GB1199494A - Acidic Electrolytes for Depositing Shiny, Level Copper Coatings. - Google Patents

Acidic Electrolytes for Depositing Shiny, Level Copper Coatings.

Info

Publication number
GB1199494A
GB1199494A GB37420/67A GB3742067A GB1199494A GB 1199494 A GB1199494 A GB 1199494A GB 37420/67 A GB37420/67 A GB 37420/67A GB 3742067 A GB3742067 A GB 3742067A GB 1199494 A GB1199494 A GB 1199494A
Authority
GB
United Kingdom
Prior art keywords
compound
depositing
nonylphenol
thiourea
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB37420/67A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of GB1199494A publication Critical patent/GB1199494A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Abstract

1,199,494. Electro-depositing copper. SOBERING A.G. Aug. 15, 1967 [Aug. 20, 1966], No.37420/67. Heading C7B. An acidic electrolyte for depositing shiny, level Cu coatings comprises a Cu salt, e. g. 125-260 g/l. Cu SO 4 5H 2 O with 20-85 g/l H 2 SO 4 , with (a) an oxygen-containing compound of M.W. 500 to 50, 000, e.g. 0À01-10 g/l of an addition compound of a fatty alcohol or nonylphenol with ethylene oxide, polyethylene (or propylene) glycol, polyvinylalcohol, carboxymethyl-cellulose, stearic or oleic acid-polyglycolester, stearylalcohol or nonylphenol-polyglycolether; (b) an organic thio compound, e.g. 0À002-0À2 g/l of thiourea, thiohydantoin, a thiocarbamic or thiophosphoric acid ester, a thioalkane-sulphonic acid or thioglycollic acid; and (c) a polyvinyl compound substituted by an amino group or derivative thereof or a heterocyclic group attached through a N atom, e. g. 0À0005-0À1 g/l of polyvinylamine, N-polyvinyl-acetamide, -thioethylurethane, -carbamate, -thiourea, - succinimide, -imidazole, -N, N<SP>1</SP>- ethyleneurea,-pyrrolidone- (2), -morpholine, -morpholinone-(3), -benzimidazole, -5-alkyl-oxazolidone-(2) or -caprolactam. The electrolyte may contain, instead of or in addition to H 2 SO 4 , HBF 4 or H 3 PO 4 ; an alkali metal chloride, e.g. 0À001-0À2 g/l NaCl, may also be present.
GB37420/67A 1966-08-20 1967-08-15 Acidic Electrolytes for Depositing Shiny, Level Copper Coatings. Expired GB1199494A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DESC039431 1966-08-20

Publications (1)

Publication Number Publication Date
GB1199494A true GB1199494A (en) 1970-07-22

Family

ID=7435168

Family Applications (1)

Application Number Title Priority Date Filing Date
GB37420/67A Expired GB1199494A (en) 1966-08-20 1967-08-15 Acidic Electrolytes for Depositing Shiny, Level Copper Coatings.

Country Status (3)

Country Link
US (1) US3502551A (en)
GB (1) GB1199494A (en)
SE (1) SE322956B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024046447A1 (en) * 2022-09-02 2024-03-07 宁波安集微电子科技有限公司 Metal electroplating composition for electrolytic copper coating and use method therefor
WO2024046450A1 (en) * 2022-09-02 2024-03-07 宁波安集微电子科技有限公司 Metal plating composition and use method therefor

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2039831C3 (en) * 1970-06-06 1979-09-06 Schering Ag, 1000 Berlin Und 4619 Bergkamen Acid bath for the galvanic deposition of shiny copper coatings
DE2053860C3 (en) * 1970-10-29 1980-11-06 Schering Ag Acid aqueous bath for the galvanic deposition of shiny copper coatings
US3966890A (en) * 1971-04-02 1976-06-29 Anumin Pty. Limited Method of producing solutions containing cuprous ions
US3961028A (en) * 1971-04-02 1976-06-01 Anumin Pty. Limited Method of producing cuprous sulfate and bisulfate solutions
GB1381666A (en) * 1971-04-02 1975-01-22 Univ Australian Compositions containing copper salts their methods of production and the recovery and purification of copper
US4113848A (en) * 1971-04-02 1978-09-12 Anumin Pty. Limited Method of producing solutions containing cuprous ions
US3770599A (en) * 1971-05-24 1973-11-06 Oxy Metal Finishing Corp Acid zinc plating baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
US3725220A (en) * 1972-04-27 1973-04-03 Lea Ronal Inc Electrodeposition of copper from acidic baths
DE2746938A1 (en) * 1977-10-17 1979-04-19 Schering Ag ACID GALVANIC COPPER BATH
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4604175A (en) * 1982-12-07 1986-08-05 Naumov Jury I Process for regeneration of iron-copper chloride etching solution
DE3836521C2 (en) * 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Aqueous acidic bath for the galvanic deposition of shiny and crack-free copper coatings and use of the bath
ATE188516T1 (en) 1990-03-19 2000-01-15 Atotech Deutschland Gmbh AQUEOUS, ACIDIC BATH FOR THE GALVANIC DEPOSITION OF SHINY AND CRACK-FREE COPPER COATINGS AND USE OF THIS BATH
US5232575A (en) * 1990-07-26 1993-08-03 Mcgean-Rohco, Inc. Polymeric leveling additive for acid electroplating baths
US5151170A (en) * 1991-12-19 1992-09-29 Mcgean-Rohco, Inc. Acid copper electroplating bath containing brightening additive
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
DE19758121C2 (en) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Aqueous bath and method for electrolytic deposition of copper layers
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
US6896739B1 (en) * 2003-12-03 2005-05-24 For Your Ease Only, Inc. Anti-tarnish aqueous treatment
JP4973829B2 (en) * 2004-07-23 2012-07-11 上村工業株式会社 Electro copper plating bath and electro copper plating method
DE102005011708B3 (en) * 2005-03-11 2007-03-01 Atotech Deutschland Gmbh A polyvinylammonium compound and process for the production thereof, and an acidic solution containing the compound and a process for electrolytically depositing a copper precipitate
TWI328622B (en) 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
CN101796221B (en) * 2007-05-21 2012-07-04 上村工业株式会社 Copper electroplating bath
JP5637671B2 (en) * 2009-09-16 2014-12-10 上村工業株式会社 Electro copper plating bath and electroplating method using the electro copper plating bath
CN101935854B (en) * 2010-09-20 2011-11-30 东莞华威铜箔科技有限公司 Preparation method of additive for electrolytic copper foil, product and application thereof
KR101809588B1 (en) 2013-11-06 2018-01-18 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 Nitrogen containing polymers as levelers
US10106512B2 (en) 2015-04-28 2018-10-23 Dow Global Technologies Llc Metal plating compositions
TWI660541B (en) * 2018-10-01 2019-05-21 長春石油化學股份有限公司 Copper foil for current collector of lithium secondary battery and negative electrode including the same
CN113881984B (en) * 2021-10-21 2022-09-16 深圳市励高表面处理材料有限公司 Pulse electroplating leveling agent, preparation method and electroplating solution applying leveling solution
CN114875409B (en) * 2022-06-07 2023-09-01 深圳市板明科技股份有限公司 Circuit board microetching roughening liquid circulation regeneration additive and application thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL109804C (en) * 1953-09-19
US2853444A (en) * 1955-10-18 1958-09-23 Dow Chemical Co Electrowinning of metals
US2872346A (en) * 1956-05-21 1959-02-03 Miller Adolph Metal plating bath
US2931760A (en) * 1957-09-25 1960-04-05 Leon R Westbrook Acid copper plating
US3322657A (en) * 1964-04-28 1967-05-30 Langbein Pfanhauser Werke Ag Electrodeposition of bright copper

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024046447A1 (en) * 2022-09-02 2024-03-07 宁波安集微电子科技有限公司 Metal electroplating composition for electrolytic copper coating and use method therefor
WO2024046450A1 (en) * 2022-09-02 2024-03-07 宁波安集微电子科技有限公司 Metal plating composition and use method therefor

Also Published As

Publication number Publication date
DE1521031A1 (en) 1969-09-04
SE322956B (en) 1970-04-20
US3502551A (en) 1970-03-24
DE1521031B2 (en) 1975-09-25

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years