NL188772C - Inductantie. - Google Patents
Inductantie.Info
- Publication number
- NL188772C NL188772C NLAANVRAGE8202751,A NL8202751A NL188772C NL 188772 C NL188772 C NL 188772C NL 8202751 A NL8202751 A NL 8202751A NL 188772 C NL188772 C NL 188772C
- Authority
- NL
- Netherlands
- Prior art keywords
- inductance
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/02—Fixed inductances of the signal type without magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/04—Arrangements of electric connections to coils, e.g. leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10118981U JPS588914U (ja) | 1981-07-09 | 1981-07-09 | チツプインダクタ− |
JP10118981 | 1981-07-09 | ||
JP4054482U JPS58142916U (ja) | 1982-03-23 | 1982-03-23 | 電子部品 |
JP4054482 | 1982-03-23 | ||
JP4054682 | 1982-03-23 | ||
JP4054682U JPS58142914U (ja) | 1982-03-23 | 1982-03-23 | 電子部品 |
JP6684982U JPS58170900U (ja) | 1982-05-08 | 1982-05-08 | チツプ状電子部品 |
JP6684982 | 1982-05-08 |
Publications (3)
Publication Number | Publication Date |
---|---|
NL8202751A NL8202751A (nl) | 1983-02-01 |
NL188772B NL188772B (nl) | 1992-04-16 |
NL188772C true NL188772C (nl) | 1992-09-16 |
Family
ID=27460911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NLAANVRAGE8202751,A NL188772C (nl) | 1981-07-09 | 1982-07-08 | Inductantie. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4490706A (nl) |
DE (1) | DE3225782A1 (nl) |
FR (1) | FR2509529B1 (nl) |
GB (1) | GB2102632B (nl) |
NL (1) | NL188772C (nl) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3477438D1 (en) * | 1984-03-23 | 1989-04-27 | Siemens Ag | Electronic component, in particular a chip inductance |
US4796079A (en) * | 1984-07-25 | 1989-01-03 | Rca Licensing Corporation | Chip component providing rf suppression |
US4704592A (en) * | 1984-09-13 | 1987-11-03 | Siemens Aktiengesellschaft | Chip inductor electronic component |
DE3505888C1 (de) * | 1985-02-20 | 1986-08-14 | Wolfgang Dipl.-Ing. 6800 Mannheim Westermann | Kunststoffolien-Wickelkondensator in Chipbauweise |
DE3513435A1 (de) * | 1985-04-15 | 1986-10-16 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum abreisssicheren kontaktieren lackisolierter draehte, insbesondere zur anwendung bei elektronischen bauteilen |
US4712723A (en) * | 1985-04-15 | 1987-12-15 | Siemens Aktiengesellschaft | Method for bonding an insulated wire element on a contact |
US4801912A (en) * | 1985-06-07 | 1989-01-31 | American Precision Industries Inc. | Surface mountable electronic device |
FR2593320B1 (fr) * | 1986-01-21 | 1988-03-04 | Europ Composants Electron | Procede de fabrication d'un composant inductif pour report a plat |
US4818960A (en) * | 1987-04-06 | 1989-04-04 | Tdk Corporation | Composite part and method of manufacturing same |
DE3866418D1 (de) * | 1987-05-05 | 1992-01-09 | Siemens Ag | Elektrisches bauelement in chip-bauweise und verfahren zu seiner herstellung. |
US4821005A (en) * | 1987-12-22 | 1989-04-11 | Amp Incorporated | Electrical circuit component assembly for circuit boards |
DE3908896C2 (de) * | 1988-03-17 | 1994-02-24 | Murata Manufacturing Co | Chipinduktor |
JPH0729612Y2 (ja) * | 1988-06-23 | 1995-07-05 | 株式会社村田製作所 | ノイズ除去用インダクタ |
DE3921651A1 (de) * | 1989-06-30 | 1991-01-10 | Siemens Ag | Mindestens sechsflaechiges elektronikbauteil fuer gedruckte schaltungen |
JPH04273112A (ja) * | 1991-02-28 | 1992-09-29 | Murata Mfg Co Ltd | モールド型チップ電子部品 |
GB2258764A (en) * | 1991-08-14 | 1993-02-17 | Abc Taiwan Electronics Corp | Securing chip coil to p.c.b |
US5977855A (en) * | 1991-11-26 | 1999-11-02 | Matsushita Electric Industrial Co., Ltd. | Molded transformer |
DE4217434A1 (de) * | 1992-05-26 | 1993-12-02 | Siemens Ag | Elektrisches Bauteil |
DE9312005U1 (de) * | 1993-08-11 | 1993-09-23 | Siemens Matsushita Components GmbH & Co. KG, 81541 München | Elektrisches bauelement in chip-bauweise |
DE4332638A1 (de) * | 1993-09-24 | 1995-03-30 | Siemens Matsushita Components | Chip-Induktivität |
JP3322189B2 (ja) * | 1997-10-24 | 2002-09-09 | 株式会社村田製作所 | インダクタ及びその製造方法 |
US6918173B2 (en) * | 2000-07-31 | 2005-07-19 | Ceratech Corporation | Method for fabricating surface mountable chip inductor |
US6965167B2 (en) * | 2003-06-17 | 2005-11-15 | Inpaq Technology Co., Ltd. | Laminated chip electronic device and method of manufacturing the same |
JP2007311622A (ja) * | 2006-05-19 | 2007-11-29 | Toko Inc | 小型面実装電子部品とその製造方法 |
US8953349B2 (en) * | 2010-07-27 | 2015-02-10 | Georgia Tech Research Corporation | Systems and methods for providing AC/DC boost converters for energy harvesting |
JP2012234868A (ja) * | 2011-04-28 | 2012-11-29 | Taiyo Yuden Co Ltd | コイル部品 |
TW201318011A (zh) * | 2011-10-17 | 2013-05-01 | Power Mate Technology Co Ltd | 變壓器承座 |
DE102012201847A1 (de) * | 2012-02-08 | 2013-08-08 | Würth Elektronik eiSos Gmbh & Co. KG | Elektronisches Bauelement |
US9513671B2 (en) | 2014-08-01 | 2016-12-06 | Microsoft Technology Licensing, Llc | Peripheral retention device |
US9397723B2 (en) | 2014-08-26 | 2016-07-19 | Microsoft Technology Licensing, Llc | Spread spectrum wireless over non-contiguous channels |
US9424048B2 (en) * | 2014-09-15 | 2016-08-23 | Microsoft Technology Licensing, Llc | Inductive peripheral retention device |
US10157702B2 (en) * | 2014-12-07 | 2018-12-18 | Alpha And Omega Semiconductor (Cayman) Ltd. | Pulse transformer |
JP6341138B2 (ja) * | 2015-04-10 | 2018-06-13 | 株式会社村田製作所 | 面実装インダクタ及びその製造方法 |
JP6465068B2 (ja) * | 2016-04-28 | 2019-02-06 | 株式会社村田製作所 | コイル部品 |
JP2018142644A (ja) * | 2017-02-28 | 2018-09-13 | 株式会社村田製作所 | インダクタ |
US10469029B2 (en) | 2017-10-23 | 2019-11-05 | Analog Devices, Inc. | Inductor current distribution |
US10461696B2 (en) | 2017-10-23 | 2019-10-29 | Analog Devices, Inc. | Switched capacitor banks |
DE202022104994U1 (de) | 2022-09-06 | 2023-12-11 | Tridonic Gmbh & Co Kg | Geerdeter Kern einer Induktivität auf einer Leiterplatte |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1727581A (en) * | 1925-12-23 | 1929-09-10 | Stanford J Wood | Fixed condenser |
DE913450C (de) * | 1952-04-19 | 1954-06-14 | Felten & Guilleaume Carlswerk | Verfahren zur Herstellung von elektrischen Kondensatoren |
US3295056A (en) * | 1961-04-28 | 1966-12-27 | Tdk Electronics Co Ltd | Combined unit of impedance |
US3824518A (en) * | 1973-03-05 | 1974-07-16 | Piconics Inc | Miniaturized inductive component |
DE2547110C3 (de) * | 1975-10-21 | 1978-11-30 | Resista Fabrik Elektrischer Widerstaende Gmbh, 8300 Landshut | Mit Markierungen versehenes elektrisches Bauelement sowie Verfahren zu dessen Markierung und Anwendung derartiger Bauelemente zum automatischen Bestücken von Druckplatinen |
US4027207A (en) * | 1975-11-03 | 1977-05-31 | International Business Machines Corporation | Electrical safety bypass |
US4064472A (en) * | 1976-04-08 | 1977-12-20 | Vanguard Electronics Company, Inc. | Compact inductor |
DE2617465C3 (de) * | 1976-04-21 | 1978-10-19 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Elektrische Spule und Verfahren zu ihrer Herstellung |
DE2617555C3 (de) * | 1976-04-22 | 1979-01-25 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Miniaturspule |
US4247883A (en) * | 1978-07-31 | 1981-01-27 | Sprague Electric Company | Encapsulated capacitor |
US4255779A (en) * | 1978-12-28 | 1981-03-10 | Western Electric Company, Inc. | Package machine insertable rolled metallized film capacitor |
JPS5926577Y2 (ja) * | 1979-09-17 | 1984-08-02 | ティーディーケイ株式会社 | 小型インダクタンス素子 |
JPS6023947Y2 (ja) * | 1980-02-26 | 1985-07-17 | ティーディーケイ株式会社 | インダクタンス素子 |
-
1982
- 1982-07-08 NL NLAANVRAGE8202751,A patent/NL188772C/nl not_active IP Right Cessation
- 1982-07-08 GB GB08219862A patent/GB2102632B/en not_active Expired
- 1982-07-08 US US06/396,208 patent/US4490706A/en not_active Expired - Lifetime
- 1982-07-09 FR FR8212125A patent/FR2509529B1/fr not_active Expired
- 1982-07-09 DE DE19823225782 patent/DE3225782A1/de active Granted
Also Published As
Publication number | Publication date |
---|---|
DE3225782A1 (de) | 1983-02-10 |
GB2102632A (en) | 1983-02-02 |
FR2509529A1 (fr) | 1983-01-14 |
US4490706A (en) | 1984-12-25 |
NL8202751A (nl) | 1983-02-01 |
FR2509529B1 (fr) | 1986-01-31 |
DE3225782C2 (nl) | 1988-03-10 |
GB2102632B (en) | 1985-10-16 |
NL188772B (nl) | 1992-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
DNT | Communications of changes of names of applicants whose applications have been laid open to public inspection |
Free format text: TDK CORPORATION |
|
A85 | Still pending on 85-01-01 | ||
BA | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
V4 | Discontinued because of reaching the maximum lifetime of a patent |
Free format text: 20020708 |