FR2539915B3 - - Google Patents
Info
- Publication number
- FR2539915B3 FR2539915B3 FR8400795A FR8400795A FR2539915B3 FR 2539915 B3 FR2539915 B3 FR 2539915B3 FR 8400795 A FR8400795 A FR 8400795A FR 8400795 A FR8400795 A FR 8400795A FR 2539915 B3 FR2539915 B3 FR 2539915B3
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10045—Mounted network component having plural terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19833301673 DE3301673A1 (en) | 1983-01-20 | 1983-01-20 | ELECTRICAL OR ELECTRONIC MULTILAYER COMPONENT |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2539915A1 FR2539915A1 (en) | 1984-07-27 |
FR2539915B3 true FR2539915B3 (en) | 1985-05-17 |
Family
ID=6188658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8400795A Granted FR2539915A1 (en) | 1983-01-20 | 1984-01-19 | MULTI-LAYER ELECTRIC OR ELECTRONIC COMPONENT |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS59138359A (en) |
DE (1) | DE3301673A1 (en) |
FR (1) | FR2539915A1 (en) |
GB (1) | GB2133933B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2231728A (en) * | 1989-05-16 | 1990-11-21 | Lucas Ind Plc | Trimming a variable resistor |
DE4031289A1 (en) * | 1990-10-04 | 1992-04-09 | Telefunken Electronic Gmbh | Oscillator with amplifier, and feedback elements - has flat capacitor as frequency determining and equalising element |
DE4304437A1 (en) * | 1993-02-13 | 1994-08-18 | Ego Elektro Blanc & Fischer | Integrated circuit, in particular for contact switches, and method for producing an integrated circuit |
WO1996006459A1 (en) * | 1994-08-25 | 1996-02-29 | National Semiconductor Corporation | Component stacking in multi-chip semiconductor packages |
RU2190284C2 (en) | 1998-07-07 | 2002-09-27 | Закрытое акционерное общество "Техно-ТМ" | Two-sided electronic device |
SE516152C2 (en) | 1999-03-17 | 2001-11-26 | Ericsson Telefon Ab L M | Apparatus for allowing trimming on a substrate and method for making a substrate for trimming |
US6188295B1 (en) * | 1999-04-13 | 2001-02-13 | Delta Electronics, Inc. | Frequency adjustments by patterning micro-strips to form serially connected capacitors or inductor-capacitor (LC) Circuit |
DE10004649A1 (en) * | 2000-02-03 | 2001-08-09 | Infineon Technologies Ag | Tuning method for signal delays on bus systems or networks between quick memory modules, involves selectively separating strip conductor run from certain capacitive load structures of printed circuit board |
DE10310434A1 (en) | 2003-03-11 | 2004-09-30 | Krone Gmbh | Method for RF tuning of an electrical arrangement and a circuit board suitable for this |
US8202128B2 (en) | 2008-11-25 | 2012-06-19 | Adc Gmbh | Telecommunications jack with adjustable crosstalk compensation |
CN107734848B (en) * | 2017-11-16 | 2020-03-13 | 珠海市魅族科技有限公司 | Printed circuit board packaging structure, manufacturing method, PCB and terminal |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3268773A (en) * | 1963-11-21 | 1966-08-23 | Union Carbide Corp | Laminate of alternate conductive and dielectric layers |
DE2222546C3 (en) * | 1972-05-08 | 1979-10-31 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Electrical RC component |
US3988824A (en) * | 1972-05-22 | 1976-11-02 | Hewlett-Packard Company | Method for manufacturing thin film circuits |
DE2247279A1 (en) * | 1972-09-27 | 1974-04-04 | Siemens Ag | PROCEDURES FOR CONTACTING AND / OR WIRING ELECTRICAL COMPONENTS |
CH589996A5 (en) * | 1974-08-30 | 1977-07-29 | Ebauches Sa | |
DE7602001U1 (en) * | 1976-01-26 | 1978-05-24 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | COMPARABLE RESISTANCE |
DE2622324C3 (en) * | 1976-05-19 | 1980-10-02 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Process for the production of a precisely balanced electrical network |
US4301439A (en) * | 1978-12-26 | 1981-11-17 | Electro Materials Corp. Of America | Film type resistor and method of producing same |
DE2903025C2 (en) * | 1979-01-26 | 1983-05-05 | Siemens AG, 1000 Berlin und 8000 München | Rc network |
-
1983
- 1983-01-20 DE DE19833301673 patent/DE3301673A1/en not_active Withdrawn
-
1984
- 1984-01-11 GB GB08400678A patent/GB2133933B/en not_active Expired
- 1984-01-19 JP JP59006389A patent/JPS59138359A/en active Pending
- 1984-01-19 FR FR8400795A patent/FR2539915A1/en active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2539915A1 (en) | 1984-07-27 |
GB8400678D0 (en) | 1984-02-15 |
GB2133933B (en) | 1987-01-28 |
JPS59138359A (en) | 1984-08-08 |
GB2133933A (en) | 1984-08-01 |
DE3301673A1 (en) | 1984-07-26 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |