DE2759952C2 - Verfahren zur Betriebssteuerung eines ohne äußere Stromzufuhr arbeitenden Verkupferungsbades - Google Patents
Verfahren zur Betriebssteuerung eines ohne äußere Stromzufuhr arbeitenden VerkupferungsbadesInfo
- Publication number
- DE2759952C2 DE2759952C2 DE2759952A DE2759952A DE2759952C2 DE 2759952 C2 DE2759952 C2 DE 2759952C2 DE 2759952 A DE2759952 A DE 2759952A DE 2759952 A DE2759952 A DE 2759952A DE 2759952 C2 DE2759952 C2 DE 2759952C2
- Authority
- DE
- Germany
- Prior art keywords
- bath
- electrode
- mixed potential
- value
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 42
- 239000010949 copper Substances 0.000 title claims description 42
- 229910052802 copper Inorganic materials 0.000 title claims description 41
- 238000000034 method Methods 0.000 title claims description 31
- 238000007747 plating Methods 0.000 title claims description 15
- 230000008569 process Effects 0.000 title claims description 10
- 239000007788 liquid Substances 0.000 claims description 34
- 239000003381 stabilizer Substances 0.000 claims description 23
- 230000008021 deposition Effects 0.000 claims description 20
- 229940075397 calomel Drugs 0.000 claims description 12
- ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical compound Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 claims description 12
- 238000000926 separation method Methods 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 230000009467 reduction Effects 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 238000005137 deposition process Methods 0.000 claims description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 72
- 238000007792 addition Methods 0.000 description 23
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 23
- 238000000151 deposition Methods 0.000 description 20
- 230000000694 effects Effects 0.000 description 20
- 238000005259 measurement Methods 0.000 description 17
- 239000000243 solution Substances 0.000 description 15
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 12
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 11
- 229910000365 copper sulfate Inorganic materials 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 229910001431 copper ion Inorganic materials 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000003638 chemical reducing agent Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 239000008139 complexing agent Substances 0.000 description 6
- 230000000875 corresponding effect Effects 0.000 description 6
- 230000002829 reductive effect Effects 0.000 description 6
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000006227 byproduct Substances 0.000 description 5
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000000080 wetting agent Substances 0.000 description 5
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- ZYDVNTYVDVZMKF-UHFFFAOYSA-N [Cl].[Ag] Chemical compound [Cl].[Ag] ZYDVNTYVDVZMKF-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 4
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 4
- 230000002269 spontaneous effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- DPLVEEXVKBWGHE-UHFFFAOYSA-N potassium sulfide Chemical compound [S-2].[K+].[K+] DPLVEEXVKBWGHE-UHFFFAOYSA-N 0.000 description 3
- -1 2-hydroxypropyl Chemical group 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000008098 formaldehyde solution Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 235000010265 sodium sulphite Nutrition 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 150000003464 sulfur compounds Chemical class 0.000 description 2
- 229940095064 tartrate Drugs 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 241000530268 Lycaena heteronea Species 0.000 description 1
- 229910003251 Na K Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- HEEXXOPCWXVDEB-UHFFFAOYSA-N [C-]#N.[Na+].C=O Chemical compound [C-]#N.[Na+].C=O HEEXXOPCWXVDEB-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- TVJORGWKNPGCDW-UHFFFAOYSA-N aminoboron Chemical compound N[B] TVJORGWKNPGCDW-UHFFFAOYSA-N 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- VIQAOIGVRNWUDN-UHFFFAOYSA-N ethane-1,2-diamine formaldehyde Chemical compound C=O.C(CN)N VIQAOIGVRNWUDN-UHFFFAOYSA-N 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000003197 gene knockdown Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000000546 pharmaceutical excipient Substances 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 230000003334 potential effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- GJIMNMWWEUBESO-UHFFFAOYSA-M sodium formaldehyde hydroxide Chemical compound [OH-].[Na+].O=C GJIMNMWWEUBESO-UHFFFAOYSA-M 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000003442 weekly effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74411076A | 1976-11-22 | 1976-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2759952C2 true DE2759952C2 (de) | 1984-03-08 |
Family
ID=24991471
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2759952A Expired DE2759952C2 (de) | 1976-11-22 | 1977-11-11 | Verfahren zur Betriebssteuerung eines ohne äußere Stromzufuhr arbeitenden Verkupferungsbades |
| DE19772751104 Ceased DE2751104A1 (de) | 1976-11-22 | 1977-11-11 | Verfahren zum steuern stromlos arbeitender metallisierungsbaeder |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19772751104 Ceased DE2751104A1 (de) | 1976-11-22 | 1977-11-11 | Verfahren zum steuern stromlos arbeitender metallisierungsbaeder |
Country Status (14)
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5953348B2 (ja) * | 1977-12-16 | 1984-12-24 | 株式会社日立製作所 | 化学銅めつき液の主成分自動管理方法並びにその装置 |
| DE2911073C2 (de) | 1979-03-21 | 1984-01-12 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und Vorrichtung zum automatischen Messen und Regeln der Konzentration der Hauptkomponenten eines Bades zum stromlosen Abscheiden von Kupfer |
| US4276323A (en) * | 1979-12-21 | 1981-06-30 | Hitachi, Ltd. | Process for controlling of chemical copper plating solution |
| JPS6096767A (ja) * | 1983-10-31 | 1985-05-30 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 銅めつき方法 |
| US4707377A (en) * | 1983-10-31 | 1987-11-17 | International Business Machines Corporation | Copper plating |
| JPS61110799A (ja) * | 1984-10-30 | 1986-05-29 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | 金属めつき槽の制御装置 |
| US4623554A (en) * | 1985-03-08 | 1986-11-18 | International Business Machines Corp. | Method for controlling plating rate in an electroless plating system |
| US4908242A (en) * | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
| ES2039403T3 (es) * | 1986-10-31 | 1993-10-01 | Amp-Akzo Corporation (A Delaware Corp.) | Metodo para depositar sin electricidad cobre de alta calidad. |
| US4774101A (en) * | 1986-12-10 | 1988-09-27 | American Telephone And Telegraph Company, At&T Technologies, Inc. | Automated method for the analysis and control of the electroless metal plating solution |
| JPS63149278U (enrdf_load_stackoverflow) * | 1987-03-19 | 1988-09-30 | ||
| DE3718584A1 (de) * | 1987-06-03 | 1988-12-15 | Norddeutsche Affinerie | Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten |
| US4842886A (en) * | 1987-11-04 | 1989-06-27 | International Business Machines Corporation | Method for electroless plating |
| AU3304389A (en) * | 1988-04-29 | 1989-11-02 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
| GB2225026A (en) * | 1988-11-22 | 1990-05-23 | American Chem & Refining Co | Electroless gold plating composition |
| JP2005206931A (ja) | 2003-12-26 | 2005-08-04 | Sumitomo Electric Ind Ltd | 金属粉末の製造方法 |
| JP5116068B2 (ja) * | 2004-09-07 | 2013-01-09 | Ｊｘ日鉱日石金属株式会社 | 無電解金めっき液の安定化方法 |
| CN120006271B (zh) * | 2025-04-18 | 2025-08-01 | 南通赛可特电子有限公司 | 一种化学镀铜溶液的制备参数调控方法及装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3375178A (en) * | 1964-05-28 | 1968-03-26 | Continental Oil Co | Method of confirming the occurrence of plating in electroless nickel-plating |
| FR1522048A (fr) * | 1966-05-06 | 1968-04-19 | Photocircuits Corp | Dépôt non galvanique de métaux |
| JPS5921386B2 (ja) * | 1976-04-13 | 1984-05-19 | 株式会社東芝 | 無電解メツキのメツキ速度自動制御方法 |
-
1977
- 1977-09-13 ZA ZA00775495A patent/ZA775495B/xx unknown
- 1977-11-03 IL IL53298A patent/IL53298A/xx unknown
- 1977-11-11 DE DE2759952A patent/DE2759952C2/de not_active Expired
- 1977-11-11 DE DE19772751104 patent/DE2751104A1/de not_active Ceased
- 1977-11-17 NL NL7712683A patent/NL7712683A/xx not_active Application Discontinuation
- 1977-11-18 AT AT827777A patent/AT354213B/de not_active IP Right Cessation
- 1977-11-18 AU AU30760/77A patent/AU512805B2/en not_active Expired
- 1977-11-18 ES ES464266A patent/ES464266A1/es not_active Expired
- 1977-11-18 CA CA291,214A patent/CA1112523A/en not_active Expired
- 1977-11-21 CH CH1419677A patent/CH637995A5/de not_active IP Right Cessation
- 1977-11-21 GB GB48323/77A patent/GB1588758A/en not_active Expired
- 1977-11-22 FR FR7734995A patent/FR2371522A1/fr active Granted
- 1977-11-22 JP JP14147477A patent/JPS5365226A/ja active Granted
- 1977-11-22 IT IT51901/77A patent/IT1116376B/it active
- 1977-11-22 SE SE7713192A patent/SE442410B/sv not_active IP Right Cessation
Non-Patent Citations (1)
| Title |
|---|
| NICHTS-ERMITTELT * |
Also Published As
| Publication number | Publication date |
|---|---|
| SE442410B (sv) | 1985-12-23 |
| IL53298A0 (en) | 1978-01-31 |
| ATA827777A (de) | 1979-05-15 |
| ES464266A1 (es) | 1978-08-01 |
| ZA775495B (en) | 1978-07-26 |
| IT1116376B (it) | 1986-02-10 |
| CH637995A5 (en) | 1983-08-31 |
| JPS5365226A (en) | 1978-06-10 |
| IL53298A (en) | 1981-02-27 |
| NL7712683A (nl) | 1978-05-24 |
| JPS5753857B2 (enrdf_load_stackoverflow) | 1982-11-15 |
| DE2751104A1 (de) | 1978-05-24 |
| AU3076077A (en) | 1979-05-24 |
| FR2371522B1 (enrdf_load_stackoverflow) | 1980-02-15 |
| AU512805B2 (en) | 1980-10-30 |
| CA1112523A (en) | 1981-11-17 |
| FR2371522A1 (fr) | 1978-06-16 |
| AT354213B (de) | 1979-12-27 |
| SE7713192L (sv) | 1978-05-23 |
| GB1588758A (en) | 1981-04-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE2759952C2 (de) | Verfahren zur Betriebssteuerung eines ohne äußere Stromzufuhr arbeitenden Verkupferungsbades | |
| DE3005159C2 (de) | Verfahren zur Plattierung von Stahlbändern mit einer Zink-Nickel-Legierung | |
| DE3736429C2 (de) | Verfahren zur steuerung von stromlos metall abscheidenden badloesungen | |
| DE102006019496A1 (de) | Elektrophosphatierprozess | |
| EP2649223A2 (de) | Elektrolyt für die galvanische abscheidung von gold-legierungen und verfahren zu dessen herstellung | |
| DE19856840A1 (de) | Verfahren zur Abwasser-Behandlung und Behandlungsvorrichtung hierfür | |
| DE3601698C2 (enrdf_load_stackoverflow) | ||
| DE2837219A1 (de) | Verfahren und vorrichtung zur kontrolle der halogenionenkonzentration einer fotografischen behandlungsloesung | |
| DE2847961C2 (enrdf_load_stackoverflow) | ||
| DE2337733C3 (de) | Verfahren und Anlage zum Aufbereiten von Abwässern | |
| EP0178347B1 (de) | Verfahren zum automatischen Regenerieren von Kupferchlorid-Ätzlösungen | |
| DE1017000B (de) | Bad und Verfahren fuer die elektrolytische Abscheidung von Kupferueberzuegen | |
| DE2025670A1 (de) | Kontinuierlich durchgeführtes Plattierungsverfahren | |
| DE3300317A1 (de) | Verfahren zur galvanischen abscheidung von chrom | |
| DE2713392A1 (de) | Verfahren und einrichtung zum herstellen von zur chemischen metallabscheidung geeigneten metallkomplexverbindungen und zum betrieb chemischer metallisierungsbaeder | |
| DE2929305C2 (de) | Verfahren und Vorrichtung zur kontinuierlichen galvanischen Abscheidung von Mangan auf Stahl | |
| DE1220798B (de) | Verfahren zur elektrolytischen Behandlung kochsalzhaltiger Waesser, insbesondere von Meerwasser, zwecks Verhuetung von Kesselsteinablagerungen | |
| EP0240589A1 (de) | Verfahren zur Regenerierung eines stromlosen Verkupferungsbades und Vorrichtung zur Durchführung desselben | |
| DE3345795A1 (de) | Elektrolyt zur galvanischen abscheidung niedrigkaraetiger gold-kupfer-zink-legierungen | |
| DE3423690A1 (de) | Waessriges bad zur abscheidung von gold und dessen verwendung bei einem galvanischen verfahren | |
| DE4218916C2 (de) | Verwendung einer Gitteranode zur elektrolytische Entgiftung oder Regeneration einer Cyanid enthaltenden wäßrigen Lösung | |
| DE3034749A1 (de) | Verfahren zum automatischen steuern der zusammensetzung einer chemischen verkupferungsloesung | |
| DE4229917C1 (en) | Electrolytic bath for meter coating - has sec. anode contg. alkaline or ammonium soln. with acid added to electrolyte to compensate for pH rise | |
| DE2363462C3 (de) | Verfahren zum galvanischen Abscheiden von Weichgoldschichten | |
| EP0079032B1 (de) | Vorrichtung zum galvanischen Beschichten eines metallischen Werkstücks |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AC | Divided out of |
Ref country code: DE Ref document number: 2751104 Format of ref document f/p: P |
|
| Q172 | Divided out of (supplement): |
Ref country code: DE Ref document number: 2751104 |
|
| 8110 | Request for examination paragraph 44 | ||
| 8128 | New person/name/address of the agent |
Representative=s name: PFENNING, J., DIPL.-ING. MEINIG, K., DIPL.-PHYS., |
|
| AC | Divided out of |
Ref country code: DE Ref document number: 2751104 Format of ref document f/p: P |
|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |