FR2406009A1 - Bain de cuivrage electrolytique acide - Google Patents

Bain de cuivrage electrolytique acide

Info

Publication number
FR2406009A1
FR2406009A1 FR7829381A FR7829381A FR2406009A1 FR 2406009 A1 FR2406009 A1 FR 2406009A1 FR 7829381 A FR7829381 A FR 7829381A FR 7829381 A FR7829381 A FR 7829381A FR 2406009 A1 FR2406009 A1 FR 2406009A1
Authority
FR
France
Prior art keywords
copper bath
acid copper
electrolytic acid
oxygenated
carboxamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7829381A
Other languages
English (en)
Other versions
FR2406009B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of FR2406009A1 publication Critical patent/FR2406009A1/fr
Application granted granted Critical
Publication of FR2406009B1 publication Critical patent/FR2406009B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Lubricants (AREA)
  • Detergent Compositions (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Bain de cuivrage électrolytique acide. Il contient : a. un carboxamide R-CO-NH2 ; dans lequel R désigne un radical hydrocarboné aliphatique ou aromatique, monomère ou polymère, b. un composé macromoléculaire oxygéné, c. un composé thio portant des groupes hydrosolubilisants. Application au renforcement des conducteurs de circuits imprimés.
FR7829381A 1977-10-17 1978-10-16 Bain de cuivrage electrolytique acide Granted FR2406009A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772746938 DE2746938A1 (de) 1977-10-17 1977-10-17 Saures galvanisches kupferbad

Publications (2)

Publication Number Publication Date
FR2406009A1 true FR2406009A1 (fr) 1979-05-11
FR2406009B1 FR2406009B1 (fr) 1982-06-11

Family

ID=6021780

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7829381A Granted FR2406009A1 (fr) 1977-10-17 1978-10-16 Bain de cuivrage electrolytique acide

Country Status (8)

Country Link
US (1) US4181582A (fr)
JP (1) JPS59596B2 (fr)
CH (1) CH642686A5 (fr)
DE (1) DE2746938A1 (fr)
FR (1) FR2406009A1 (fr)
GB (1) GB2009238B (fr)
IT (1) IT1099997B (fr)
SE (1) SE447275B (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0107109A2 (fr) * 1982-09-30 1984-05-02 LeaRonal, Inc. Solutions de dépôt électrolytique de cuivre et procédé pour leur application
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3012168A1 (de) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur galvanischen abscheidung von kupferniederschlaegen
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
DE3240643A1 (de) * 1982-11-04 1984-05-30 LPW-Chemie GmbH, 4040 Neuss Erzeugung von leiterbahnbeschichtungen und leitenden lochwandbeschichtungen auf bzw. in leiterplatten
AU554236B2 (en) * 1983-06-10 1986-08-14 Omi International Corp. Electrolyte composition and process for electrodepositing copper
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
DE3404267A1 (de) * 1984-02-03 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Verfahren zur vollautomatischen steuerung der galvanischen abscheidung von kupferueberzuegen aus sauren kupferbaedern
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
US4673469A (en) * 1984-06-08 1987-06-16 Mcgean-Rohco, Inc. Method of plating plastics
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
DE3836521C2 (de) * 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
US4969979A (en) * 1989-05-08 1990-11-13 International Business Machines Corporation Direct electroplating of through holes
DE59700942D1 (de) 1990-03-19 2000-02-10 Atotech Deutschland Gmbh Wässriges, saures Bad zur galvanischen Abscheidung von glänzenden und rissfreien Kupferüberzügen und Verwendung dieses Bades
DE4032864A1 (de) * 1990-10-13 1992-04-16 Schering Ag Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination
DE4126502C1 (fr) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5733429A (en) * 1996-09-10 1998-03-31 Enthone-Omi, Inc. Polyacrylic acid additives for copper electrorefining and electrowinning
US6024857A (en) 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
DE19758121C2 (de) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
JP4793530B2 (ja) * 2001-07-02 2011-10-12 上村工業株式会社 硫酸銅めっき浴
KR100389061B1 (ko) * 2002-11-14 2003-06-25 일진소재산업주식회사 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법
DE10337669B4 (de) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
DE102005011708B3 (de) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages
EP2568063A1 (fr) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Procédé d'électrodéposition de cuivre à faible contrainte interne
CN107531859B (zh) 2015-04-28 2020-02-14 罗门哈斯电子材料有限责任公司 作为电镀浴添加剂的双酸酐与二胺的反应产物
CN107447237B (zh) * 2016-05-30 2021-04-20 史莱福灵有限公司 具有降低的接触噪声的滑环

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3804729A (en) * 1972-06-19 1974-04-16 M & T Chemicals Inc Electrolyte and process for electro-depositing copper

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2798040A (en) * 1955-09-15 1957-07-02 Dow Chemical Co Electrowinning of metals
US2888390A (en) * 1956-11-08 1959-05-26 Anaconda Co Electrolytic refining of copper
US2954331A (en) * 1958-08-14 1960-09-27 Dayton Bright Copper Company Bright copper plating bath
US3287236A (en) * 1964-02-14 1966-11-22 Langbein Pfanhausen Werke A G Electrodeposition of copper and solutions therefor
SE322956B (fr) * 1966-08-20 1970-04-20 Schering Ag
JPS5330279B2 (fr) * 1972-07-19 1978-08-25
JPS4931406A (fr) * 1972-07-20 1974-03-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3804729A (en) * 1972-06-19 1974-04-16 M & T Chemicals Inc Electrolyte and process for electro-depositing copper

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0107109A2 (fr) * 1982-09-30 1984-05-02 LeaRonal, Inc. Solutions de dépôt électrolytique de cuivre et procédé pour leur application
EP0107109A3 (en) * 1982-09-30 1984-07-25 Learonal, Inc. Electrolytic copper plating solutions and a method for their application
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods

Also Published As

Publication number Publication date
US4181582A (en) 1980-01-01
DE2746938A1 (de) 1979-04-19
FR2406009B1 (fr) 1982-06-11
SE7810754L (sv) 1979-04-18
JPS5464025A (en) 1979-05-23
GB2009238A (en) 1979-06-13
DE2746938C2 (fr) 1987-04-09
CH642686A5 (de) 1984-04-30
IT1099997B (it) 1985-09-28
JPS59596B2 (ja) 1984-01-07
IT7828812A0 (it) 1978-10-17
SE447275B (sv) 1986-11-03
GB2009238B (en) 1982-05-26

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