EP0107109A3 - Electrolytic copper plating solutions and a method for their application - Google Patents

Electrolytic copper plating solutions and a method for their application Download PDF

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Publication number
EP0107109A3
EP0107109A3 EP83109814A EP83109814A EP0107109A3 EP 0107109 A3 EP0107109 A3 EP 0107109A3 EP 83109814 A EP83109814 A EP 83109814A EP 83109814 A EP83109814 A EP 83109814A EP 0107109 A3 EP0107109 A3 EP 0107109A3
Authority
EP
European Patent Office
Prior art keywords
hydrogen
magnesium
alkali metal
compound
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP83109814A
Other versions
EP0107109A2 (en
EP0107109B1 (en
Inventor
John Houman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Priority to AT83109814T priority Critical patent/ATE32611T1/en
Publication of EP0107109A2 publication Critical patent/EP0107109A2/en
Publication of EP0107109A3 publication Critical patent/EP0107109A3/en
Application granted granted Critical
Publication of EP0107109B1 publication Critical patent/EP0107109B1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)

Abstract

Acid copper electroplating solutions containing the reaction product of (1) a compound of the formula <CHEM> wherein R1 and R2 are lower alkyl radicals of with 1 to 6 carbon atoms, a hydrogen atom or mixtures thereof and R4 is an alkali metal, hydrogen, magnesium, or the groups SX or SSX, wherein X is an alkali metal, hydrogen or magnesium, or a compound of the formula <CHEM> wherein R3 is an aromatic, heterocyclic or alicyclic radical containing 3 to 12 carbon atoms and R4 is an alkali metal, hydrogen, magnesium, or the groups SX or SSX where X is an alkali metal, hydrogen or magnesium, (2) a compound of the formula XR1-(S)n-R2-SO3H wherein R1 and R2 are the same or different and are alkylene radicals containing 1 to 6 carbon atoms, X is hydrogen or -SO3H and n equals 2 to 5, and (3) acrylamide in a sufficient amount to increase the brightness of the deposit and/or to prevent the formation of cracks during thermal shock.
EP83109814A 1982-09-30 1983-09-30 Electrolytic copper plating solutions and a method for their application Expired EP0107109B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT83109814T ATE32611T1 (en) 1982-09-30 1983-09-30 ELECTROLYTIC COPPER PLATING SOLUTIONS AND PROCESSES FOR YOUR APPLICATION.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42905582A 1982-09-30 1982-09-30
US429055 1982-09-30

Publications (3)

Publication Number Publication Date
EP0107109A2 EP0107109A2 (en) 1984-05-02
EP0107109A3 true EP0107109A3 (en) 1984-07-25
EP0107109B1 EP0107109B1 (en) 1988-02-24

Family

ID=23701587

Family Applications (1)

Application Number Title Priority Date Filing Date
EP83109814A Expired EP0107109B1 (en) 1982-09-30 1983-09-30 Electrolytic copper plating solutions and a method for their application

Country Status (5)

Country Link
EP (1) EP0107109B1 (en)
JP (1) JPS59501829A (en)
AT (1) ATE32611T1 (en)
DE (2) DE107109T1 (en)
WO (1) WO1984001393A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
DE3721985A1 (en) * 1987-06-30 1989-01-12 Schering Ag AQUEOUS ACID BATH FOR GALVANIC DEPOSITION OF GLOSSY AND LEVELED COPPER COATINGS
DE4032864A1 (en) * 1990-10-13 1992-04-16 Schering Ag ACIDIC BATH FOR THE GALVANIC DEPOSITION OF COPPER COVERS AND METHODS USING THIS COMBINATION
DE19758121C2 (en) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Aqueous bath and method for electrolytic deposition of copper layers
JP4115240B2 (en) * 2002-10-21 2008-07-09 日鉱金属株式会社 Copper electrolytic solution containing quaternary amine compound having specific skeleton and organic sulfur compound as additive, and electrolytic copper foil produced thereby
DE10337669B4 (en) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Aqueous, acid solution and process for the electrodeposition of copper coatings and use of the solution
DE102005011708B3 (en) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh A polyvinylammonium compound and process for the production thereof, and an acidic solution containing the compound and a process for electrolytically depositing a copper precipitate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
FR2406009A1 (en) * 1977-10-17 1979-05-11 Schering Ag ELECTROLYTIC ACID COPPER BATH

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2888390A (en) * 1956-11-08 1959-05-26 Anaconda Co Electrolytic refining of copper
US2954331A (en) * 1958-08-14 1960-09-27 Dayton Bright Copper Company Bright copper plating bath
JPS4931183B1 (en) * 1969-12-19 1974-08-20
JPS4931406B1 (en) * 1970-02-19 1974-08-21
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
FR2406009A1 (en) * 1977-10-17 1979-05-11 Schering Ag ELECTROLYTIC ACID COPPER BATH

Also Published As

Publication number Publication date
WO1984001393A1 (en) 1984-04-12
DE107109T1 (en) 1985-02-14
JPS6250559B2 (en) 1987-10-26
JPS59501829A (en) 1984-11-01
ATE32611T1 (en) 1988-03-15
EP0107109A2 (en) 1984-05-02
DE3375732D1 (en) 1988-03-31
EP0107109B1 (en) 1988-02-24

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