FR2593320B1 - Procede de fabrication d'un composant inductif pour report a plat - Google Patents

Procede de fabrication d'un composant inductif pour report a plat

Info

Publication number
FR2593320B1
FR2593320B1 FR8600801A FR8600801A FR2593320B1 FR 2593320 B1 FR2593320 B1 FR 2593320B1 FR 8600801 A FR8600801 A FR 8600801A FR 8600801 A FR8600801 A FR 8600801A FR 2593320 B1 FR2593320 B1 FR 2593320B1
Authority
FR
France
Prior art keywords
manufacturing
inductive component
flat carrying
flat
carrying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8600801A
Other languages
English (en)
Other versions
FR2593320A1 (fr
Inventor
Jean-Luc Zattara
Gilles Bernard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUROP COMPOSANTS ELECTRON
Original Assignee
EUROP COMPOSANTS ELECTRON
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUROP COMPOSANTS ELECTRON filed Critical EUROP COMPOSANTS ELECTRON
Priority to FR8600801A priority Critical patent/FR2593320B1/fr
Priority to EP87400098A priority patent/EP0232197A1/fr
Priority to US07/004,397 priority patent/US4785527A/en
Priority to JP62012182A priority patent/JPS62183104A/ja
Publication of FR2593320A1 publication Critical patent/FR2593320A1/fr
Application granted granted Critical
Publication of FR2593320B1 publication Critical patent/FR2593320B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10Connecting leads to windings
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49071Electromagnet, transformer or inductor by winding or coiling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171Assembling electrical component directly to terminal or elongated conductor with encapsulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
FR8600801A 1986-01-21 1986-01-21 Procede de fabrication d'un composant inductif pour report a plat Expired FR2593320B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR8600801A FR2593320B1 (fr) 1986-01-21 1986-01-21 Procede de fabrication d'un composant inductif pour report a plat
EP87400098A EP0232197A1 (fr) 1986-01-21 1987-01-16 Procédé de fabrication d'un composant inductif pour report à plat
US07/004,397 US4785527A (en) 1986-01-21 1987-01-20 Method for manufacturing an inductive chip
JP62012182A JPS62183104A (ja) 1986-01-21 1987-01-21 チツプインダクタの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8600801A FR2593320B1 (fr) 1986-01-21 1986-01-21 Procede de fabrication d'un composant inductif pour report a plat

Publications (2)

Publication Number Publication Date
FR2593320A1 FR2593320A1 (fr) 1987-07-24
FR2593320B1 true FR2593320B1 (fr) 1988-03-04

Family

ID=9331329

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8600801A Expired FR2593320B1 (fr) 1986-01-21 1986-01-21 Procede de fabrication d'un composant inductif pour report a plat

Country Status (4)

Country Link
US (1) US4785527A (fr)
EP (1) EP0232197A1 (fr)
JP (1) JPS62183104A (fr)
FR (1) FR2593320B1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991000603A1 (fr) * 1989-07-03 1991-01-10 Sokymat Sa Procede de fabrication de composants electroniques comportant un bobinage en fil fin, et dispositif de maintien du fil de bobinage permettant une fabrication selon ce procede
CH684642A5 (fr) * 1991-02-25 1994-11-15 Ake Gustafson Pince de maintien d'un corps de bobine dans une machine de bobinage.
WO1993009551A1 (fr) * 1991-11-08 1993-05-13 Herbert Stowasser Transpondeur ainsi que procede et dispositif pour sa fabrication
US5478517A (en) * 1994-02-28 1995-12-26 Gennum Corporation Method for molding IC chips
CA2180992C (fr) * 1995-07-18 1999-05-18 Timothy M. Shafer Bobine d'induction a courant eleve et methode de fabrication
US7921546B2 (en) 1995-07-18 2011-04-12 Vishay Dale Electronics, Inc. Method for making a high current low profile inductor
US6202853B1 (en) 1996-01-11 2001-03-20 Autosplice Systems, Inc. Secondary processing for electrical or mechanical components molded to continuous carrier supports
US5706952A (en) * 1996-01-11 1998-01-13 Autosplice Systems Inc. Continuous carrier for electrical or mechanical components
EP0937304A1 (fr) * 1996-11-11 1999-08-25 Metget AB Procede de fabrication et de fixation de bobines et appareil de realisation de ce procede
US5867891A (en) * 1996-12-30 1999-02-09 Ericsson Inc. Continuous method of manufacturing wire wound inductors and wire wound inductors thereby
US5903207A (en) * 1996-12-30 1999-05-11 Ericsson Inc. Wire wound inductors
US5933949A (en) * 1997-03-06 1999-08-10 Ericsson Inc. Surface mount device terminal forming apparatus and method
DE19848009C2 (de) * 1998-10-19 2001-10-04 Ods Landis & Gyr Gmbh & Co Kg Verfahren zum Herstellen einer Leiterschleife mit angeschlossenem Chipmodul zur Verwendung in kontaktlosen Chipkarten sowie Trägervorrichtung zur Verwendung in dem Verfahren sowie kontaktlose Chipkarte
DE102004058452A1 (de) * 2004-12-03 2006-06-08 Vacuumschmelze Gmbh & Co. Kg Stromerfassungseinrichtung und Verfahren zum Herstellen einer solchen Stromerfassungseinrichtung
CN103208898A (zh) * 2013-04-16 2013-07-17 厦门新鸿洲精密科技有限公司 音圈马达组件的线圈支架结构

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5556617A (en) * 1978-10-23 1980-04-25 Toudai Musen Kk Preparation of resin mold coil
US4490706A (en) * 1981-07-09 1984-12-25 Tdk Corporation Electronic parts
JPS5828820A (ja) * 1981-08-13 1983-02-19 Sony Corp チツプ型コイル装置の製法
JPS58127308A (ja) * 1982-01-23 1983-07-29 Mitsumi Electric Co Ltd コイルの製造方法
JPS58166713A (ja) * 1982-03-29 1983-10-01 Toko Inc 固定インダクタの製造方法
JPS58223306A (ja) * 1982-06-22 1983-12-24 Toko Inc リ−ドレス型固定インダクタの製造方法
US4553123A (en) * 1982-09-03 1985-11-12 Murata Manufacturing Co., Ltd. Miniature inductor
JPS60224210A (ja) * 1984-04-20 1985-11-08 Matsushita Electric Ind Co Ltd 変成器の製造法
US4662066A (en) * 1985-10-28 1987-05-05 Herbert Toman Continuously operable tool for use in production line process

Also Published As

Publication number Publication date
US4785527A (en) 1988-11-22
JPS62183104A (ja) 1987-08-11
EP0232197A1 (fr) 1987-08-12
FR2593320A1 (fr) 1987-07-24

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Legal Events

Date Code Title Description
ST Notification of lapse