JP1537980S - - Google Patents

Info

Publication number
JP1537980S
JP1537980S JPD2015-8836F JP2015008836F JP1537980S JP 1537980 S JP1537980 S JP 1537980S JP 2015008836 F JP2015008836 F JP 2015008836F JP 1537980 S JP1537980 S JP 1537980S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2015-8836F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2015-8836F priority Critical patent/JP1537980S/ja
Priority to TW104305869F priority patent/TWD175797S/zh
Priority to US29/543,060 priority patent/USD803800S1/en
Application granted granted Critical
Publication of JP1537980S publication Critical patent/JP1537980S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2015-8836F 2015-04-20 2015-04-20 Active JP1537980S (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2015-8836F JP1537980S (ja) 2015-04-20 2015-04-20
TW104305869F TWD175797S (zh) 2015-04-20 2015-10-20 導線框之部分
US29/543,060 USD803800S1 (en) 2015-04-20 2015-10-20 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-8836F JP1537980S (ja) 2015-04-20 2015-04-20

Publications (1)

Publication Number Publication Date
JP1537980S true JP1537980S (ja) 2015-11-16

Family

ID=54549588

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2015-8836F Active JP1537980S (ja) 2015-04-20 2015-04-20

Country Status (3)

Country Link
US (1) USD803800S1 (ja)
JP (1) JP1537980S (ja)
TW (1) TWD175797S (ja)

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316821B1 (en) * 1998-09-28 2001-11-13 Cypress Semiconductor Corporation High density lead frames and methods for plastic injection molding
JP3711776B2 (ja) * 1999-02-09 2005-11-02 松下電器産業株式会社 固体電解コンデンサの製造方法およびその製造装置
US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
TW433551U (en) * 1999-10-26 2001-05-01 You Shang Hua Improvement of cup base for light emitting diode chip
US6433424B1 (en) * 2000-12-14 2002-08-13 International Rectifier Corporation Semiconductor device package and lead frame with die overhanging lead frame pad
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
JP3872001B2 (ja) * 2002-11-18 2007-01-24 シャープ株式会社 リードフレーム、それを用いた半導体装置の製造方法、それを用いた半導体装置、及び電子機器
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US8211753B2 (en) * 2003-08-26 2012-07-03 Stats Chippac Ltd. Leadframe-based mold array package heat spreader and fabrication method therefor
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
JP5634033B2 (ja) * 2008-08-29 2014-12-03 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 樹脂封止型半導体装置とその製造方法
CN102169864B (zh) * 2010-02-26 2015-06-17 飞思卡尔半导体公司 引线框架片材
JP5762078B2 (ja) * 2011-03-28 2015-08-12 新光電気工業株式会社 リードフレーム
JP5875848B2 (ja) * 2011-12-16 2016-03-02 株式会社東芝 フォトカプラの製造方法及びフォトカプラ用リードフレームシート
US8884414B2 (en) * 2013-01-09 2014-11-11 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US9013030B2 (en) * 2013-03-28 2015-04-21 Infineon Technologies Ag Leadframe, semiconductor package including a leadframe and method for producing a leadframe
US9171766B2 (en) * 2013-05-03 2015-10-27 Infineon Technologies Ag Lead frame strips with support members
US9054091B2 (en) * 2013-06-10 2015-06-09 Alpha & Omega Semiconductor, Inc. Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
JP6603982B2 (ja) * 2013-07-31 2019-11-13 日亜化学工業株式会社 リードフレーム、樹脂付きリードフレーム、樹脂パッケージ、発光装置及び樹脂パッケージの製造方法
US9252063B2 (en) * 2014-07-07 2016-02-02 Infineon Technologies Ag Extended contact area for leadframe strip testing
US9337130B2 (en) * 2014-07-28 2016-05-10 Texas Instruments Incorporated Leadframe strip and leadframes
USD780722S1 (en) * 2015-01-13 2017-03-07 Avery Dennison Retail Information Services, Llc Antenna
JP6573356B2 (ja) * 2015-01-22 2019-09-11 大口マテリアル株式会社 リードフレーム

Also Published As

Publication number Publication date
TWD175797S (zh) 2016-05-21
USD803800S1 (en) 2017-11-28

Similar Documents

Publication Publication Date Title
BR112018002275A2 (ja)
BR112017026121A2 (ja)
BR112018005526A2 (ja)
BR112018002793A2 (ja)
BR0008719B1 (ja)
BR0009349B1 (ja)
CN303105008S (ja)
CN303099491S (ja)
CN303096076S (ja)
CN303095678S (ja)
CN303095674S (ja)
CN303095468S (ja)
CN303094177S (ja)
CN303088140S (ja)
CN303080553S (ja)
CN303075167S (ja)
CN303075103S (ja)
CN303071353S (ja)
CN303066661S (ja)
BR9912994B1 (ja)
BR0318106B1 (ja)
BR0309765B1 (ja)
BR0010150B1 (ja)
BR0009994B1 (ja)
BR0009942B1 (ja)