USD803800S1 - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- USD803800S1 USD803800S1 US29/543,060 US201529543060F USD803800S US D803800 S1 USD803800 S1 US D803800S1 US 201529543060 F US201529543060 F US 201529543060F US D803800 S USD803800 S US D803800S
- Authority
- US
- United States
- Prior art keywords
- taken along
- along line
- lead frame
- view
- end view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The Dash-Dot broken lines in FIG. 14 labeled as “2” are included to indicate the point at which the magnified view is cut off. The Dash-Dot broken lines define the bounds of the claimed design and form no part thereof. The Dash-Dash broken line portion of the figure drawings is included to show environment and form no part of the claimed design.
Claims (1)
- The ornamental design for a lead frame, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2015-8836F JP1537980S (en) | 2015-04-20 | 2015-04-20 | |
JP2015-008836 | 2015-04-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD803800S1 true USD803800S1 (en) | 2017-11-28 |
Family
ID=54549588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/543,060 Active USD803800S1 (en) | 2015-04-20 | 2015-10-20 | Lead frame |
Country Status (3)
Country | Link |
---|---|
US (1) | USD803800S1 (en) |
JP (1) | JP1537980S (en) |
TW (1) | TWD175797S (en) |
Citations (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6316821B1 (en) * | 1998-09-28 | 2001-11-13 | Cypress Semiconductor Corporation | High density lead frames and methods for plastic injection molding |
US6409775B1 (en) * | 1999-02-09 | 2002-06-25 | Matsushita Electric Industrial Co., Ltd. | Method of molding a plurality of solid electrolytic capacitors on a metal lead frame |
US6433424B1 (en) * | 2000-12-14 | 2002-08-13 | International Rectifier Corporation | Semiconductor device package and lead frame with die overhanging lead frame pad |
US6486538B1 (en) * | 1999-05-27 | 2002-11-26 | Infineon Technologies Ag | Chip carrier having ventilation channels |
US6494597B1 (en) * | 1999-10-26 | 2002-12-17 | San-Hua Yu | Bowl on lead frame in light emitting diode |
USD483336S1 (en) * | 2002-11-15 | 2003-12-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484104S1 (en) | 2002-11-25 | 2003-12-23 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484858S1 (en) * | 2002-11-15 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484859S1 (en) * | 2003-02-07 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD485244S1 (en) * | 2002-12-17 | 2004-01-13 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD485808S1 (en) * | 2003-01-03 | 2004-01-27 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD487432S1 (en) | 2003-02-07 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD487431S1 (en) * | 2003-01-03 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD488136S1 (en) * | 2003-01-03 | 2004-04-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
US20040094827A1 (en) * | 2002-11-18 | 2004-05-20 | Hideya Takakura | Leadframe for semiconductor device, method for manufacturing semiconductor device using the same, semiconductor device using the same, and electronic equipment |
USD491900S1 (en) * | 2002-12-17 | 2004-06-22 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD492266S1 (en) * | 2002-11-15 | 2004-06-29 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD494939S1 (en) * | 2002-12-17 | 2004-08-24 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
US20050046012A1 (en) * | 2003-08-26 | 2005-03-03 | Stats Chippac Ltd. | Leadframe-based mold array package heat spreader and fabrication method therefor |
USD505122S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD505121S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD588080S1 (en) * | 2007-09-26 | 2009-03-10 | Gem Services, Inc. | 2021-8J matrix leadframe |
US20100052125A1 (en) * | 2008-08-29 | 2010-03-04 | Sanyo Electric Co., Ltd. | Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
US20110212341A1 (en) * | 2010-02-26 | 2011-09-01 | Freescale Semiconductor, Inc. | Lead frame sheet |
US20120248588A1 (en) * | 2011-03-28 | 2012-10-04 | Shinko Electric Industries Co., Ltd. | Lead frame |
JP2013128007A (en) * | 2011-12-16 | 2013-06-27 | Toshiba Corp | Manufacturing method of photocoupler and lead frame sheet for photocoupler |
US20140191381A1 (en) * | 2013-01-09 | 2014-07-10 | Texas Instruments Incorporated | Integrated circuit module with dual leadframe |
US20140291824A1 (en) * | 2013-03-28 | 2014-10-02 | Infineon Technologies Ag | Leadframe, Semiconductor Package Including a Leadframe and Method for Producing a Leadframe |
US20140327004A1 (en) * | 2013-05-03 | 2014-11-06 | Infineon Technologies Ag | Lead Frame Strips with Support Members |
US9054091B2 (en) * | 2013-06-10 | 2015-06-09 | Alpha & Omega Semiconductor, Inc. | Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures |
US20160005663A1 (en) * | 2014-07-07 | 2016-01-07 | Infineon Technologies Ag | Extended contact area for leadframe strip testing |
US20160027721A1 (en) * | 2014-07-28 | 2016-01-28 | Texas Instruments Incorporated | Leadframe Strip And Leadframes |
US20160218051A1 (en) * | 2015-01-22 | 2016-07-28 | Sh Materials Co., Ltd. | Lead frame |
USD780722S1 (en) * | 2015-01-13 | 2017-03-07 | Avery Dennison Retail Information Services, Llc | Antenna |
US9607934B2 (en) * | 2013-07-31 | 2017-03-28 | Nichia Corporation | Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package |
-
2015
- 2015-04-20 JP JPD2015-8836F patent/JP1537980S/ja active Active
- 2015-10-20 US US29/543,060 patent/USD803800S1/en active Active
- 2015-10-20 TW TW104305869F patent/TWD175797S/en unknown
Patent Citations (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6316821B1 (en) * | 1998-09-28 | 2001-11-13 | Cypress Semiconductor Corporation | High density lead frames and methods for plastic injection molding |
US6409775B1 (en) * | 1999-02-09 | 2002-06-25 | Matsushita Electric Industrial Co., Ltd. | Method of molding a plurality of solid electrolytic capacitors on a metal lead frame |
US6486538B1 (en) * | 1999-05-27 | 2002-11-26 | Infineon Technologies Ag | Chip carrier having ventilation channels |
US6494597B1 (en) * | 1999-10-26 | 2002-12-17 | San-Hua Yu | Bowl on lead frame in light emitting diode |
US6433424B1 (en) * | 2000-12-14 | 2002-08-13 | International Rectifier Corporation | Semiconductor device package and lead frame with die overhanging lead frame pad |
USD483336S1 (en) * | 2002-11-15 | 2003-12-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484858S1 (en) * | 2002-11-15 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD492266S1 (en) * | 2002-11-15 | 2004-06-29 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
US20040094827A1 (en) * | 2002-11-18 | 2004-05-20 | Hideya Takakura | Leadframe for semiconductor device, method for manufacturing semiconductor device using the same, semiconductor device using the same, and electronic equipment |
USD484104S1 (en) | 2002-11-25 | 2003-12-23 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD485244S1 (en) * | 2002-12-17 | 2004-01-13 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD494939S1 (en) * | 2002-12-17 | 2004-08-24 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD491900S1 (en) * | 2002-12-17 | 2004-06-22 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD485808S1 (en) * | 2003-01-03 | 2004-01-27 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD488136S1 (en) * | 2003-01-03 | 2004-04-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD487431S1 (en) * | 2003-01-03 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD505121S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD505122S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484859S1 (en) * | 2003-02-07 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD487432S1 (en) | 2003-02-07 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
US20050046012A1 (en) * | 2003-08-26 | 2005-03-03 | Stats Chippac Ltd. | Leadframe-based mold array package heat spreader and fabrication method therefor |
USD588080S1 (en) * | 2007-09-26 | 2009-03-10 | Gem Services, Inc. | 2021-8J matrix leadframe |
US20100052125A1 (en) * | 2008-08-29 | 2010-03-04 | Sanyo Electric Co., Ltd. | Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
US20110212341A1 (en) * | 2010-02-26 | 2011-09-01 | Freescale Semiconductor, Inc. | Lead frame sheet |
US20120248588A1 (en) * | 2011-03-28 | 2012-10-04 | Shinko Electric Industries Co., Ltd. | Lead frame |
JP2013128007A (en) * | 2011-12-16 | 2013-06-27 | Toshiba Corp | Manufacturing method of photocoupler and lead frame sheet for photocoupler |
US20140191381A1 (en) * | 2013-01-09 | 2014-07-10 | Texas Instruments Incorporated | Integrated circuit module with dual leadframe |
US20140291824A1 (en) * | 2013-03-28 | 2014-10-02 | Infineon Technologies Ag | Leadframe, Semiconductor Package Including a Leadframe and Method for Producing a Leadframe |
US20140327004A1 (en) * | 2013-05-03 | 2014-11-06 | Infineon Technologies Ag | Lead Frame Strips with Support Members |
US9054091B2 (en) * | 2013-06-10 | 2015-06-09 | Alpha & Omega Semiconductor, Inc. | Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures |
US9607934B2 (en) * | 2013-07-31 | 2017-03-28 | Nichia Corporation | Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package |
US20160005663A1 (en) * | 2014-07-07 | 2016-01-07 | Infineon Technologies Ag | Extended contact area for leadframe strip testing |
US20160027721A1 (en) * | 2014-07-28 | 2016-01-28 | Texas Instruments Incorporated | Leadframe Strip And Leadframes |
USD780722S1 (en) * | 2015-01-13 | 2017-03-07 | Avery Dennison Retail Information Services, Llc | Antenna |
US20160218051A1 (en) * | 2015-01-22 | 2016-07-28 | Sh Materials Co., Ltd. | Lead frame |
Non-Patent Citations (1)
Title |
---|
Excel Cell Electronic Co., dated Dec. 29, 2014, [online], [site visited Mar. 31, 2017]. Available from Internet, <URL: http://www.ece.com.tw/product.php>. * |
Also Published As
Publication number | Publication date |
---|---|
JP1537980S (en) | 2015-11-16 |
TWD175797S (en) | 2016-05-21 |
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