JPS59138359A - 多層素子 - Google Patents

多層素子

Info

Publication number
JPS59138359A
JPS59138359A JP59006389A JP638984A JPS59138359A JP S59138359 A JPS59138359 A JP S59138359A JP 59006389 A JP59006389 A JP 59006389A JP 638984 A JP638984 A JP 638984A JP S59138359 A JPS59138359 A JP S59138359A
Authority
JP
Japan
Prior art keywords
capacitor
multilayer
resistor
substrate
trimming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59006389A
Other languages
English (en)
Japanese (ja)
Inventor
ヘルマン・ビルンブライアー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
BURAUN BOBERI UNTO CO AG
Original Assignee
BBC BROWN BOVERI and CIE
BURAUN BOBERI UNTO CO AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC BROWN BOVERI and CIE, BURAUN BOBERI UNTO CO AG filed Critical BBC BROWN BOVERI and CIE
Publication of JPS59138359A publication Critical patent/JPS59138359A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10045—Mounted network component having plural terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP59006389A 1983-01-20 1984-01-19 多層素子 Pending JPS59138359A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833301673 DE3301673A1 (de) 1983-01-20 1983-01-20 Elektrisches bzw. elektronisches mehrschichtbauelement

Publications (1)

Publication Number Publication Date
JPS59138359A true JPS59138359A (ja) 1984-08-08

Family

ID=6188658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59006389A Pending JPS59138359A (ja) 1983-01-20 1984-01-19 多層素子

Country Status (4)

Country Link
JP (1) JPS59138359A (enrdf_load_stackoverflow)
DE (1) DE3301673A1 (enrdf_load_stackoverflow)
FR (1) FR2539915A1 (enrdf_load_stackoverflow)
GB (1) GB2133933B (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8413323B2 (en) 2003-03-11 2013-04-09 Adc Gmbh Method for high-frequency tuning an electrical device
CN107734848A (zh) * 2017-11-16 2018-02-23 珠海市魅族科技有限公司 印制电路板封装结构、制备方法、pcb板和终端

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2231728A (en) * 1989-05-16 1990-11-21 Lucas Ind Plc Trimming a variable resistor
DE4031289A1 (de) * 1990-10-04 1992-04-09 Telefunken Electronic Gmbh Oszillator
DE4304437A1 (de) * 1993-02-13 1994-08-18 Ego Elektro Blanc & Fischer Integrierte Schaltung, insbesondere für Berührungsschalter, sowie Verfahren zur Herstellung einer integrierten Schaltung
EP0725981B1 (en) * 1994-08-25 2002-01-02 National Semiconductor Corporation Component stacking in multi-chip semiconductor packages
RU2190284C2 (ru) 1998-07-07 2002-09-27 Закрытое акционерное общество "Техно-ТМ" Двусторонний электронный прибор
SE516152C2 (sv) 1999-03-17 2001-11-26 Ericsson Telefon Ab L M Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning
US6188295B1 (en) * 1999-04-13 2001-02-13 Delta Electronics, Inc. Frequency adjustments by patterning micro-strips to form serially connected capacitors or inductor-capacitor (LC) Circuit
DE10004649A1 (de) * 2000-02-03 2001-08-09 Infineon Technologies Ag Verfahren und Vorrichtung zur Anpassung/Abstimmung von Signallaufzeiten auf Leitungssystemen oder Netzen zwischen integrierten Schaltungen
US8202128B2 (en) 2008-11-25 2012-06-19 Adc Gmbh Telecommunications jack with adjustable crosstalk compensation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3268773A (en) * 1963-11-21 1966-08-23 Union Carbide Corp Laminate of alternate conductive and dielectric layers
DE2222546C3 (de) * 1972-05-08 1979-10-31 Siemens Ag, 1000 Berlin Und 8000 Muenchen Elektrisches RC-Bauelement
US3988824A (en) * 1972-05-22 1976-11-02 Hewlett-Packard Company Method for manufacturing thin film circuits
DE2247279A1 (de) * 1972-09-27 1974-04-04 Siemens Ag Verfahren zur kontaktierung und/oder verdrahtung von elektrischen bauelementen
CH589996A5 (enrdf_load_stackoverflow) * 1974-08-30 1977-07-29 Ebauches Sa
DE7602001U1 (de) * 1976-01-26 1978-05-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Abgleichbarer widerstand
DE2622324C3 (de) * 1976-05-19 1980-10-02 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung eines genau abgeglichenen elektrischen Netzwerkes
US4301439A (en) * 1978-12-26 1981-11-17 Electro Materials Corp. Of America Film type resistor and method of producing same
DE2903025C2 (de) * 1979-01-26 1983-05-05 Siemens AG, 1000 Berlin und 8000 München RC-Netzwerk

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8413323B2 (en) 2003-03-11 2013-04-09 Adc Gmbh Method for high-frequency tuning an electrical device
CN107734848A (zh) * 2017-11-16 2018-02-23 珠海市魅族科技有限公司 印制电路板封装结构、制备方法、pcb板和终端
CN107734848B (zh) * 2017-11-16 2020-03-13 珠海市魅族科技有限公司 印制电路板封装结构、制备方法、pcb板和终端

Also Published As

Publication number Publication date
DE3301673A1 (de) 1984-07-26
GB2133933A (en) 1984-08-01
FR2539915A1 (fr) 1984-07-27
FR2539915B3 (enrdf_load_stackoverflow) 1985-05-17
GB8400678D0 (en) 1984-02-15
GB2133933B (en) 1987-01-28

Similar Documents

Publication Publication Date Title
JPS59138359A (ja) 多層素子
KR910008749A (ko) 칩 형성 표면 장착 전기저항 및 그 제조방법
KR930022530A (ko) 반도체 장치 및 그 제조방법
JP2668375B2 (ja) 回路部品の電極製造方法
JPS63208252A (ja) 半導体装置用パツケ−ジ
JPS6231192A (ja) ハイブリツド集積回路
JPS61134053A (ja) 半導体集積回路装置
JPS61104637A (ja) 半導体装置
JPS60154654A (ja) 半導体装置
JPS5847713Y2 (ja) 感熱記録ヘッド用薄膜混成回路
JPH0350616Y2 (enrdf_load_stackoverflow)
JPS60942U (ja) 半導体装置
JPS59107104U (ja) 固体膜抵抗素子
JPS58140144A (ja) 半導体装置
JPS58191449A (ja) 多層配線構造
JPS61208890A (ja) 混成集積回路
JPS6127302U (ja) タンタル薄膜抵抗配線基板
KR940016735A (ko) 반도체 소자의 금속 배선 제조 방법
JPS6122370U (ja) 光起電力素子
JPS60115287A (ja) 混成集積回路装置
JPS58210612A (ja) 複合電子部品
JPS6310550U (enrdf_load_stackoverflow)
JPS5999478U (ja) 多層回路板の配線構造
JPS59107102U (ja) チツプ抵抗素子
JPS63164395A (ja) 印刷配線板