FR2406009A1 - Bain de cuivrage electrolytique acide - Google Patents
Bain de cuivrage electrolytique acideInfo
- Publication number
- FR2406009A1 FR2406009A1 FR7829381A FR7829381A FR2406009A1 FR 2406009 A1 FR2406009 A1 FR 2406009A1 FR 7829381 A FR7829381 A FR 7829381A FR 7829381 A FR7829381 A FR 7829381A FR 2406009 A1 FR2406009 A1 FR 2406009A1
- Authority
- FR
- France
- Prior art keywords
- copper bath
- acid copper
- electrolytic acid
- oxygenated
- carboxamide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Lubricants (AREA)
- Detergent Compositions (AREA)
Abstract
Bain de cuivrage électrolytique acide. Il contient : a. un carboxamide R-CO-NH2 ; dans lequel R désigne un radical hydrocarboné aliphatique ou aromatique, monomère ou polymère, b. un composé macromoléculaire oxygéné, c. un composé thio portant des groupes hydrosolubilisants. Application au renforcement des conducteurs de circuits imprimés.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19772746938 DE2746938A1 (de) | 1977-10-17 | 1977-10-17 | Saures galvanisches kupferbad |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2406009A1 true FR2406009A1 (fr) | 1979-05-11 |
FR2406009B1 FR2406009B1 (fr) | 1982-06-11 |
Family
ID=6021780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7829381A Granted FR2406009A1 (fr) | 1977-10-17 | 1978-10-16 | Bain de cuivrage electrolytique acide |
Country Status (8)
Country | Link |
---|---|
US (1) | US4181582A (fr) |
JP (1) | JPS59596B2 (fr) |
CH (1) | CH642686A5 (fr) |
DE (1) | DE2746938A1 (fr) |
FR (1) | FR2406009A1 (fr) |
GB (1) | GB2009238B (fr) |
IT (1) | IT1099997B (fr) |
SE (1) | SE447275B (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0107109A2 (fr) * | 1982-09-30 | 1984-05-02 | LeaRonal, Inc. | Solutions de dépôt électrolytique de cuivre et procédé pour leur application |
US4490220A (en) * | 1982-09-30 | 1984-12-25 | Learonal, Inc. | Electrolytic copper plating solutions |
US4948474A (en) * | 1987-09-18 | 1990-08-14 | Pennsylvania Research Corporation | Copper electroplating solutions and methods |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3012168A1 (de) * | 1980-03-27 | 1981-10-01 | Schering Ag Berlin Und Bergkamen, 1000 Berlin | Verfahren zur galvanischen abscheidung von kupferniederschlaegen |
US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
DE3240643A1 (de) * | 1982-11-04 | 1984-05-30 | LPW-Chemie GmbH, 4040 Neuss | Erzeugung von leiterbahnbeschichtungen und leitenden lochwandbeschichtungen auf bzw. in leiterplatten |
AU559896B2 (en) * | 1983-06-10 | 1987-03-26 | Omi International Corp. | Electrolytic copper depositing processes |
AU554236B2 (en) * | 1983-06-10 | 1986-08-14 | Omi International Corp. | Electrolyte composition and process for electrodepositing copper |
DE3404267A1 (de) * | 1984-02-03 | 1985-08-08 | Schering AG, 1000 Berlin und 4709 Bergkamen | Verfahren zur vollautomatischen steuerung der galvanischen abscheidung von kupferueberzuegen aus sauren kupferbaedern |
US4555315A (en) * | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
US4673469A (en) * | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
US4786746A (en) * | 1987-09-18 | 1988-11-22 | Pennsylvania Research Corporation | Copper electroplating solutions and methods of making and using them |
DE3836521C2 (de) * | 1988-10-24 | 1995-04-13 | Atotech Deutschland Gmbh | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades |
US4969979A (en) * | 1989-05-08 | 1990-11-13 | International Business Machines Corporation | Direct electroplating of through holes |
ATE188516T1 (de) | 1990-03-19 | 2000-01-15 | Atotech Deutschland Gmbh | Wässriges, saures bad zur galvanischen abscheidung von glänzenden und rissfreien kupferüberzügen und verwendung dieses bades |
DE4032864A1 (de) * | 1990-10-13 | 1992-04-16 | Schering Ag | Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination |
DE4126502C1 (fr) * | 1991-08-07 | 1993-02-11 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
US5733429A (en) * | 1996-09-10 | 1998-03-31 | Enthone-Omi, Inc. | Polyacrylic acid additives for copper electrorefining and electrowinning |
US6024857A (en) * | 1997-10-08 | 2000-02-15 | Novellus Systems, Inc. | Electroplating additive for filling sub-micron features |
DE19758121C2 (de) * | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten |
JP4793530B2 (ja) * | 2001-07-02 | 2011-10-12 | 上村工業株式会社 | 硫酸銅めっき浴 |
KR100389061B1 (ko) * | 2002-11-14 | 2003-06-25 | 일진소재산업주식회사 | 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법 |
DE10337669B4 (de) * | 2003-08-08 | 2006-04-27 | Atotech Deutschland Gmbh | Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung |
DE102005011708B3 (de) | 2005-03-11 | 2007-03-01 | Atotech Deutschland Gmbh | Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages |
EP2568063A1 (fr) * | 2011-09-09 | 2013-03-13 | Rohm and Haas Electronic Materials LLC | Procédé d'électrodéposition de cuivre à faible contrainte interne |
CN107531859B (zh) | 2015-04-28 | 2020-02-14 | 罗门哈斯电子材料有限责任公司 | 作为电镀浴添加剂的双酸酐与二胺的反应产物 |
CN107447237B (zh) * | 2016-05-30 | 2021-04-20 | 史莱福灵有限公司 | 具有降低的接触噪声的滑环 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3804729A (en) * | 1972-06-19 | 1974-04-16 | M & T Chemicals Inc | Electrolyte and process for electro-depositing copper |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2798040A (en) * | 1955-09-15 | 1957-07-02 | Dow Chemical Co | Electrowinning of metals |
US2888390A (en) * | 1956-11-08 | 1959-05-26 | Anaconda Co | Electrolytic refining of copper |
US2954331A (en) * | 1958-08-14 | 1960-09-27 | Dayton Bright Copper Company | Bright copper plating bath |
US3287236A (en) * | 1964-02-14 | 1966-11-22 | Langbein Pfanhausen Werke A G | Electrodeposition of copper and solutions therefor |
SE322956B (fr) * | 1966-08-20 | 1970-04-20 | Schering Ag | |
JPS5330279B2 (fr) * | 1972-07-19 | 1978-08-25 | ||
JPS4931406A (fr) * | 1972-07-20 | 1974-03-20 |
-
1977
- 1977-10-17 DE DE19772746938 patent/DE2746938A1/de active Granted
-
1978
- 1978-10-02 US US05/947,746 patent/US4181582A/en not_active Expired - Lifetime
- 1978-10-13 CH CH1066578A patent/CH642686A5/de not_active IP Right Cessation
- 1978-10-16 FR FR7829381A patent/FR2406009A1/fr active Granted
- 1978-10-16 JP JP53126287A patent/JPS59596B2/ja not_active Expired
- 1978-10-16 SE SE7810754A patent/SE447275B/sv not_active IP Right Cessation
- 1978-10-16 GB GB7840680A patent/GB2009238B/en not_active Expired
- 1978-10-17 IT IT28812/78A patent/IT1099997B/it active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3804729A (en) * | 1972-06-19 | 1974-04-16 | M & T Chemicals Inc | Electrolyte and process for electro-depositing copper |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0107109A2 (fr) * | 1982-09-30 | 1984-05-02 | LeaRonal, Inc. | Solutions de dépôt électrolytique de cuivre et procédé pour leur application |
EP0107109A3 (en) * | 1982-09-30 | 1984-07-25 | Learonal, Inc. | Electrolytic copper plating solutions and a method for their application |
US4490220A (en) * | 1982-09-30 | 1984-12-25 | Learonal, Inc. | Electrolytic copper plating solutions |
US4948474A (en) * | 1987-09-18 | 1990-08-14 | Pennsylvania Research Corporation | Copper electroplating solutions and methods |
Also Published As
Publication number | Publication date |
---|---|
GB2009238A (en) | 1979-06-13 |
FR2406009B1 (fr) | 1982-06-11 |
GB2009238B (en) | 1982-05-26 |
IT1099997B (it) | 1985-09-28 |
SE7810754L (sv) | 1979-04-18 |
IT7828812A0 (it) | 1978-10-17 |
DE2746938A1 (de) | 1979-04-19 |
SE447275B (sv) | 1986-11-03 |
CH642686A5 (de) | 1984-04-30 |
JPS59596B2 (ja) | 1984-01-07 |
DE2746938C2 (fr) | 1987-04-09 |
US4181582A (en) | 1980-01-01 |
JPS5464025A (en) | 1979-05-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property |