USD513608S1 - Portion of a matrix for surface mount package leadframe - Google Patents

Portion of a matrix for surface mount package leadframe Download PDF

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Publication number
USD513608S1
USD513608S1 US29/173,644 US17364403F USD513608S US D513608 S1 USD513608 S1 US D513608S1 US 17364403 F US17364403 F US 17364403F US D513608 S USD513608 S US D513608S
Authority
US
United States
Prior art keywords
matrix
surface mount
mount package
package leadframe
leadframe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/173,644
Inventor
James Harnden
Richard K. Williams
Anthony Chia
Chu Weibing
Allen K. Lam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEM Services Inc USA
Original Assignee
GEM Services Inc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEM Services Inc USA filed Critical GEM Services Inc USA
Priority to US29/173,644 priority Critical patent/USD513608S1/en
Assigned to GEM SERVICES, INC. reassignment GEM SERVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HARNDEN, JAMES, CHIA, ANTHONY, WEIBING, CHU, LAM, ALLEN K., WILLIAMS, RICHARD K.
Application granted granted Critical
Publication of USD513608S1 publication Critical patent/USD513608S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframe showing my new design;
FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,
FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframe.

Claims (1)

  1. The ornamental design for portion of a matrix for surface mount package leadframe, as shown and described.
US29/173,644 2003-01-03 2003-01-03 Portion of a matrix for surface mount package leadframe Expired - Lifetime USD513608S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/173,644 USD513608S1 (en) 2003-01-03 2003-01-03 Portion of a matrix for surface mount package leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/173,644 USD513608S1 (en) 2003-01-03 2003-01-03 Portion of a matrix for surface mount package leadframe

Publications (1)

Publication Number Publication Date
USD513608S1 true USD513608S1 (en) 2006-01-17

Family

ID=35550946

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/173,644 Expired - Lifetime USD513608S1 (en) 2003-01-03 2003-01-03 Portion of a matrix for surface mount package leadframe

Country Status (1)

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US (1) USD513608S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130175679A1 (en) * 2007-12-13 2013-07-11 Cheng-Hong Su Optoisolator leadframe assembly
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130175679A1 (en) * 2007-12-13 2013-07-11 Cheng-Hong Su Optoisolator leadframe assembly
US8853837B2 (en) * 2007-12-13 2014-10-07 Lite-On Electronics (Guangzhou) Limited Optoisolator leadframe assembly
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

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