JP1537981S - - Google Patents

Info

Publication number
JP1537981S
JP1537981S JPD2015-8837F JP2015008837F JP1537981S JP 1537981 S JP1537981 S JP 1537981S JP 2015008837 F JP2015008837 F JP 2015008837F JP 1537981 S JP1537981 S JP 1537981S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2015-8837F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2015-8837F priority Critical patent/JP1537981S/ja
Priority to US29/543,065 priority patent/USD803801S1/en
Priority to TW104305868F priority patent/TWD175796S/zh
Application granted granted Critical
Publication of JP1537981S publication Critical patent/JP1537981S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2015-8837F 2015-04-20 2015-04-20 Active JP1537981S (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2015-8837F JP1537981S (ja) 2015-04-20 2015-04-20
US29/543,065 USD803801S1 (en) 2015-04-20 2015-10-20 Lead frame
TW104305868F TWD175796S (zh) 2015-04-20 2015-10-20 導線框之部分

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-8837F JP1537981S (ja) 2015-04-20 2015-04-20

Publications (1)

Publication Number Publication Date
JP1537981S true JP1537981S (ja) 2015-11-16

Family

ID=54549589

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2015-8837F Active JP1537981S (ja) 2015-04-20 2015-04-20

Country Status (3)

Country Link
US (1) USD803801S1 (ja)
JP (1) JP1537981S (ja)
TW (1) TWD175796S (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11515244B2 (en) 2019-02-21 2022-11-29 Infineon Technologies Ag Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
US10964628B2 (en) * 2019-02-21 2021-03-30 Infineon Technologies Ag Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316821B1 (en) * 1998-09-28 2001-11-13 Cypress Semiconductor Corporation High density lead frames and methods for plastic injection molding
JP3711776B2 (ja) * 1999-02-09 2005-11-02 松下電器産業株式会社 固体電解コンデンサの製造方法およびその製造装置
US6433424B1 (en) * 2000-12-14 2002-08-13 International Rectifier Corporation Semiconductor device package and lead frame with die overhanging lead frame pad
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
JP5634033B2 (ja) * 2008-08-29 2014-12-03 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 樹脂封止型半導体装置とその製造方法
CN102169864B (zh) * 2010-02-26 2015-06-17 飞思卡尔半导体公司 引线框架片材
USD637566S1 (en) * 2010-08-10 2011-05-10 Taymac Corporation Electrical receptacle circuit board
USD656469S1 (en) * 2011-04-28 2012-03-27 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
JP5875848B2 (ja) * 2011-12-16 2016-03-02 株式会社東芝 フォトカプラの製造方法及びフォトカプラ用リードフレームシート
US9748164B2 (en) * 2013-03-05 2017-08-29 Nichia Corporation Semiconductor device
US9171766B2 (en) * 2013-05-03 2015-10-27 Infineon Technologies Ag Lead frame strips with support members
US9054091B2 (en) * 2013-06-10 2015-06-09 Alpha & Omega Semiconductor, Inc. Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
JP6603982B2 (ja) * 2013-07-31 2019-11-13 日亜化学工業株式会社 リードフレーム、樹脂付きリードフレーム、樹脂パッケージ、発光装置及び樹脂パッケージの製造方法
US9263419B2 (en) * 2013-08-30 2016-02-16 Infineon Technologies Ag Lead frame strips with electrical isolation of die paddles
US9337130B2 (en) * 2014-07-28 2016-05-10 Texas Instruments Incorporated Leadframe strip and leadframes
USD762197S1 (en) * 2014-09-12 2016-07-26 Taoglas Group Holdings Limited GPS antenna assembly
JP6573356B2 (ja) * 2015-01-22 2019-09-11 大口マテリアル株式会社 リードフレーム

Also Published As

Publication number Publication date
TWD175796S (zh) 2016-05-21
USD803801S1 (en) 2017-11-28

Similar Documents

Publication Publication Date Title
BE2015C047I2 (ja)
BE2015C044I2 (ja)
BR0009761B1 (ja)
BR0003928B1 (ja)
BR0000126B1 (ja)
BR0000695B1 (ja)
BR0000763F1 (ja)
BR0001536B1 (ja)
BR0001684B1 (ja)
BR0001810B1 (ja)
BR0002033B1 (ja)
BR0002402B1 (ja)
BR0002435B1 (ja)
BR0002694B1 (ja)
BR0002802B1 (ja)
BR0002874B1 (ja)
BR0003166B1 (ja)
BR0003208B1 (ja)
BR0003401B1 (ja)
BR0003686B1 (ja)
BR0003746B1 (ja)
BR0003751B1 (ja)
BR0009757B1 (ja)
BR0004687B1 (ja)
BR0005041B1 (ja)