SE322956B - - Google Patents

Info

Publication number
SE322956B
SE322956B SE9526/67*A SE952667A SE322956B SE 322956 B SE322956 B SE 322956B SE 952667 A SE952667 A SE 952667A SE 322956 B SE322956 B SE 322956B
Authority
SE
Sweden
Application number
SE9526/67*A
Inventor
H Todt
W Clauss
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of SE322956B publication Critical patent/SE322956B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Paints Or Removers (AREA)
SE9526/67*A 1966-08-20 1967-06-28 SE322956B (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DESC039431 1966-08-20

Publications (1)

Publication Number Publication Date
SE322956B true SE322956B (fr) 1970-04-20

Family

ID=7435168

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9526/67*A SE322956B (fr) 1966-08-20 1967-06-28

Country Status (3)

Country Link
US (1) US3502551A (fr)
GB (1) GB1199494A (fr)
SE (1) SE322956B (fr)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2039831C3 (de) * 1970-06-06 1979-09-06 Schering Ag, 1000 Berlin Und 4619 Bergkamen Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge
DE2053860C3 (de) * 1970-10-29 1980-11-06 Schering Ag Saures wäßriges Bad zur galvanischen Abscheidung glänzender Kupferüberzüge
US3961028A (en) * 1971-04-02 1976-06-01 Anumin Pty. Limited Method of producing cuprous sulfate and bisulfate solutions
GB1381666A (en) * 1971-04-02 1975-01-22 Univ Australian Compositions containing copper salts their methods of production and the recovery and purification of copper
US4113848A (en) * 1971-04-02 1978-09-12 Anumin Pty. Limited Method of producing solutions containing cuprous ions
US3966890A (en) * 1971-04-02 1976-06-29 Anumin Pty. Limited Method of producing solutions containing cuprous ions
US3770599A (en) * 1971-05-24 1973-11-06 Oxy Metal Finishing Corp Acid zinc plating baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
US3725220A (en) * 1972-04-27 1973-04-03 Lea Ronal Inc Electrodeposition of copper from acidic baths
DE2746938C2 (de) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4604175A (en) * 1982-12-07 1986-08-05 Naumov Jury I Process for regeneration of iron-copper chloride etching solution
DE3836521C2 (de) * 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
DE59700942D1 (de) 1990-03-19 2000-02-10 Atotech Deutschland Gmbh Wässriges, saures Bad zur galvanischen Abscheidung von glänzenden und rissfreien Kupferüberzügen und Verwendung dieses Bades
US5232575A (en) * 1990-07-26 1993-08-03 Mcgean-Rohco, Inc. Polymeric leveling additive for acid electroplating baths
US5151170A (en) * 1991-12-19 1992-09-29 Mcgean-Rohco, Inc. Acid copper electroplating bath containing brightening additive
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
DE19758121C2 (de) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
US6896739B1 (en) * 2003-12-03 2005-05-24 For Your Ease Only, Inc. Anti-tarnish aqueous treatment
JP4973829B2 (ja) * 2004-07-23 2012-07-11 上村工業株式会社 電気銅めっき浴及び電気銅めっき方法
DE102005011708B3 (de) * 2005-03-11 2007-03-01 Atotech Deutschland Gmbh Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages
TWI328622B (en) 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
CN101796221B (zh) * 2007-05-21 2012-07-04 上村工业株式会社 铜电镀浴
JP5637671B2 (ja) * 2009-09-16 2014-12-10 上村工業株式会社 電気銅めっき浴及びその電気銅めっき浴を用いた電気めっき方法
CN101935854B (zh) * 2010-09-20 2011-11-30 东莞华威铜箔科技有限公司 电解铜箔用添加剂的制备方法、制品及其应用
EP3068819B1 (fr) 2013-11-06 2019-03-27 Rohm and Haas Electronic Materials LLC Polymères contenant de l'azote utilisés en tant que qu'agents nivelants
JP2018517793A (ja) 2015-04-28 2018-07-05 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 電気めっき浴用の添加剤としてのビス無水物及びジアミンの反応生成物
TWI660541B (zh) * 2018-10-01 2019-05-21 長春石油化學股份有限公司 用於鋰二次電池集電體之銅箔及包含其之負極
CN113881984B (zh) * 2021-10-21 2022-09-16 深圳市励高表面处理材料有限公司 一种脉冲电镀整平剂及制备方法和应用该整平液的电镀液
CN114875409B (zh) * 2022-06-07 2023-09-01 深圳市板明科技股份有限公司 一种线路板微蚀粗化液循环再生添加剂及其应用
CN117684223A (zh) * 2022-09-02 2024-03-12 宁波安集微电子科技有限公司 一种金属电镀组合物及其使用方法
CN117684222A (zh) * 2022-09-02 2024-03-12 宁波安集微电子科技有限公司 一种用于电解铜涂层的金属电镀组合物及其应用方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL110737C (fr) * 1953-09-19
US2853444A (en) * 1955-10-18 1958-09-23 Dow Chemical Co Electrowinning of metals
US2872346A (en) * 1956-05-21 1959-02-03 Miller Adolph Metal plating bath
US2931760A (en) * 1957-09-25 1960-04-05 Leon R Westbrook Acid copper plating
US3322657A (en) * 1964-04-28 1967-05-30 Langbein Pfanhauser Werke Ag Electrodeposition of bright copper

Also Published As

Publication number Publication date
DE1521031A1 (de) 1969-09-04
GB1199494A (en) 1970-07-22
US3502551A (en) 1970-03-24
DE1521031B2 (de) 1975-09-25

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