DE69005691D1 - Behandlung von Kupferfolie für gedruckte Schaltungen. - Google Patents

Behandlung von Kupferfolie für gedruckte Schaltungen.

Info

Publication number
DE69005691D1
DE69005691D1 DE90108140T DE69005691T DE69005691D1 DE 69005691 D1 DE69005691 D1 DE 69005691D1 DE 90108140 T DE90108140 T DE 90108140T DE 69005691 T DE69005691 T DE 69005691T DE 69005691 D1 DE69005691 D1 DE 69005691D1
Authority
DE
Germany
Prior art keywords
treatment
copper foil
printed circuits
printed
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE90108140T
Other languages
English (en)
Other versions
DE69005691T2 (de
Inventor
Eiji Hino
Keisuke Yamanishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1112226A external-priority patent/JPH0650794B2/ja
Priority claimed from JP1112227A external-priority patent/JPH0650795B2/ja
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Application granted granted Critical
Publication of DE69005691D1 publication Critical patent/DE69005691D1/de
Publication of DE69005691T2 publication Critical patent/DE69005691T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
DE90108140T 1989-05-02 1990-04-27 Behandlung von Kupferfolie für gedruckte Schaltungen. Expired - Lifetime DE69005691T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1112226A JPH0650794B2 (ja) 1989-05-02 1989-05-02 印刷回路用銅箔の処理方法
JP1112227A JPH0650795B2 (ja) 1989-05-02 1989-05-02 印刷回路用銅箔の処理方法

Publications (2)

Publication Number Publication Date
DE69005691D1 true DE69005691D1 (de) 1994-02-17
DE69005691T2 DE69005691T2 (de) 1994-04-28

Family

ID=26451448

Family Applications (1)

Application Number Title Priority Date Filing Date
DE90108140T Expired - Lifetime DE69005691T2 (de) 1989-05-02 1990-04-27 Behandlung von Kupferfolie für gedruckte Schaltungen.

Country Status (3)

Country Link
US (1) US5019222A (de)
EP (1) EP0396056B1 (de)
DE (1) DE69005691T2 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0818401B2 (ja) * 1989-05-17 1996-02-28 福田金属箔粉工業株式会社 複合箔とその製法
JPH0819550B2 (ja) * 1990-06-05 1996-02-28 福田金属箔粉工業株式会社 印刷回路用銅箔の表面処理方法
US5304428A (en) * 1990-06-05 1994-04-19 Fukuda Metal Foil And Powder Co., Ltd. Copper foil for printed circuit boards
TW208110B (de) * 1990-06-08 1993-06-21 Furukawa Circuit Foil Kk
JPH0787270B2 (ja) * 1992-02-19 1995-09-20 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
FR2688234B1 (fr) * 1992-03-03 1995-03-24 Sarrel Procede de protection d'une piece en argent ou revetue d'argent.
US5670033A (en) * 1993-04-19 1997-09-23 Electrocopper Products Limited Process for making copper metal powder, copper oxides and copper foil
US5366612A (en) * 1993-04-19 1994-11-22 Magma Copper Company Process for making copper foil
CN1084803C (zh) * 1993-04-19 2002-05-15 Ga-Tek公司 制造金属铜粉、铜氧化物和铜箔的方法
TW317575B (de) * 1994-01-21 1997-10-11 Olin Corp
US5681662A (en) * 1995-09-15 1997-10-28 Olin Corporation Copper alloy foils for flexible circuits
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
US5780172A (en) * 1995-12-18 1998-07-14 Olin Corporation Tin coated electrical connector
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
US6736988B1 (en) * 1999-11-04 2004-05-18 Mitsubishi Gas Chemical Company, Inc. Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board
US6497806B1 (en) * 2000-04-25 2002-12-24 Nippon Denkai, Ltd. Method of producing a roughening-treated copper foil
JP3258308B2 (ja) 2000-02-03 2002-02-18 株式会社日鉱マテリアルズ レーザー穴開け性に優れた銅箔及びその製造方法
US6759142B2 (en) 2001-07-31 2004-07-06 Kobe Steel Ltd. Plated copper alloy material and process for production thereof
JP3868854B2 (ja) * 2002-06-14 2007-01-17 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合体およびその製造方法
US20040175582A1 (en) * 2002-12-05 2004-09-09 Olin Corporation, A Corporation Of The Commonwealth Of Virginia Laser ablation resistant copper foil
JP4115293B2 (ja) * 2003-02-17 2008-07-09 古河サーキットフォイル株式会社 チップオンフィルム用銅箔
WO2007145164A1 (ja) * 2006-06-12 2007-12-21 Nippon Mining & Metals Co., Ltd. 粗化処理面を備えた圧延銅又は銅合金箔及び圧延銅又は銅合金箔の粗化方法
KR20120034750A (ko) * 2007-03-20 2012-04-12 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 무접착제 플렉시블 라미네이트 및 그 제조 방법
KR101228168B1 (ko) * 2007-09-28 2013-01-30 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 인쇄 회로용 동박 및 동장 적층판
WO2010061736A1 (ja) * 2008-11-25 2010-06-03 日鉱金属株式会社 印刷回路用銅箔
CN102666939B (zh) * 2009-12-24 2015-08-19 吉坤日矿日石金属株式会社 表面处理铜箔
US9580829B2 (en) 2010-05-07 2017-02-28 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit
RU2449059C2 (ru) * 2010-07-21 2012-04-27 Общество с ограниченной ответственностью "Легкие металлы" Электролизер для производства алюминия
US9049795B2 (en) * 2011-03-25 2015-06-02 Jx Nippon Mining & Metals Corporation Rolled copper or copper-alloy foil provided with roughened surface
JP5654416B2 (ja) * 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔
RU2499085C1 (ru) * 2012-03-16 2013-11-20 Общество с ограниченной ответственностью "Легкие металлы" Электролизер для производства алюминия
RU2550683C1 (ru) * 2013-12-19 2015-05-10 Федеральное Государственное Автономное Образовательное Учреждение Высшего Профессионального Образования "Сибирский Федеральный Университет" Электролизер для производства алюминия
CN105007691B (zh) * 2015-08-18 2018-02-06 四川海英电子科技有限公司 精细线路印制板蚀刻工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131517A (en) * 1977-06-03 1978-12-26 Nippon Mining Co., Ltd. Surface treating process for copper foil for use in printed circuit
JPS6113688A (ja) * 1984-06-28 1986-01-21 福田金属箔粉工業株式会社 印刷回路用銅箔およびその製造方法

Also Published As

Publication number Publication date
EP0396056A2 (de) 1990-11-07
EP0396056A3 (de) 1992-06-10
EP0396056B1 (de) 1994-01-05
DE69005691T2 (de) 1994-04-28
US5019222A (en) 1991-05-28

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Legal Events

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8364 No opposition during term of opposition