DE2818080C2 - Verkapselte Halbleitereinrichtung - Google Patents

Verkapselte Halbleitereinrichtung

Info

Publication number
DE2818080C2
DE2818080C2 DE2818080A DE2818080A DE2818080C2 DE 2818080 C2 DE2818080 C2 DE 2818080C2 DE 2818080 A DE2818080 A DE 2818080A DE 2818080 A DE2818080 A DE 2818080A DE 2818080 C2 DE2818080 C2 DE 2818080C2
Authority
DE
Germany
Prior art keywords
fastening
webs
fastening part
semiconductor device
strips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2818080A
Other languages
German (de)
English (en)
Other versions
DE2818080A1 (de
Inventor
Shigeru Yokohama Komatsu
Satoshi Tokio/Tokyo Takahashi
Masao Yokohama Wakatsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of DE2818080A1 publication Critical patent/DE2818080A1/de
Application granted granted Critical
Publication of DE2818080C2 publication Critical patent/DE2818080C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE2818080A 1977-04-26 1978-04-25 Verkapselte Halbleitereinrichtung Expired DE2818080C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4738777A JPS53132975A (en) 1977-04-26 1977-04-26 Semiconductor device

Publications (2)

Publication Number Publication Date
DE2818080A1 DE2818080A1 (de) 1978-11-09
DE2818080C2 true DE2818080C2 (de) 1985-08-01

Family

ID=12773684

Family Applications (2)

Application Number Title Priority Date Filing Date
DE2818080A Expired DE2818080C2 (de) 1977-04-26 1978-04-25 Verkapselte Halbleitereinrichtung
DE2858087A Expired DE2858087C2 (Direct) 1977-04-26 1978-04-25

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE2858087A Expired DE2858087C2 (Direct) 1977-04-26 1978-04-25

Country Status (3)

Country Link
US (1) US4298883A (Direct)
JP (1) JPS53132975A (Direct)
DE (2) DE2818080C2 (Direct)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113349A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Semiconductor device
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4339768A (en) * 1980-01-18 1982-07-13 Amp Incorporated Transistors and manufacture thereof
FR2488445A1 (fr) * 1980-08-06 1982-02-12 Efcis Boitier plastique pour circuits integres
FR2490917A1 (fr) * 1980-09-02 1982-03-26 Motorola Semiconducteurs Boitier pour circuit electrique et procede de fabrication
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
EP0104231A4 (en) * 1982-04-05 1985-10-30 Motorola Inc SELF-ALIGNING HEAT SPREADING ARRANGEMENT.
JPS5958828A (ja) * 1982-09-28 1984-04-04 Fujitsu Ltd 樹脂封止型半導体装置のスクリ−ニング法
EP0121149B1 (de) * 1983-03-31 1987-09-02 Koninklijke Philips Electronics N.V. Elektrische Kontaktanordnung für Flüssigkristall-Anzeigezellen
US4722060A (en) * 1984-03-22 1988-01-26 Thomson Components-Mostek Corporation Integrated-circuit leadframe adapted for a simultaneous bonding operation
US4791473A (en) * 1986-12-17 1988-12-13 Fairchild Semiconductor Corporation Plastic package for high frequency semiconductor devices
US5162894A (en) * 1988-05-24 1992-11-10 Kabushiki Kaisha Toshiba Semiconductor integrated circuit having a dummy lead and shaped inner leads
JPH0225057A (ja) * 1988-07-13 1990-01-26 Mitsubishi Electric Corp 半導体装置の製造方法
JP2522524B2 (ja) * 1988-08-06 1996-08-07 株式会社東芝 半導体装置の製造方法
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
US5083368A (en) * 1990-02-14 1992-01-28 Motorola Inc. Method of forming modular power device assembly
US4991002A (en) * 1990-02-14 1991-02-05 Motorola Inc. Modular power device assembly
JPH03293756A (ja) * 1990-04-12 1991-12-25 Mitsubishi Electric Corp 半導体装置用リードフレーム及びその製造方法
DE4021871C2 (de) * 1990-07-09 1994-07-28 Lsi Logic Products Gmbh Hochintegriertes elektronisches Bauteil
US5389577A (en) * 1992-08-31 1995-02-14 Sgs-Thomson Microelectronics, Inc. Leadframe for integrated circuits
US5358905A (en) * 1993-04-02 1994-10-25 Texas Instruments Incorporated Semiconductor device having die pad locking to substantially reduce package cracking
US5683944A (en) * 1995-09-01 1997-11-04 Motorola, Inc. Method of fabricating a thermally enhanced lead frame
DE19639183A1 (de) * 1996-09-24 1998-04-02 Siemens Ag Anschlußrahmen für ein mikroelektronisches Bauteil, Verfahren zu dessen Herstellung und den Anschlußrahmen umfassendes mikroelektronisches Bauteil
US5926695A (en) * 1997-06-10 1999-07-20 National Semiconductor Corporation Lead frame incorporating material flow diverters
EP0895287A3 (en) * 1997-07-31 2006-04-05 Matsushita Electric Industrial Co., Ltd. Semiconductor device and lead frame for the same
US7057273B2 (en) * 2001-05-15 2006-06-06 Gem Services, Inc. Surface mount package
USD461172S1 (en) 2001-07-17 2002-08-06 Gem Services, Inc. Surface mount package
USD485243S1 (en) 2002-10-22 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483336S1 (en) 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483337S1 (en) 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD486802S1 (en) 2002-12-17 2004-02-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD513608S1 (en) 2003-01-03 2006-01-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
JP4435050B2 (ja) * 2005-05-24 2010-03-17 パナソニック株式会社 半導体装置
US20120248594A1 (en) * 2011-03-28 2012-10-04 Ho Il Lee Junction box and manufacturing method thereof
CN104465588B (zh) * 2013-09-25 2018-11-02 恩智浦美国有限公司 具有应力释放和散热器的半导体封装件
US20210043466A1 (en) 2019-08-06 2021-02-11 Texas Instruments Incorporated Universal semiconductor package molds

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL121501C (Direct) * 1959-12-16
DE1937664U (de) 1966-01-18 1966-04-28 Werner Bialluch Kombinierte zigaretten-streichholzschachtel.
US3574815A (en) * 1966-07-13 1971-04-13 Motorola Inc Method of fabricating a plastic encapsulated semiconductor assembly
US3423516A (en) * 1966-07-13 1969-01-21 Motorola Inc Plastic encapsulated semiconductor assemblies
US3577633A (en) * 1966-12-02 1971-05-04 Hitachi Ltd Method of making a semiconductor device
NL157456B (nl) * 1968-07-30 1978-07-17 Philips Nv Halfgeleiderinrichting in een isolerende kunststofomhulling.
DE2004768C3 (de) * 1968-07-30 1979-09-06 N.V. Philips' Gloeilampenfabrieken, Eindhoven (Niederlande) Halbleiterbauelement
DE1800213A1 (de) * 1968-10-01 1970-05-14 Telefunken Patent Gehaeuse fuer integrierte Halbleiterschaltungen
US3665256A (en) * 1968-10-15 1972-05-23 Rca Corp Heat dissipation for power integrated circuits
US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting
US3629668A (en) * 1969-12-19 1971-12-21 Texas Instruments Inc Semiconductor device package having improved compatibility properties
US3628483A (en) * 1970-03-20 1971-12-21 Amp Inc Method of making power frame for integrated circuit
US3786317A (en) * 1972-11-09 1974-01-15 Bell Telephone Labor Inc Microelectronic circuit package
US3914786A (en) * 1974-04-19 1975-10-21 Hewlett Packard Co In-line reflective lead-pair for light-emitting diodes
US4023053A (en) * 1974-12-16 1977-05-10 Tokyo Shibaura Electric Co., Ltd. Variable capacity diode device
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
US4048670A (en) * 1975-06-30 1977-09-13 Sprague Electric Company Stress-free hall-cell package

Also Published As

Publication number Publication date
DE2818080A1 (de) 1978-11-09
DE2858087C2 (Direct) 1987-07-02
JPS53132975A (en) 1978-11-20
US4298883A (en) 1981-11-03

Similar Documents

Publication Publication Date Title
DE69304304T2 (de) Kombination einer elektronischen Halbleiteranordnung und einer Wärmesenke
DE69025365T2 (de) Karte mit integrierter Schaltung
DE3447347C2 (Direct)
DE2818080A1 (de) Verkapselte halbleitereinrichtung
DE2712543C2 (de) Anordnung eines Halbleiterbauelements auf einer Montageplatte
DE29819994U1 (de) Wärmeabfuhrvorrichtung
EP0706214A2 (de) Elektronikmodul und Chipkarte
DE3422362A1 (de) Strahlungskuehler fuer halbleitervorrichtungen
DE2159530C3 (de) Verfahren zum Herstellen einer Halbleiteranordnung
DE4031660A1 (de) Parallele anschlussstifte fuer elektronische bauelemente
DE29514509U1 (de) Zugfederanschluß für elektrische Leiter
DE69017979T2 (de) Elektrischer Kontakt.
DE69617614T2 (de) Ein werkzeug zur herstellung von verbindungsstellen zwischen plattenförmigen teilen
DE102017212186B4 (de) Mit Gießharz versiegelte Leistungshalbleiter-Einrichtung
DE3438435C2 (de) Gehäuse aus Metall und Kunststoff für eine Halbleiter-Vorrichtung, das zur Befestigung an einem nicht genau ebenen Wärmeableiter geeignet ist, sowie Verfahren zu dessen Herstellung
EP0283973B1 (de) Vorrichtung zur Befestigung von Gehäusen in Öffnungen einer Schalttafel oder einer Rastersystemwand
DE10100460A1 (de) Leistungshalbleitermodul mit Gehäuse und Anschlußelementen
DE69817837T2 (de) Magnetische anordnung für einen transformator oder dergleichen
DE2233792A1 (de) Elektrischer schalter
DE3342382C2 (Direct)
DE2524287A1 (de) Elektrischer schalter
DE69015243T2 (de) Anschlussvorrichtung.
DE69524312T2 (de) Verfahren zur herstellung eines vergossenen leiterrahmens
DE3447851A1 (de) Elektrisches bauelement
DE3855949T2 (de) Gehäuse für integrierte Schaltungen

Legal Events

Date Code Title Description
OAP Request for examination filed
OD Request for examination
8172 Supplementary division/partition in:

Ref country code: DE

Ref document number: 2858087

Format of ref document f/p: P

Q171 Divided out to:

Ref country code: DE

Ref document number: 2858087

D2 Grant after examination
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: KLUNKER, H., DIPL.-ING. DR.RER.NAT., PAT.-ANW., 8000 MUENCHEN

8327 Change in the person/name/address of the patent owner

Owner name: KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP

AH Division in

Ref country code: DE

Ref document number: 2858087

Format of ref document f/p: P

8339 Ceased/non-payment of the annual fee