DE3225782A1 - Elektronisches bauteil - Google Patents

Elektronisches bauteil

Info

Publication number
DE3225782A1
DE3225782A1 DE19823225782 DE3225782A DE3225782A1 DE 3225782 A1 DE3225782 A1 DE 3225782A1 DE 19823225782 DE19823225782 DE 19823225782 DE 3225782 A DE3225782 A DE 3225782A DE 3225782 A1 DE3225782 A1 DE 3225782A1
Authority
DE
Germany
Prior art keywords
electronic component
component according
connections
chip
inductance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19823225782
Other languages
German (de)
English (en)
Other versions
DE3225782C2 (en, 2012
Inventor
Hiroshi Satou
Tadao Akita Yahagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
Tdk Electronics Co Ltd Tokyo
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10118981U external-priority patent/JPS588914U/ja
Priority claimed from JP4054682U external-priority patent/JPS58142914U/ja
Priority claimed from JP4054482U external-priority patent/JPS58142916U/ja
Priority claimed from JP6684982U external-priority patent/JPS58170900U/ja
Application filed by Tdk Electronics Co Ltd Tokyo, TDK Corp filed Critical Tdk Electronics Co Ltd Tokyo
Publication of DE3225782A1 publication Critical patent/DE3225782A1/de
Application granted granted Critical
Publication of DE3225782C2 publication Critical patent/DE3225782C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/02—Fixed inductances of the signal type without magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/04—Arrangements of electric connections to coils, e.g. leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
DE19823225782 1981-07-09 1982-07-09 Elektronisches bauteil Granted DE3225782A1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP10118981U JPS588914U (ja) 1981-07-09 1981-07-09 チツプインダクタ−
JP4054682U JPS58142914U (ja) 1982-03-23 1982-03-23 電子部品
JP4054482U JPS58142916U (ja) 1982-03-23 1982-03-23 電子部品
JP6684982U JPS58170900U (ja) 1982-05-08 1982-05-08 チツプ状電子部品

Publications (2)

Publication Number Publication Date
DE3225782A1 true DE3225782A1 (de) 1983-02-10
DE3225782C2 DE3225782C2 (en, 2012) 1988-03-10

Family

ID=27460911

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823225782 Granted DE3225782A1 (de) 1981-07-09 1982-07-09 Elektronisches bauteil

Country Status (5)

Country Link
US (1) US4490706A (en, 2012)
DE (1) DE3225782A1 (en, 2012)
FR (1) FR2509529B1 (en, 2012)
GB (1) GB2102632B (en, 2012)
NL (1) NL188772C (en, 2012)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0157927A1 (de) * 1984-03-23 1985-10-16 Siemens Aktiengesellschaft Elektronisches Bauteil, insbesondere für eine Chip-Induktivität
DE3505888C1 (de) * 1985-02-20 1986-08-14 Wolfgang Dipl.-Ing. 6800 Mannheim Westermann Kunststoffolien-Wickelkondensator in Chipbauweise
US4704592A (en) * 1984-09-13 1987-11-03 Siemens Aktiengesellschaft Chip inductor electronic component
DE3908896A1 (de) * 1988-03-17 1989-09-28 Murata Manufacturing Co Chipinduktor
DE3921651A1 (de) * 1989-06-30 1991-01-10 Siemens Ag Mindestens sechsflaechiges elektronikbauteil fuer gedruckte schaltungen
DE4217434A1 (de) * 1992-05-26 1993-12-02 Siemens Ag Elektrisches Bauteil
DE102012201847A1 (de) * 2012-02-08 2013-08-08 Würth Elektronik eiSos Gmbh & Co. KG Elektronisches Bauelement

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4796079A (en) * 1984-07-25 1989-01-03 Rca Licensing Corporation Chip component providing rf suppression
DE3513435A1 (de) * 1985-04-15 1986-10-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zum abreisssicheren kontaktieren lackisolierter draehte, insbesondere zur anwendung bei elektronischen bauteilen
US4712723A (en) * 1985-04-15 1987-12-15 Siemens Aktiengesellschaft Method for bonding an insulated wire element on a contact
US4801912A (en) * 1985-06-07 1989-01-31 American Precision Industries Inc. Surface mountable electronic device
FR2593320B1 (fr) * 1986-01-21 1988-03-04 Europ Composants Electron Procede de fabrication d'un composant inductif pour report a plat
US4818960A (en) * 1987-04-06 1989-04-04 Tdk Corporation Composite part and method of manufacturing same
EP0289934B1 (de) * 1987-05-05 1991-11-27 Siemens Aktiengesellschaft Elektrisches Bauelement in Chip-Bauweise und Verfahren zu seiner Herstellung
US4821005A (en) * 1987-12-22 1989-04-11 Amp Incorporated Electrical circuit component assembly for circuit boards
JPH0729612Y2 (ja) * 1988-06-23 1995-07-05 株式会社村田製作所 ノイズ除去用インダクタ
JPH04273112A (ja) * 1991-02-28 1992-09-29 Murata Mfg Co Ltd モールド型チップ電子部品
GB2258764A (en) * 1991-08-14 1993-02-17 Abc Taiwan Electronics Corp Securing chip coil to p.c.b
US5977855A (en) * 1991-11-26 1999-11-02 Matsushita Electric Industrial Co., Ltd. Molded transformer
DE9312005U1 (de) * 1993-08-11 1993-09-23 Siemens Matsushita Components GmbH & Co. KG, 81541 München Elektrisches bauelement in chip-bauweise
DE4332638A1 (de) * 1993-09-24 1995-03-30 Siemens Matsushita Components Chip-Induktivität
JP3322189B2 (ja) * 1997-10-24 2002-09-09 株式会社村田製作所 インダクタ及びその製造方法
US6918173B2 (en) * 2000-07-31 2005-07-19 Ceratech Corporation Method for fabricating surface mountable chip inductor
US6965167B2 (en) * 2003-06-17 2005-11-15 Inpaq Technology Co., Ltd. Laminated chip electronic device and method of manufacturing the same
JP2007311622A (ja) * 2006-05-19 2007-11-29 Toko Inc 小型面実装電子部品とその製造方法
WO2012015942A1 (en) * 2010-07-27 2012-02-02 Georgia Tech Research Corporation Systems and methods for providing ac/dc boost converters for energy harvesting
JP2012234868A (ja) * 2011-04-28 2012-11-29 Taiyo Yuden Co Ltd コイル部品
TW201318011A (zh) * 2011-10-17 2013-05-01 Power Mate Technology Co Ltd 變壓器承座
US9513671B2 (en) 2014-08-01 2016-12-06 Microsoft Technology Licensing, Llc Peripheral retention device
US9397723B2 (en) 2014-08-26 2016-07-19 Microsoft Technology Licensing, Llc Spread spectrum wireless over non-contiguous channels
US9424048B2 (en) * 2014-09-15 2016-08-23 Microsoft Technology Licensing, Llc Inductive peripheral retention device
US10157702B2 (en) * 2014-12-07 2018-12-18 Alpha And Omega Semiconductor (Cayman) Ltd. Pulse transformer
JP6341138B2 (ja) * 2015-04-10 2018-06-13 株式会社村田製作所 面実装インダクタ及びその製造方法
JP6465068B2 (ja) * 2016-04-28 2019-02-06 株式会社村田製作所 コイル部品
JP2018142644A (ja) * 2017-02-28 2018-09-13 株式会社村田製作所 インダクタ
US10469029B2 (en) 2017-10-23 2019-11-05 Analog Devices, Inc. Inductor current distribution
US10461696B2 (en) 2017-10-23 2019-10-29 Analog Devices, Inc. Switched capacitor banks
DE202022104994U1 (de) 2022-09-06 2023-12-11 Tridonic Gmbh & Co Kg Geerdeter Kern einer Induktivität auf einer Leiterplatte

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2617555A1 (de) * 1976-04-22 1977-10-27 Siemens Ag Abgleichbare miniaturspule
DE2617465A1 (de) * 1976-04-21 1977-11-03 Siemens Ag Elektrische spule und verfahren zu ihrer herstellung
EP0025605A1 (en) * 1979-09-17 1981-03-25 TDK Corporation Inductance device
DE3036913A1 (de) * 1980-02-26 1981-09-10 TDK Electronics Co., Ltd., Tokyo Induktivitaetseinrichtung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1727581A (en) * 1925-12-23 1929-09-10 Stanford J Wood Fixed condenser
DE913450C (de) * 1952-04-19 1954-06-14 Felten & Guilleaume Carlswerk Verfahren zur Herstellung von elektrischen Kondensatoren
US3295056A (en) * 1961-04-28 1966-12-27 Tdk Electronics Co Ltd Combined unit of impedance
US3824518A (en) * 1973-03-05 1974-07-16 Piconics Inc Miniaturized inductive component
DE2547110C3 (de) * 1975-10-21 1978-11-30 Resista Fabrik Elektrischer Widerstaende Gmbh, 8300 Landshut Mit Markierungen versehenes elektrisches Bauelement sowie Verfahren zu dessen Markierung und Anwendung derartiger Bauelemente zum automatischen Bestücken von Druckplatinen
US4027207A (en) * 1975-11-03 1977-05-31 International Business Machines Corporation Electrical safety bypass
US4064472A (en) * 1976-04-08 1977-12-20 Vanguard Electronics Company, Inc. Compact inductor
US4247883A (en) * 1978-07-31 1981-01-27 Sprague Electric Company Encapsulated capacitor
US4255779A (en) * 1978-12-28 1981-03-10 Western Electric Company, Inc. Package machine insertable rolled metallized film capacitor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2617465A1 (de) * 1976-04-21 1977-11-03 Siemens Ag Elektrische spule und verfahren zu ihrer herstellung
DE2617555A1 (de) * 1976-04-22 1977-10-27 Siemens Ag Abgleichbare miniaturspule
EP0025605A1 (en) * 1979-09-17 1981-03-25 TDK Corporation Inductance device
DE3036913A1 (de) * 1980-02-26 1981-09-10 TDK Electronics Co., Ltd., Tokyo Induktivitaetseinrichtung

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0157927A1 (de) * 1984-03-23 1985-10-16 Siemens Aktiengesellschaft Elektronisches Bauteil, insbesondere für eine Chip-Induktivität
US4704592A (en) * 1984-09-13 1987-11-03 Siemens Aktiengesellschaft Chip inductor electronic component
DE3505888C1 (de) * 1985-02-20 1986-08-14 Wolfgang Dipl.-Ing. 6800 Mannheim Westermann Kunststoffolien-Wickelkondensator in Chipbauweise
US4656556A (en) * 1985-02-20 1987-04-07 Wolfgang Westermann Plastic film capacitor in chip constructional form
EP0192818B1 (de) * 1985-02-20 1988-06-22 Wolfgang Westermann Kunststoffolien-Wickelkondensator in Chipbauweise
DE3908896A1 (de) * 1988-03-17 1989-09-28 Murata Manufacturing Co Chipinduktor
DE3921651A1 (de) * 1989-06-30 1991-01-10 Siemens Ag Mindestens sechsflaechiges elektronikbauteil fuer gedruckte schaltungen
DE4217434A1 (de) * 1992-05-26 1993-12-02 Siemens Ag Elektrisches Bauteil
DE102012201847A1 (de) * 2012-02-08 2013-08-08 Würth Elektronik eiSos Gmbh & Co. KG Elektronisches Bauelement

Also Published As

Publication number Publication date
NL8202751A (nl) 1983-02-01
US4490706A (en) 1984-12-25
FR2509529B1 (fr) 1986-01-31
NL188772C (nl) 1992-09-16
DE3225782C2 (en, 2012) 1988-03-10
NL188772B (nl) 1992-04-16
GB2102632A (en) 1983-02-02
GB2102632B (en) 1985-10-16
FR2509529A1 (fr) 1983-01-14

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: TDK CORPORATION, TOKIO/TOKYO, JP

8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition