DE2746938C2 - Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades - Google Patents
Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses BadesInfo
- Publication number
- DE2746938C2 DE2746938C2 DE2746938A DE2746938A DE2746938C2 DE 2746938 C2 DE2746938 C2 DE 2746938C2 DE 2746938 A DE2746938 A DE 2746938A DE 2746938 A DE2746938 A DE 2746938A DE 2746938 C2 DE2746938 C2 DE 2746938C2
- Authority
- DE
- Germany
- Prior art keywords
- acid
- bath
- acid amide
- compound
- alkali
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 15
- 229910052802 copper Inorganic materials 0.000 title claims description 13
- 239000010949 copper Substances 0.000 title claims description 13
- 238000000576 coating method Methods 0.000 title claims description 7
- 230000008021 deposition Effects 0.000 title claims description 4
- 239000011260 aqueous acid Substances 0.000 title 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 12
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 claims description 8
- -1 thio compound Chemical class 0.000 claims description 8
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 150000002148 esters Chemical class 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229920002125 Sokalan® Polymers 0.000 claims description 5
- 150000001408 amides Chemical class 0.000 claims description 5
- 150000002894 organic compounds Chemical class 0.000 claims description 5
- 239000004584 polyacrylic acid Substances 0.000 claims description 5
- 229920000151 polyglycol Polymers 0.000 claims description 5
- 239000010695 polyglycol Substances 0.000 claims description 5
- 229920001451 polypropylene glycol Polymers 0.000 claims description 5
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 claims description 4
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 4
- KXDAEFPNCMNJSK-UHFFFAOYSA-N Benzamide Chemical compound NC(=O)C1=CC=CC=C1 KXDAEFPNCMNJSK-UHFFFAOYSA-N 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 4
- RYYWUUFWQRZTIU-UHFFFAOYSA-N Thiophosphoric acid Chemical compound OP(O)(S)=O RYYWUUFWQRZTIU-UHFFFAOYSA-N 0.000 claims description 4
- 230000002378 acidificating effect Effects 0.000 claims description 4
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 claims description 4
- 229920001522 polyglycol ester Polymers 0.000 claims description 4
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 claims description 4
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 150000001879 copper Chemical class 0.000 claims description 3
- LMBWSYZSUOEYSN-UHFFFAOYSA-N diethyldithiocarbamic acid Chemical compound CCN(CC)C(S)=S LMBWSYZSUOEYSN-UHFFFAOYSA-N 0.000 claims description 3
- 229950004394 ditiocarb Drugs 0.000 claims description 3
- 150000007522 mineralic acids Chemical class 0.000 claims description 3
- 229920001521 polyalkylene glycol ether Polymers 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 2
- 239000005642 Oleic acid Substances 0.000 claims description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims description 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 2
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims 5
- 150000001447 alkali salts Chemical class 0.000 claims 3
- BGRULSGHCKMLAO-UHFFFAOYSA-N 3-isothiocyanatopropane-1-sulfonic acid Chemical compound OS(=O)(=O)CCCN=C=S BGRULSGHCKMLAO-UHFFFAOYSA-N 0.000 claims 1
- OBDVFOBWBHMJDG-UHFFFAOYSA-N 3-mercapto-1-propanesulfonic acid Chemical compound OS(=O)(=O)CCCS OBDVFOBWBHMJDG-UHFFFAOYSA-N 0.000 claims 1
- ONFUFVNGQIHXNU-UHFFFAOYSA-N [O-]S(CCC[S+]1C(S)=NC2=C1C=CC=C2)(=O)=O Chemical compound [O-]S(CCC[S+]1C(S)=NC2=C1C=CC=C2)(=O)=O ONFUFVNGQIHXNU-UHFFFAOYSA-N 0.000 claims 1
- MVRZBDLOPSKKBG-UHFFFAOYSA-N ethanethioamide;propane-1-sulfonic acid Chemical compound CC(N)=S.CCCS(O)(=O)=O MVRZBDLOPSKKBG-UHFFFAOYSA-N 0.000 claims 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 claims 1
- 239000000080 wetting agent Substances 0.000 claims 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 229910000365 copper sulfate Inorganic materials 0.000 description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 5
- 239000011780 sodium chloride Substances 0.000 description 4
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical class [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920002401 polyacrylamide Polymers 0.000 description 2
- 159000000000 sodium salts Chemical class 0.000 description 2
- FTCLAXOKVVLHEG-UHFFFAOYSA-N sodium;3-sulfanylpropane-1-sulfonic acid Chemical compound [Na].OS(=O)(=O)CCCS FTCLAXOKVVLHEG-UHFFFAOYSA-N 0.000 description 2
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 2
- 239000001117 sulphuric acid Substances 0.000 description 2
- 235000011149 sulphuric acid Nutrition 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- UGWULZWUXSCWPX-UHFFFAOYSA-N 2-sulfanylideneimidazolidin-4-one Chemical compound O=C1CNC(=S)N1 UGWULZWUXSCWPX-UHFFFAOYSA-N 0.000 description 1
- VOKFESKJFXDLAS-UHFFFAOYSA-N C(CC)S(=O)(=O)O.C(C)(=S)N.[Na] Chemical compound C(CC)S(=O)(=O)O.C(C)(=S)N.[Na] VOKFESKJFXDLAS-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- DCEQCSJMZBSQRY-UHFFFAOYSA-N [O-]S(CCC[S+]1C(S)=NC2=C1C=CC=C2)(=O)=O.[Na] Chemical compound [O-]S(CCC[S+]1C(S)=NC2=C1C=CC=C2)(=O)=O.[Na] DCEQCSJMZBSQRY-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 150000003560 thiocarbamic acids Chemical class 0.000 description 1
- 150000003580 thiophosphoric acid esters Chemical class 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Lubricants (AREA)
- Detergent Compositions (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2746938A DE2746938C2 (de) | 1977-10-17 | 1977-10-17 | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades |
| US05/947,746 US4181582A (en) | 1977-10-17 | 1978-10-02 | Galvanic acid copper bath and method |
| CH1066578A CH642686A5 (de) | 1977-10-17 | 1978-10-13 | Saures galvanisches kupferbad. |
| SE7810754A SE447275B (sv) | 1977-10-17 | 1978-10-16 | Surt galvaniskt kopparbad samt anvendning av detsamma for utfellning av glensande kopparskikt |
| JP53126287A JPS59596B2 (ja) | 1977-10-17 | 1978-10-16 | 酸性銅メツキ浴 |
| GB7840680A GB2009238B (en) | 1977-10-17 | 1978-10-16 | Acidic copper electrolyte |
| FR7829381A FR2406009A1 (fr) | 1977-10-17 | 1978-10-16 | Bain de cuivrage electrolytique acide |
| IT28812/78A IT1099997B (it) | 1977-10-17 | 1978-10-17 | Bagno galvanico acido di rame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2746938A DE2746938C2 (de) | 1977-10-17 | 1977-10-17 | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2746938A1 DE2746938A1 (de) | 1979-04-19 |
| DE2746938C2 true DE2746938C2 (de) | 1987-04-09 |
Family
ID=6021780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2746938A Expired DE2746938C2 (de) | 1977-10-17 | 1977-10-17 | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades |
Country Status (8)
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4032864A1 (de) * | 1990-10-13 | 1992-04-16 | Schering Ag | Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination |
| DE4126502C1 (US07655746-20100202-C00011.png) * | 1991-08-07 | 1993-02-11 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3012168A1 (de) * | 1980-03-27 | 1981-10-01 | Schering Ag Berlin Und Bergkamen, 1000 Berlin | Verfahren zur galvanischen abscheidung von kupferniederschlaegen |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| US4490220A (en) * | 1982-09-30 | 1984-12-25 | Learonal, Inc. | Electrolytic copper plating solutions |
| JPS59501829A (ja) * | 1982-09-30 | 1984-11-01 | リ−ロ−ナル インコ−ポレ−テツド | 電気銅メッキ液 |
| DE3240643A1 (de) * | 1982-11-04 | 1984-05-30 | LPW-Chemie GmbH, 4040 Neuss | Erzeugung von leiterbahnbeschichtungen und leitenden lochwandbeschichtungen auf bzw. in leiterplatten |
| AU554236B2 (en) * | 1983-06-10 | 1986-08-14 | Omi International Corp. | Electrolyte composition and process for electrodepositing copper |
| AU559896B2 (en) * | 1983-06-10 | 1987-03-26 | Omi International Corp. | Electrolytic copper depositing processes |
| DE3404267A1 (de) * | 1984-02-03 | 1985-08-08 | Schering AG, 1000 Berlin und 4709 Bergkamen | Verfahren zur vollautomatischen steuerung der galvanischen abscheidung von kupferueberzuegen aus sauren kupferbaedern |
| US4555315A (en) * | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
| US4673469A (en) * | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
| US4786746A (en) * | 1987-09-18 | 1988-11-22 | Pennsylvania Research Corporation | Copper electroplating solutions and methods of making and using them |
| US4948474A (en) * | 1987-09-18 | 1990-08-14 | Pennsylvania Research Corporation | Copper electroplating solutions and methods |
| DE3836521C2 (de) * | 1988-10-24 | 1995-04-13 | Atotech Deutschland Gmbh | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades |
| US4969979A (en) * | 1989-05-08 | 1990-11-13 | International Business Machines Corporation | Direct electroplating of through holes |
| ATE188516T1 (de) | 1990-03-19 | 2000-01-15 | Atotech Deutschland Gmbh | Wässriges, saures bad zur galvanischen abscheidung von glänzenden und rissfreien kupferüberzügen und verwendung dieses bades |
| US5733429A (en) * | 1996-09-10 | 1998-03-31 | Enthone-Omi, Inc. | Polyacrylic acid additives for copper electrorefining and electrowinning |
| US6024857A (en) * | 1997-10-08 | 2000-02-15 | Novellus Systems, Inc. | Electroplating additive for filling sub-micron features |
| DE19758121C2 (de) * | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten |
| JP4793530B2 (ja) * | 2001-07-02 | 2011-10-12 | 上村工業株式会社 | 硫酸銅めっき浴 |
| KR100389061B1 (ko) * | 2002-11-14 | 2003-06-25 | 일진소재산업주식회사 | 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법 |
| DE10337669B4 (de) * | 2003-08-08 | 2006-04-27 | Atotech Deutschland Gmbh | Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung |
| DE102005011708B3 (de) | 2005-03-11 | 2007-03-01 | Atotech Deutschland Gmbh | Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages |
| EP2568063A1 (en) * | 2011-09-09 | 2013-03-13 | Rohm and Haas Electronic Materials LLC | Low internal stress copper electroplating method |
| EP3288990B1 (en) | 2015-04-28 | 2022-09-28 | Rohm and Haas Electronic Materials LLC | Reaction products of bisanhydrids and diamines as additives for electroplating baths |
| CN107447237B (zh) * | 2016-05-30 | 2021-04-20 | 史莱福灵有限公司 | 具有降低的接触噪声的滑环 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3502551A (en) | 1966-08-20 | 1970-03-24 | Schering Ag | Acid electrolyte for the deposition of bright,levelling copper coatings |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2798040A (en) * | 1955-09-15 | 1957-07-02 | Dow Chemical Co | Electrowinning of metals |
| US2888390A (en) * | 1956-11-08 | 1959-05-26 | Anaconda Co | Electrolytic refining of copper |
| US2954331A (en) * | 1958-08-14 | 1960-09-27 | Dayton Bright Copper Company | Bright copper plating bath |
| US3287236A (en) * | 1964-02-14 | 1966-11-22 | Langbein Pfanhausen Werke A G | Electrodeposition of copper and solutions therefor |
| US3804729A (en) * | 1972-06-19 | 1974-04-16 | M & T Chemicals Inc | Electrolyte and process for electro-depositing copper |
| JPS5330279B2 (US07655746-20100202-C00011.png) * | 1972-07-19 | 1978-08-25 | ||
| JPS4931406A (US07655746-20100202-C00011.png) * | 1972-07-20 | 1974-03-20 |
-
1977
- 1977-10-17 DE DE2746938A patent/DE2746938C2/de not_active Expired
-
1978
- 1978-10-02 US US05/947,746 patent/US4181582A/en not_active Expired - Lifetime
- 1978-10-13 CH CH1066578A patent/CH642686A5/de not_active IP Right Cessation
- 1978-10-16 FR FR7829381A patent/FR2406009A1/fr active Granted
- 1978-10-16 JP JP53126287A patent/JPS59596B2/ja not_active Expired
- 1978-10-16 GB GB7840680A patent/GB2009238B/en not_active Expired
- 1978-10-16 SE SE7810754A patent/SE447275B/sv not_active IP Right Cessation
- 1978-10-17 IT IT28812/78A patent/IT1099997B/it active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3502551A (en) | 1966-08-20 | 1970-03-24 | Schering Ag | Acid electrolyte for the deposition of bright,levelling copper coatings |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4032864A1 (de) * | 1990-10-13 | 1992-04-16 | Schering Ag | Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination |
| DE4126502C1 (US07655746-20100202-C00011.png) * | 1991-08-07 | 1993-02-11 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De |
Also Published As
| Publication number | Publication date |
|---|---|
| SE7810754L (sv) | 1979-04-18 |
| JPS5464025A (en) | 1979-05-23 |
| DE2746938A1 (de) | 1979-04-19 |
| FR2406009A1 (fr) | 1979-05-11 |
| IT7828812A0 (it) | 1978-10-17 |
| SE447275B (sv) | 1986-11-03 |
| FR2406009B1 (US07655746-20100202-C00011.png) | 1982-06-11 |
| GB2009238A (en) | 1979-06-13 |
| GB2009238B (en) | 1982-05-26 |
| US4181582A (en) | 1980-01-01 |
| CH642686A5 (de) | 1984-04-30 |
| JPS59596B2 (ja) | 1984-01-07 |
| IT1099997B (it) | 1985-09-28 |
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Owner name: ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE |