DE3015101C2 - - Google Patents
Info
- Publication number
- DE3015101C2 DE3015101C2 DE3015101A DE3015101A DE3015101C2 DE 3015101 C2 DE3015101 C2 DE 3015101C2 DE 3015101 A DE3015101 A DE 3015101A DE 3015101 A DE3015101 A DE 3015101A DE 3015101 C2 DE3015101 C2 DE 3015101C2
- Authority
- DE
- Germany
- Prior art keywords
- zones
- mask
- semiconductor body
- layer
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 31
- 230000003647 oxidation Effects 0.000 claims description 27
- 238000007254 oxidation reaction Methods 0.000 claims description 27
- 238000005530 etching Methods 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 12
- 230000005669 field effect Effects 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 9
- 230000000873 masking effect Effects 0.000 claims description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000011109 contamination Methods 0.000 claims description 4
- 229910052785 arsenic Inorganic materials 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 58
- 150000004767 nitrides Chemical class 0.000 description 29
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000009792 diffusion process Methods 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 239000004020 conductor Substances 0.000 description 6
- 230000003071 parasitic effect Effects 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 238000002513 implantation Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002650 habitual effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- NQLVQOSNDJXLKG-UHFFFAOYSA-N prosulfocarb Chemical compound CCCN(CCC)C(=O)SCC1=CC=CC=C1 NQLVQOSNDJXLKG-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/027—Manufacture or treatment of FETs having insulated gates [IGFET] of lateral single-gate IGFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
- H01L21/76213—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose
- H01L21/76216—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose introducing electrical active impurities in the local oxidation region for the sole purpose of creating channel stoppers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/911—Differential oxidation and etching
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Junction Field-Effect Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Local Oxidation Of Silicon (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7903158A NL7903158A (nl) | 1979-04-23 | 1979-04-23 | Werkwijze voor het vervaardigen van een veldeffekt- transistor met geisoleerde poortelektrode, en transistor vervaardigd door toepassing van een derge- lijke werkwijze. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3015101A1 DE3015101A1 (de) | 1980-11-06 |
DE3015101C2 true DE3015101C2 (en, 2012) | 1990-03-29 |
Family
ID=19833027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19803015101 Granted DE3015101A1 (de) | 1979-04-23 | 1980-04-19 | Verfahren zur herstellung eines feldeffekttransistors mit isolierter gate-elektrode und durch ein derartiges verfahren hergestellter transistor |
Country Status (10)
Country | Link |
---|---|
US (1) | US4343079A (en, 2012) |
JP (1) | JPS55141758A (en, 2012) |
AU (1) | AU537858B2 (en, 2012) |
CA (1) | CA1146675A (en, 2012) |
CH (1) | CH653482A5 (en, 2012) |
DE (1) | DE3015101A1 (en, 2012) |
FR (1) | FR2455361A1 (en, 2012) |
GB (1) | GB2047961B (en, 2012) |
IT (1) | IT1140878B (en, 2012) |
NL (1) | NL7903158A (en, 2012) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55156370A (en) * | 1979-05-25 | 1980-12-05 | Hitachi Ltd | Manufacture of semiconductor device |
US5252505A (en) * | 1979-05-25 | 1993-10-12 | Hitachi, Ltd. | Method for manufacturing a semiconductor device |
JPS60106142A (ja) * | 1983-11-15 | 1985-06-11 | Nec Corp | 半導体素子の製造方法 |
US4675982A (en) * | 1985-10-31 | 1987-06-30 | International Business Machines Corporation | Method of making self-aligned recessed oxide isolation regions |
EP0585601B1 (en) | 1992-07-31 | 1999-04-28 | Hughes Electronics Corporation | Integrated circuit security system and method with implanted interconnections |
US5973375A (en) * | 1997-06-06 | 1999-10-26 | Hughes Electronics Corporation | Camouflaged circuit structure with step implants |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3698966A (en) * | 1970-02-26 | 1972-10-17 | North American Rockwell | Processes using a masking layer for producing field effect devices having oxide isolation |
NL164424C (nl) * | 1970-06-04 | 1980-12-15 | Philips Nv | Werkwijze voor het vervaardigen van een veldeffect- transistor met een geisoleerde stuurelektrode, waarbij een door een tegen oxydatie maskerende laag vrijgelaten deel van het oppervlak van een siliciumlichaam aan een oxydatiebehandeling wordt onderworpen ter verkrijging van een althans gedeeltelijk in het siliciumlichaam verzonken siliciumoxydelaag. |
NL173110C (nl) * | 1971-03-17 | 1983-12-01 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting, waarbij op een oppervlak van een halfgeleiderlichaam een uit ten minste twee deellagen van verschillend materiaal samengestelde maskeringslaag wordt aangebracht. |
JPS5528229B1 (en, 2012) * | 1971-03-19 | 1980-07-26 | ||
FR2134290B1 (en, 2012) * | 1971-04-30 | 1977-03-18 | Texas Instruments France | |
NL7113561A (en, 2012) * | 1971-10-02 | 1973-04-04 | ||
US4023195A (en) * | 1974-10-23 | 1977-05-10 | Smc Microsystems Corporation | MOS field-effect transistor structure with mesa-like contact and gate areas and selectively deeper junctions |
US4013484A (en) * | 1976-02-25 | 1977-03-22 | Intel Corporation | High density CMOS process |
JPS52131483A (en) * | 1976-04-28 | 1977-11-04 | Hitachi Ltd | Mis-type semiconductor device |
NL185376C (nl) * | 1976-10-25 | 1990-03-16 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting. |
JPS53123678A (en) * | 1977-04-04 | 1978-10-28 | Nec Corp | Manufacture of field effect semiconductor device of insulation gate type |
JPS53123661A (en) * | 1977-04-04 | 1978-10-28 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPS53144280A (en) * | 1977-05-23 | 1978-12-15 | Hitachi Ltd | Mis semiconductor device |
US4268950A (en) * | 1978-06-05 | 1981-05-26 | Texas Instruments Incorporated | Post-metal ion implant programmable MOS read only memory |
US4168999A (en) * | 1978-12-26 | 1979-09-25 | Fairchild Camera And Instrument Corporation | Method for forming oxide isolated integrated injection logic semiconductor structures having minimal encroachment utilizing special masking techniques |
-
1979
- 1979-04-23 NL NL7903158A patent/NL7903158A/nl not_active Application Discontinuation
-
1980
- 1980-04-17 CA CA000350071A patent/CA1146675A/en not_active Expired
- 1980-04-18 FR FR8008773A patent/FR2455361A1/fr active Granted
- 1980-04-18 IT IT21514/80A patent/IT1140878B/it active
- 1980-04-18 GB GB8012778A patent/GB2047961B/en not_active Expired
- 1980-04-18 US US06/141,510 patent/US4343079A/en not_active Expired - Lifetime
- 1980-04-19 DE DE19803015101 patent/DE3015101A1/de active Granted
- 1980-04-21 JP JP5181280A patent/JPS55141758A/ja active Pending
- 1980-04-21 CH CH3064/80A patent/CH653482A5/de not_active IP Right Cessation
- 1980-04-21 AU AU57651/80A patent/AU537858B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
AU537858B2 (en) | 1984-07-19 |
JPS55141758A (en) | 1980-11-05 |
FR2455361B1 (en, 2012) | 1983-04-29 |
AU5765180A (en) | 1980-10-30 |
DE3015101A1 (de) | 1980-11-06 |
CH653482A5 (de) | 1985-12-31 |
NL7903158A (nl) | 1980-10-27 |
GB2047961B (en) | 1983-08-03 |
GB2047961A (en) | 1980-12-03 |
IT1140878B (it) | 1986-10-10 |
FR2455361A1 (fr) | 1980-11-21 |
IT8021514A0 (it) | 1980-04-18 |
CA1146675A (en) | 1983-05-17 |
US4343079A (en) | 1982-08-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |