TWD175797S - 導線框之部分 - Google Patents

導線框之部分

Info

Publication number
TWD175797S
TWD175797S TW104305869F TW104305869F TWD175797S TW D175797 S TWD175797 S TW D175797S TW 104305869 F TW104305869 F TW 104305869F TW 104305869 F TW104305869 F TW 104305869F TW D175797 S TWD175797 S TW D175797S
Authority
TW
Taiwan
Prior art keywords
design
parts
lead frame
item
diagram
Prior art date
Application number
TW104305869F
Other languages
English (en)
Chinese (zh)
Inventor
Atsushi Takeshita
Original Assignee
東芝股份有限公司
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝股份有限公司, Toshiba Kk filed Critical 東芝股份有限公司
Publication of TWD175797S publication Critical patent/TWD175797S/zh

Links

TW104305869F 2015-04-20 2015-10-20 導線框之部分 TWD175797S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-8836F JP1537980S (ja) 2015-04-20 2015-04-20

Publications (1)

Publication Number Publication Date
TWD175797S true TWD175797S (zh) 2016-05-21

Family

ID=54549588

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104305869F TWD175797S (zh) 2015-04-20 2015-10-20 導線框之部分

Country Status (3)

Country Link
US (1) USD803800S1 (ja)
JP (1) JP1537980S (ja)
TW (1) TWD175797S (ja)

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316821B1 (en) * 1998-09-28 2001-11-13 Cypress Semiconductor Corporation High density lead frames and methods for plastic injection molding
JP3711776B2 (ja) * 1999-02-09 2005-11-02 松下電器産業株式会社 固体電解コンデンサの製造方法およびその製造装置
US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
TW433551U (en) * 1999-10-26 2001-05-01 You Shang Hua Improvement of cup base for light emitting diode chip
US6433424B1 (en) * 2000-12-14 2002-08-13 International Rectifier Corporation Semiconductor device package and lead frame with die overhanging lead frame pad
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
JP3872001B2 (ja) * 2002-11-18 2007-01-24 シャープ株式会社 リードフレーム、それを用いた半導体装置の製造方法、それを用いた半導体装置、及び電子機器
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US8211753B2 (en) * 2003-08-26 2012-07-03 Stats Chippac Ltd. Leadframe-based mold array package heat spreader and fabrication method therefor
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
JP5634033B2 (ja) * 2008-08-29 2014-12-03 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 樹脂封止型半導体装置とその製造方法
CN102169864B (zh) * 2010-02-26 2015-06-17 飞思卡尔半导体公司 引线框架片材
JP5762078B2 (ja) * 2011-03-28 2015-08-12 新光電気工業株式会社 リードフレーム
JP5875848B2 (ja) * 2011-12-16 2016-03-02 株式会社東芝 フォトカプラの製造方法及びフォトカプラ用リードフレームシート
US8884414B2 (en) * 2013-01-09 2014-11-11 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US9013030B2 (en) * 2013-03-28 2015-04-21 Infineon Technologies Ag Leadframe, semiconductor package including a leadframe and method for producing a leadframe
US9171766B2 (en) * 2013-05-03 2015-10-27 Infineon Technologies Ag Lead frame strips with support members
US9054091B2 (en) * 2013-06-10 2015-06-09 Alpha & Omega Semiconductor, Inc. Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
JP6603982B2 (ja) * 2013-07-31 2019-11-13 日亜化学工業株式会社 リードフレーム、樹脂付きリードフレーム、樹脂パッケージ、発光装置及び樹脂パッケージの製造方法
US9252063B2 (en) * 2014-07-07 2016-02-02 Infineon Technologies Ag Extended contact area for leadframe strip testing
US9337130B2 (en) * 2014-07-28 2016-05-10 Texas Instruments Incorporated Leadframe strip and leadframes
USD780722S1 (en) * 2015-01-13 2017-03-07 Avery Dennison Retail Information Services, Llc Antenna
JP6573356B2 (ja) * 2015-01-22 2019-09-11 大口マテリアル株式会社 リードフレーム

Also Published As

Publication number Publication date
USD803800S1 (en) 2017-11-28
JP1537980S (ja) 2015-11-16

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