TWD175795S - Lead frame - Google Patents

Lead frame

Info

Publication number
TWD175795S
TWD175795S TW104305867F TW104305867F TWD175795S TW D175795 S TWD175795 S TW D175795S TW 104305867 F TW104305867 F TW 104305867F TW 104305867 F TW104305867 F TW 104305867F TW D175795 S TWD175795 S TW D175795S
Authority
TW
Taiwan
Prior art keywords
lead frame
design
view
article
symmetrical
Prior art date
Application number
TW104305867F
Other languages
Chinese (zh)
Inventor
Atsushi Takeshita
Original Assignee
東芝股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝股份有限公司 filed Critical 東芝股份有限公司
Publication of TWD175795S publication Critical patent/TWD175795S/en

Links

Abstract

【物品用途】;本設計的物品為用於半導體元件之導線框，於「C-C、D-D部分擴大圖」係構成半導體元件的一組單位之物。;【設計說明】;左側視圖與右側視圖為對稱，故省略之。本設計於前視圖部分，僅有上下為連續。[Use of the article]; The article of this design is a lead frame used for semiconductor components. The "enlarged view of parts C-C, D-D" is a group of units that constitutes a semiconductor component. ;[Design Note];The left view and the right view are symmetrical, so they are omitted. In the front view of this design, only the top and bottom are continuous.

TW104305867F 2015-04-20 2015-10-20 Lead frame TWD175795S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-8835F JP1537979S (en) 2015-04-20 2015-04-20

Publications (1)

Publication Number Publication Date
TWD175795S true TWD175795S (en) 2016-05-21

Family

ID=54549587

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104305867F TWD175795S (en) 2015-04-20 2015-10-20 Lead frame

Country Status (3)

Country Link
US (1) USD803799S1 (en)
JP (1) JP1537979S (en)
TW (1) TWD175795S (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD892763S1 (en) * 2018-09-07 2020-08-11 Shenzhen Grandsun Electronic Co., Ltd. Earphone
JP1678672S (en) * 2019-11-07 2021-02-08

Family Cites Families (38)

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US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
USD465207S1 (en) * 2001-06-08 2002-11-05 Gem Services, Inc. Leadframe matrix for a surface mount package
USD485243S1 (en) * 2002-10-22 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) * 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
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USD483337S1 (en) * 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD486802S1 (en) * 2002-12-17 2004-02-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD513608S1 (en) * 2003-01-03 2006-01-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
USD588557S1 (en) * 2007-10-02 2009-03-17 Gem Services, Inc. 4040-28J matrix leadframe
JP5634033B2 (en) * 2008-08-29 2014-12-03 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー Resin-sealed semiconductor device and manufacturing method thereof
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JP5762078B2 (en) * 2011-03-28 2015-08-12 新光電気工業株式会社 Lead frame
JP5875848B2 (en) * 2011-12-16 2016-03-02 株式会社東芝 Photocoupler manufacturing method and photocoupler lead frame sheet
US8884414B2 (en) * 2013-01-09 2014-11-11 Texas Instruments Incorporated Integrated circuit module with dual leadframe
JP6499387B2 (en) * 2013-03-05 2019-04-10 日亜化学工業株式会社 Lead frame and light emitting device
US9748164B2 (en) * 2013-03-05 2017-08-29 Nichia Corporation Semiconductor device
US9171766B2 (en) * 2013-05-03 2015-10-27 Infineon Technologies Ag Lead frame strips with support members
JP6603982B2 (en) * 2013-07-31 2019-11-13 日亜化学工業株式会社 Lead frame, lead frame with resin, resin package, light emitting device, and method for manufacturing resin package
US9263419B2 (en) * 2013-08-30 2016-02-16 Infineon Technologies Ag Lead frame strips with electrical isolation of die paddles
US9252063B2 (en) * 2014-07-07 2016-02-02 Infineon Technologies Ag Extended contact area for leadframe strip testing
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JP6573356B2 (en) * 2015-01-22 2019-09-11 大口マテリアル株式会社 Lead frame

Also Published As

Publication number Publication date
USD803799S1 (en) 2017-11-28
JP1537979S (en) 2015-11-16

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