multi-layer assembly without damage to the other components.

Diese Aufgabe wird durch die im Anspruch 1 gekennzeichneten Merkmale gelöst.This object is achieved by the features characterized in claim 1.

Die mit der Erfindung erzielbaren Vorteile bestehen insbesondere darin, daß ein Abgleich eines einzelnen Bauelementes im nicht überlappten Bereich in einfacher Weise möglich ist, ohne dabei ein anderes Bauelement der Mehrschichtanordnung zu zerstören oder zu beschädigen. Die Mehrschichtanordnung weist vorteilhaft eine hohe Packungsdichte auf.The advantages that can be achieved with the invention are in particular that an adjustment of an individual component is possible in a simple manner in the non-overlapped area without using another component of the Destroy or damage the multilayer arrangement. The multilayer arrangement advantageously has a high Packing density.

Eine vorteilhafte Ausgestaltung der Erfindung ist im Unteranspruch gekennzeichnet.An advantageous embodiment of the invention is in Characterized subclaim.

Die Erfindung wird nachstehend anhand der in den Zeichnungen dargestellten Ausführungsform erläutert.'The invention is explained below with reference to the embodiment shown in the drawings.

Es zeigen:Show it:

Fig. 1 eine Aufsicht auf ein Mehrschichtbauelement, Fig. ? einen Schnitt durch das Mehrschichtbauelement.1 shows a plan view of a multilayer component, FIG. a section through the multilayer component.

In Fig. 1 ist eine Aufsicht auf ein Mehrschichtbauelement dargestellt. Auf ein Substrat 1 (Material z.B.In Fig. 1 is a plan view of a multilayer component shown. On a substrate 1 (material e.g.

AI2O3) ist ein Dlattenförmiger Kondensator 2 in Dünn-Schichttechnik aufgebracht, was z.B. in Aufdampftechnik im Vakuum unter Zuhilfenahme von Masken erfolgt. Die beiden mit Kontaktflächen beschichteten Anschlüsse des Kondensators 2 sind mit Bezugsziffern 3 und U bezeichnet.AI2O3) is a sheet-shaped capacitor 2 in thin-layer technology applied, which e.g. in evaporation technology in Vacuum takes place with the help of masks. the Both connections of the capacitor 2 coated with contact surfaces are denoted by reference numerals 3 and U designated.

Auf dem Kondensator ?. ist ein aus mäanderförmigen BahnenOn the capacitor ? is one made of meandering tracks

bestehender Widerstand ^ aufgedampft. Die mit Kontaktflächen versehenen beiden Anschlüsse des Widerstandes ^ sind mit Bezugsziffern 6 und 7 bezeichnet. Zum Trimmen des Widerstandes 5 sind seitlich neben dem Kondensator mehrere Trimmstege 8 direkt auf das Substrat aufgedampft. existing resistance ^ vapor-deposited. The two connections of the resistor, which are provided with contact surfaces, are denoted by reference numerals 6 and 7. To trim the resistor 5 , several trimming webs 8 are vapor-deposited directly onto the substrate next to the capacitor.

Beim Trimmen des Widerstandes S wird einer bzw. werden mehrere Trimmstege 8 mittels eines Laserstrahls aufge- ^Q trennt, um den gewünschten ohmschen Widerstandswert zu erhalten. Durch den Laserstrahl wird der entsprechende Trimmsteg 8 zerstört ohne dabei den Kondensator 2 zu beschädigen.When trimming the resistor S will be one or several trimming webs 8 separated by means of a laser beam in order to achieve the desired ohmic resistance value obtain. The corresponding trimming bar 8 is destroyed by the laser beam without closing the capacitor 2 in the process to damage.

In Fig. 2 ist ein Schnitt durch das Mehrsohichtbauelement dargestellt. Es ist insbesondere der Aufbau des auf dem Substrat 1 aufgedampften Kondensators 2 ersichtlich, bestehend aus einer Metallgrundschicht 2a, einer Isolierschicht als Dielektrikum ?b, einer Metalldeckschicht 2c und einer äußeren Isolierschicht 2d zur elektrischen Trennung des Kondensators 2 von dem aufgedampften Widerstand S.In Fig. 2 is a section through the multi-layer component shown. In particular, the structure of the capacitor 2 vapor-deposited on the substrate 1 can be seen, consisting of a metal base layer 2a, an insulating layer as a dielectric? b, a metal cover layer 2c and an outer insulating layer 2d for electrical Separation of the capacitor 2 from the vapor-deposited resistor S.

Anstelle der beschriebenen Anordnung Kondensator 2/Widerstand 5 sind auch andere Anordnungen, z.B. Transistor/Widerstand, Diode/Widerstand, Transistor/Kondensator usw. im Hinblick auf einen zerstörungsfreien Abgleich ausführbar. Abgleichungen sind allgemein nicht nur bei Widerständen, sondern auch z.B. bei Kondensatoren in der beschriebenen Weise möglich.Instead of the capacitor 2 / resistor 5 arrangement described, other arrangements, for example transistor / resistor, diode / resistor, transistor / capacitor, etc., can also be implemented with a view to non-destructive adjustment. Adjustments are generally not only possible for resistors, but also for capacitors, for example, in the manner described.

Neben den aus zwei übereinander!legenden Bauelementen bestehenden Anordnungen sind auch aus drei oder mehr übereinanderliegenden Bauelementen bestehende Ausführungen möglich, wobei auch bei diesen Varianten stets einzelne Teilstücke der Bauelemente von anderen Bauele-In addition to the two building elements laid one on top of the other Existing arrangements are also versions consisting of three or more superimposed components possible, although with these variants always individual parts of the components from other components

503/83 - 5' /503/83 - 5 '/

menten nicht überdeckt sind, sondern direkt auf dem Substrat liegen.ments are not covered, but lie directly on the substrate.

Die Mehrschichtbauelemente sind außer in der im Ausfüh-5 rungsbeispiel angeführten Dünnschichttechnik auch in Dickschioht- oder Hvbridtechnik ausführbar.The multilayer components are except in the in Ausfüh-5 The thin-film technology mentioned in the example can also be implemented in thick-film or hybrid technology.

-ζ.-ζ.

- Leerseite - Blank page

Claims (2)

503/81 f 503/81 f AnsprücheExpectations si^JElektrlsches bzw. elektronisches Mehrschichtbauelement in Dünnfilm-, Dickschicht- oder Hybridtechnik, wobei mehrere einzelne Bauelemente, wie Widerstände, Kondensatoren, Dioden und Transistoren auf ein Substrat aufgebracht sind, dadurch gekennzeichnet, daß bei einer Anordnung mehrerer Bauelemente (2,5) übereinander einzelne Teilstücke (8) der Bauelemente von anderen Bauelementen nicht überdeckt sind, sondern direkt auf dem Substrat (1) liegen.Si ^ JElektrlsches or electronic multi-layer component in thin-film, thick-film or hybrid technology, wherein several individual components such as resistors, capacitors, diodes and transistors are applied to a substrate, characterized in that in an arrangement of several components (2, 5) one above the other individual parts (8) of the components are not covered by other components, but lie directly on the substrate (1). 2. Elektrisches bzw. elektronisches Mehrschiohtbau-2. Electrical or electronic multi-layer construction element nach Anspruch 1, dadurch gekennzeichnet, daß bei einer Mehrschichtanordnung eines Widerstandes (5) und eines Kondensators (2) zum Abgleich des Widerstandes dienende Trimmstege (8) neben dem Kondensator direkt auf dem Substrat (1) liegen.element according to claim 1, characterized in that at a multilayer arrangement of a resistor (5) and a capacitor (2) for balancing the resistance serving trimming webs (8) lie next to the capacitor directly on the substrate (1).
DE19833301673 1983-01-20 1983-01-20 ELECTRICAL OR ELECTRONIC MULTILAYER COMPONENT Withdrawn DE3301673A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19833301673 DE3301673A1 (en) 1983-01-20 1983-01-20 ELECTRICAL OR ELECTRONIC MULTILAYER COMPONENT
GB08400678A GB2133933B (en) 1983-01-20 1984-01-11 Electrical or electronic multi-layer circuit component
JP59006389A JPS59138359A (en) 1983-01-20 1984-01-19 Multilayer element
FR8400795A FR2539915A1 (en) 1983-01-20 1984-01-19 MULTI-LAYER ELECTRIC OR ELECTRONIC COMPONENT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833301673 DE3301673A1 (en) 1983-01-20 1983-01-20 ELECTRICAL OR ELECTRONIC MULTILAYER COMPONENT

Publications (1)

Publication Number Publication Date
DE3301673A1 true DE3301673A1 (en) 1984-07-26

Family

ID=6188658

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833301673 Withdrawn DE3301673A1 (en) 1983-01-20 1983-01-20 ELECTRICAL OR ELECTRONIC MULTILAYER COMPONENT

Country Status (4)

Country Link
JP (1) JPS59138359A (en)
DE (1) DE3301673A1 (en)
FR (1) FR2539915A1 (en)
GB (1) GB2133933B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4031289A1 (en) * 1990-10-04 1992-04-09 Telefunken Electronic Gmbh Oscillator with amplifier, and feedback elements - has flat capacitor as frequency determining and equalising element
DE4304437A1 (en) * 1993-02-13 1994-08-18 Ego Elektro Blanc & Fischer Integrated circuit, in particular for contact switches, and method for producing an integrated circuit
DE19930609A1 (en) * 1999-04-13 2000-11-30 Delta Electronics Inc Manufacturing method for electronic device e.g. voltage controlled oscillators, involves forming structure of 3 conductive, 2 insulating layers, and connecting components on first conductive layer to third structured conductive layer
US6184579B1 (en) 1998-07-07 2001-02-06 R-Amtech International, Inc. Double-sided electronic device
DE10004649A1 (en) * 2000-02-03 2001-08-09 Infineon Technologies Ag Tuning method for signal delays on bus systems or networks between quick memory modules, involves selectively separating strip conductor run from certain capacitive load structures of printed circuit board

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2231728A (en) * 1989-05-16 1990-11-21 Lucas Ind Plc Trimming a variable resistor
EP0725981B1 (en) * 1994-08-25 2002-01-02 National Semiconductor Corporation Component stacking in multi-chip semiconductor packages
SE516152C2 (en) 1999-03-17 2001-11-26 Ericsson Telefon Ab L M Apparatus for allowing trimming on a substrate and method for making a substrate for trimming
DE10310434A1 (en) 2003-03-11 2004-09-30 Krone Gmbh Method for RF tuning of an electrical arrangement and a circuit board suitable for this
US8202128B2 (en) 2008-11-25 2012-06-19 Adc Gmbh Telecommunications jack with adjustable crosstalk compensation
CN107734848B (en) * 2017-11-16 2020-03-13 珠海市魅族科技有限公司 Printed circuit board packaging structure, manufacturing method, PCB and terminal

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DE2417466A1 (en) * 1974-04-10 1975-10-23 Draloric Electronic ADJUSTABLE ELECTRICAL COMPONENT
GB1420825A (en) * 1972-05-08 1976-01-14 Siemens Ag Electrical rc elements
US3988824A (en) * 1972-05-22 1976-11-02 Hewlett-Packard Company Method for manufacturing thin film circuits
CH589996A5 (en) * 1974-08-30 1977-07-29 Ebauches Sa
DE7602001U1 (en) * 1976-01-26 1978-05-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt COMPARABLE RESISTANCE
DE2903025A1 (en) * 1979-01-26 1980-07-31 Siemens Ag RC NETWORK

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Publication number Priority date Publication date Assignee Title
US3268773A (en) * 1963-11-21 1966-08-23 Union Carbide Corp Laminate of alternate conductive and dielectric layers
DE2247279A1 (en) * 1972-09-27 1974-04-04 Siemens Ag PROCEDURES FOR CONTACTING AND / OR WIRING ELECTRICAL COMPONENTS
DE2622324C3 (en) * 1976-05-19 1980-10-02 Siemens Ag, 1000 Berlin Und 8000 Muenchen Process for the production of a precisely balanced electrical network
US4301439A (en) * 1978-12-26 1981-11-17 Electro Materials Corp. Of America Film type resistor and method of producing same

Patent Citations (7)

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Publication number Priority date Publication date Assignee Title
GB1420825A (en) * 1972-05-08 1976-01-14 Siemens Ag Electrical rc elements
US3988824A (en) * 1972-05-22 1976-11-02 Hewlett-Packard Company Method for manufacturing thin film circuits
DE2417466A1 (en) * 1974-04-10 1975-10-23 Draloric Electronic ADJUSTABLE ELECTRICAL COMPONENT
CH589996A5 (en) * 1974-08-30 1977-07-29 Ebauches Sa
DE7602001U1 (en) * 1976-01-26 1978-05-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt COMPARABLE RESISTANCE
DE2903025A1 (en) * 1979-01-26 1980-07-31 Siemens Ag RC NETWORK
GB2040591A (en) * 1979-01-26 1980-08-28 Siemens Ag Rc-networks

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4031289A1 (en) * 1990-10-04 1992-04-09 Telefunken Electronic Gmbh Oscillator with amplifier, and feedback elements - has flat capacitor as frequency determining and equalising element
DE4304437A1 (en) * 1993-02-13 1994-08-18 Ego Elektro Blanc & Fischer Integrated circuit, in particular for contact switches, and method for producing an integrated circuit
US6184579B1 (en) 1998-07-07 2001-02-06 R-Amtech International, Inc. Double-sided electronic device
DE19930609A1 (en) * 1999-04-13 2000-11-30 Delta Electronics Inc Manufacturing method for electronic device e.g. voltage controlled oscillators, involves forming structure of 3 conductive, 2 insulating layers, and connecting components on first conductive layer to third structured conductive layer
DE10004649A1 (en) * 2000-02-03 2001-08-09 Infineon Technologies Ag Tuning method for signal delays on bus systems or networks between quick memory modules, involves selectively separating strip conductor run from certain capacitive load structures of printed circuit board
EP1130408A2 (en) * 2000-02-03 2001-09-05 Infineon Technologies AG Method and apparatus for adaptation/adjustment of the delay time of signal between integrated circuits in networks or line systems
EP1130408A3 (en) * 2000-02-03 2006-04-12 Infineon Technologies AG Method and apparatus for adaptation/adjustment of the delay time of signal between integrated circuits in networks or line systems

Also Published As

Publication number Publication date
GB8400678D0 (en) 1984-02-15
JPS59138359A (en) 1984-08-08
GB2133933A (en) 1984-08-01
FR2539915A1 (en) 1984-07-27
GB2133933B (en) 1987-01-28
FR2539915B3 (en) 1985-05-17

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