TWD175797S - Portion of lead frame - Google Patents

Portion of lead frame

Info

Publication number
TWD175797S
TWD175797S TW104305869F TW104305869F TWD175797S TW D175797 S TWD175797 S TW D175797S TW 104305869 F TW104305869 F TW 104305869F TW 104305869 F TW104305869 F TW 104305869F TW D175797 S TWD175797 S TW D175797S
Authority
TW
Taiwan
Prior art keywords
design
parts
lead frame
item
diagram
Prior art date
Application number
TW104305869F
Other languages
Chinese (zh)
Inventor
Atsushi Takeshita
Original Assignee
東芝股份有限公司
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝股份有限公司, Toshiba Kk filed Critical 東芝股份有限公司
Publication of TWD175797S publication Critical patent/TWD175797S/en

Links

Abstract

【物品用途】;本設計的物品為用於半導體元件之導線框。;【設計說明】;左側視圖與右側視圖為對稱，故省略之。本設計於前視圖部分，僅有上下為連續。圖式所揭露之虛線部分，為本案不主張設計之部分。圖式所揭露之一點鏈線，是區分「本案主張設計之部分」與「其他部分」的分界線。[Use of item]; The item of this design is a lead frame for semiconductor components. ;[Design Note];The left view and the right view are symmetrical, so they are omitted. In the front view of this design, only the top and bottom are continuous. The dotted line parts revealed in the diagram are the parts for which design is not advocated in this case. The dotted chain line revealed in the diagram is the dividing line that distinguishes "the part proposed to be designed in this case" from "other parts".

TW104305869F 2015-04-20 2015-10-20 Portion of lead frame TWD175797S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-8836F JP1537980S (en) 2015-04-20 2015-04-20

Publications (1)

Publication Number Publication Date
TWD175797S true TWD175797S (en) 2016-05-21

Family

ID=54549588

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104305869F TWD175797S (en) 2015-04-20 2015-10-20 Portion of lead frame

Country Status (3)

Country Link
US (1) USD803800S1 (en)
JP (1) JP1537980S (en)
TW (1) TWD175797S (en)

Family Cites Families (35)

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US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
TW433551U (en) * 1999-10-26 2001-05-01 You Shang Hua Improvement of cup base for light emitting diode chip
US6433424B1 (en) * 2000-12-14 2002-08-13 International Rectifier Corporation Semiconductor device package and lead frame with die overhanging lead frame pad
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
JP3872001B2 (en) * 2002-11-18 2007-01-24 シャープ株式会社 Lead frame, method of manufacturing semiconductor device using the same, semiconductor device using the same, and electronic device
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US8211753B2 (en) * 2003-08-26 2012-07-03 Stats Chippac Ltd. Leadframe-based mold array package heat spreader and fabrication method therefor
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
JP5634033B2 (en) * 2008-08-29 2014-12-03 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー Resin-sealed semiconductor device and manufacturing method thereof
CN102169864B (en) * 2010-02-26 2015-06-17 飞思卡尔半导体公司 Lead frame sheet
JP5762078B2 (en) * 2011-03-28 2015-08-12 新光電気工業株式会社 Lead frame
JP5875848B2 (en) * 2011-12-16 2016-03-02 株式会社東芝 Photocoupler manufacturing method and photocoupler lead frame sheet
US8884414B2 (en) * 2013-01-09 2014-11-11 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US9013030B2 (en) * 2013-03-28 2015-04-21 Infineon Technologies Ag Leadframe, semiconductor package including a leadframe and method for producing a leadframe
US9171766B2 (en) * 2013-05-03 2015-10-27 Infineon Technologies Ag Lead frame strips with support members
US9054091B2 (en) * 2013-06-10 2015-06-09 Alpha & Omega Semiconductor, Inc. Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
JP6603982B2 (en) * 2013-07-31 2019-11-13 日亜化学工業株式会社 Lead frame, lead frame with resin, resin package, light emitting device, and method for manufacturing resin package
US9252063B2 (en) * 2014-07-07 2016-02-02 Infineon Technologies Ag Extended contact area for leadframe strip testing
US9337130B2 (en) * 2014-07-28 2016-05-10 Texas Instruments Incorporated Leadframe strip and leadframes
USD780722S1 (en) * 2015-01-13 2017-03-07 Avery Dennison Retail Information Services, Llc Antenna
JP6573356B2 (en) * 2015-01-22 2019-09-11 大口マテリアル株式会社 Lead frame

Also Published As

Publication number Publication date
USD803800S1 (en) 2017-11-28
JP1537980S (en) 2015-11-16

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