USD803801S1 - Lead frame - Google Patents

Lead frame Download PDF

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Publication number
USD803801S1
USD803801S1 US29/543,065 US201529543065F USD803801S US D803801 S1 USD803801 S1 US D803801S1 US 201529543065 F US201529543065 F US 201529543065F US D803801 S USD803801 S US D803801S
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US
United States
Prior art keywords
lead frame
view
taken along
along line
end view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/543,065
Inventor
Atsushi Takeshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Devices and Storage Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKESHITA, ATSUSHI
Application granted granted Critical
Publication of USD803801S1 publication Critical patent/USD803801S1/en
Assigned to TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION reassignment TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KABUSHIKI KAISHA TOSHIBA
Assigned to KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is an enlarged fragmented perspective view taken along line 2 in FIG. 11 of a lead frame, showing my new design;
FIG. 2 is an enlarged fragmented view thereof taken along line 2 in FIG. 11;
FIG. 3 is an end view thereof taken along line 3-3 in FIG. 2;
FIG. 4 is an end view thereof taken along line 4-4 in FIG. 2;
FIG. 5 is an end view thereof taken along line 5-5 in FIG. 2;
FIG. 6 is an end view thereof taken along line 6-6 in FIG. 2;
FIG. 7 is an end view thereof taken along line 7-7 in FIG. 2;
FIG. 8 is an end view thereof taken along line 8-8 in FIG. 2;
FIG. 9 is an end view thereof taken along line 9-9 in FIG. 2;
FIG. 10 is a perspective view thereof;
FIG. 11 is a front view thereof;
FIG. 12 is a top view thereof;
FIG. 13 is a bottom view thereof;
FIG. 14 is a right side view thereof, the opposite side being symmetrical;
FIG. 15 is a rear view thereof;
FIG. 16 is an enlarged view thereof taken along line 16-16 in FIG. 13;
FIG. 17 is an end view thereof taken along line 17-17 in FIG. 11; and,
FIG. 18 is an end view thereof taken along line 18-18 in FIG. 11.
The Dash-Dot broken lines in FIG. 11 labeled as “2” are included to indicate the point at which the magnified view is cut off. The Dash-Dot broken lines define the bounds of the claimed design and form no part thereof. The Dash-Dash broken line portion of the figure drawings is included to show environment and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a lead frame, as shown and described.
US29/543,065 2015-04-20 2015-10-20 Lead frame Active USD803801S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-008837 2015-01-20
JPD2015-8837F JP1537981S (en) 2015-04-20 2015-04-20

Publications (1)

Publication Number Publication Date
USD803801S1 true USD803801S1 (en) 2017-11-28

Family

ID=54549589

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/543,065 Active USD803801S1 (en) 2015-04-20 2015-10-20 Lead frame

Country Status (3)

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US (1) USD803801S1 (en)
JP (1) JP1537981S (en)
TW (1) TWD175796S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10964628B2 (en) * 2019-02-21 2021-03-30 Infineon Technologies Ag Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
US11515244B2 (en) 2019-02-21 2022-11-29 Infineon Technologies Ag Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture

Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316821B1 (en) * 1998-09-28 2001-11-13 Cypress Semiconductor Corporation High density lead frames and methods for plastic injection molding
US6409775B1 (en) * 1999-02-09 2002-06-25 Matsushita Electric Industrial Co., Ltd. Method of molding a plurality of solid electrolytic capacitors on a metal lead frame
US6433424B1 (en) * 2000-12-14 2002-08-13 International Rectifier Corporation Semiconductor device package and lead frame with die overhanging lead frame pad
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
US20100052125A1 (en) * 2008-08-29 2010-03-04 Sanyo Electric Co., Ltd. Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
USD637566S1 (en) * 2010-08-10 2011-05-10 Taymac Corporation Electrical receptacle circuit board
US20110212341A1 (en) * 2010-02-26 2011-09-01 Freescale Semiconductor, Inc. Lead frame sheet
USD656469S1 (en) * 2011-04-28 2012-03-27 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
JP2013128007A (en) * 2011-12-16 2013-06-27 Toshiba Corp Manufacturing method of photocoupler and lead frame sheet for photocoupler
US20140252574A1 (en) * 2013-03-05 2014-09-11 Nichia Corporation Lead frame and semiconductor device
US20140327004A1 (en) * 2013-05-03 2014-11-06 Infineon Technologies Ag Lead Frame Strips with Support Members
US20150064849A1 (en) * 2013-08-30 2015-03-05 Infineon Technologies Ag Lead Frame Strips with Electrical Isolation of Die Paddles
US9054091B2 (en) * 2013-06-10 2015-06-09 Alpha & Omega Semiconductor, Inc. Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
US20160027721A1 (en) * 2014-07-28 2016-01-28 Texas Instruments Incorporated Leadframe Strip And Leadframes
USD762197S1 (en) * 2014-09-12 2016-07-26 Taoglas Group Holdings Limited GPS antenna assembly
US20160218051A1 (en) * 2015-01-22 2016-07-28 Sh Materials Co., Ltd. Lead frame
US9607934B2 (en) * 2013-07-31 2017-03-28 Nichia Corporation Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package

Patent Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316821B1 (en) * 1998-09-28 2001-11-13 Cypress Semiconductor Corporation High density lead frames and methods for plastic injection molding
US6409775B1 (en) * 1999-02-09 2002-06-25 Matsushita Electric Industrial Co., Ltd. Method of molding a plurality of solid electrolytic capacitors on a metal lead frame
US6433424B1 (en) * 2000-12-14 2002-08-13 International Rectifier Corporation Semiconductor device package and lead frame with die overhanging lead frame pad
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
US20100052125A1 (en) * 2008-08-29 2010-03-04 Sanyo Electric Co., Ltd. Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
US20110212341A1 (en) * 2010-02-26 2011-09-01 Freescale Semiconductor, Inc. Lead frame sheet
USD637566S1 (en) * 2010-08-10 2011-05-10 Taymac Corporation Electrical receptacle circuit board
USD656469S1 (en) * 2011-04-28 2012-03-27 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
JP2013128007A (en) * 2011-12-16 2013-06-27 Toshiba Corp Manufacturing method of photocoupler and lead frame sheet for photocoupler
US20140252574A1 (en) * 2013-03-05 2014-09-11 Nichia Corporation Lead frame and semiconductor device
US20140327004A1 (en) * 2013-05-03 2014-11-06 Infineon Technologies Ag Lead Frame Strips with Support Members
US9054091B2 (en) * 2013-06-10 2015-06-09 Alpha & Omega Semiconductor, Inc. Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
US9607934B2 (en) * 2013-07-31 2017-03-28 Nichia Corporation Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package
US20150064849A1 (en) * 2013-08-30 2015-03-05 Infineon Technologies Ag Lead Frame Strips with Electrical Isolation of Die Paddles
US20160027721A1 (en) * 2014-07-28 2016-01-28 Texas Instruments Incorporated Leadframe Strip And Leadframes
USD762197S1 (en) * 2014-09-12 2016-07-26 Taoglas Group Holdings Limited GPS antenna assembly
US20160218051A1 (en) * 2015-01-22 2016-07-28 Sh Materials Co., Ltd. Lead frame

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Excel Cell Electronic Co., dated Dec. 29, 2014, [online], [site visited Mar. 31, 2017]. Available from Internet, <URL: http://www.ece.com.tw/product.php>. *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10964628B2 (en) * 2019-02-21 2021-03-30 Infineon Technologies Ag Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
US11515244B2 (en) 2019-02-21 2022-11-29 Infineon Technologies Ag Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture

Also Published As

Publication number Publication date
JP1537981S (en) 2015-11-16
TWD175796S (en) 2016-05-21

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