USD494939S1 - Portion of a matrix for surface mount package leadframe - Google Patents

Portion of a matrix for surface mount package leadframe Download PDF

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Publication number
USD494939S1
USD494939S1 US29/172,799 US17279902F USD494939S US D494939 S1 USD494939 S1 US D494939S1 US 17279902 F US17279902 F US 17279902F US D494939 S USD494939 S US D494939S
Authority
US
United States
Prior art keywords
matrix
surface mount
mount package
package leadframe
leadframe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/172,799
Inventor
James Harnden
Richard K. Williams
Anthony Chia
Chu Weibing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEM Services Inc USA
Original Assignee
GEM Services Inc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEM Services Inc USA filed Critical GEM Services Inc USA
Priority to US29/172,799 priority Critical patent/USD494939S1/en
Assigned to GEM SERVICES, INC. reassignment GEM SERVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIA, ANTHONY, WEIBING, CHU, HARNDEN, JAMES, WILLIAMS, RICHARD K.
Application granted granted Critical
Publication of USD494939S1 publication Critical patent/USD494939S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframes showing my new design;
FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,
FIG. 3 is a perspective view of a matrix for surface mount package leadframes showing my new design.

Claims (1)

  1. The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.
US29/172,799 2002-12-17 2002-12-17 Portion of a matrix for surface mount package leadframe Expired - Lifetime USD494939S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/172,799 USD494939S1 (en) 2002-12-17 2002-12-17 Portion of a matrix for surface mount package leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/172,799 USD494939S1 (en) 2002-12-17 2002-12-17 Portion of a matrix for surface mount package leadframe

Publications (1)

Publication Number Publication Date
USD494939S1 true USD494939S1 (en) 2004-08-24

Family

ID=32867550

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/172,799 Expired - Lifetime USD494939S1 (en) 2002-12-17 2002-12-17 Portion of a matrix for surface mount package leadframe

Country Status (1)

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US (1) USD494939S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD803801S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803800S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD1012871S1 (en) * 2020-06-30 2024-01-30 Roche Molecular Systems, Inc. Circuit board sensor pad

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD803801S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803800S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD1012871S1 (en) * 2020-06-30 2024-01-30 Roche Molecular Systems, Inc. Circuit board sensor pad

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