DE3768995D1 - Vorrichtung zum verdrahten der schaltdraehte von gedruckten leiterplatten. - Google Patents

Vorrichtung zum verdrahten der schaltdraehte von gedruckten leiterplatten.

Info

Publication number
DE3768995D1
DE3768995D1 DE8787104346T DE3768995T DE3768995D1 DE 3768995 D1 DE3768995 D1 DE 3768995D1 DE 8787104346 T DE8787104346 T DE 8787104346T DE 3768995 T DE3768995 T DE 3768995T DE 3768995 D1 DE3768995 D1 DE 3768995D1
Authority
DE
Germany
Prior art keywords
wiring
printed circuits
switching wires
wires
switching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787104346T
Other languages
English (en)
Inventor
Seiji Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apollo Seiko Ltd
Original Assignee
Apollo Seiko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apollo Seiko Ltd filed Critical Apollo Seiko Ltd
Application granted granted Critical
Publication of DE3768995D1 publication Critical patent/DE3768995D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0615—Solder feeding devices forming part of a soldering iron
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49181—Assembling terminal to elongated conductor by deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE8787104346T 1986-04-09 1987-03-24 Vorrichtung zum verdrahten der schaltdraehte von gedruckten leiterplatten. Expired - Fee Related DE3768995D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61080222A JPS62238700A (ja) 1986-04-09 1986-04-09 プリント基板用ジヤンパ線配線装置

Publications (1)

Publication Number Publication Date
DE3768995D1 true DE3768995D1 (de) 1991-05-08

Family

ID=13712336

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787104346T Expired - Fee Related DE3768995D1 (de) 1986-04-09 1987-03-24 Vorrichtung zum verdrahten der schaltdraehte von gedruckten leiterplatten.

Country Status (5)

Country Link
US (1) US4746048A (de)
EP (1) EP0240835B1 (de)
JP (1) JPS62238700A (de)
KR (1) KR910000600B1 (de)
DE (1) DE3768995D1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2628631B2 (ja) * 1986-04-09 1997-07-09 アポロ精工株式会社 ワイヤストリツパー装置及びこれを用いた自動配線装置
US5393951A (en) * 1993-02-01 1995-02-28 Watteredge-Uniflex, Inc. Flexible jumper and method of making
ES2130059B1 (es) * 1997-02-04 2000-02-16 Mecanismos Aux Ind Un cabezal insertador de pines de distintas longitudes.
DE60045182D1 (de) * 1999-09-29 2010-12-16 Kaneka Corp Verfahren und Gerät zur automatischen Lötung von einem Anschlussdraht an einer Sonnenzellenbatterie
US20090179511A1 (en) * 2007-03-22 2009-07-16 Tecnomatic, S.P.A. Stators having female connectors and methods for forming female connectors integral with the stator winding conductors
ES2332551B1 (es) * 2007-05-24 2011-02-10 Construcciones Mecanicas Jose Lazpiur, S.A. Cabezal de insercion de pins en placas de circuito impreso.
US10804670B2 (en) 2016-11-02 2020-10-13 Panasonic Intellectual Property Management Co., Ltd. Electronic equipment assembly apparatus and electronic equipment assembly method
JP6688971B2 (ja) * 2016-11-02 2020-04-28 パナソニックＩｐマネジメント株式会社 電子機器組立装置および電子機器組立方法
US11420287B2 (en) * 2019-09-29 2022-08-23 Ningbo Shangjin Automation Technology Co., Ltd. Wire clamping system for fully automatic wire bonding machine
US11850765B2 (en) * 2020-03-06 2023-12-26 Flexible Steel Lacing Company Cutting apparatus and method for cutting belts
CN111843099B (zh) * 2020-07-28 2022-03-25 安徽蓝锐电子科技有限公司 阵列式led灯珠导线焊接系统
CN115922021A (zh) * 2021-08-12 2023-04-07 台达电子工业股份有限公司 自动焊锡加工系统及自动焊锡加工方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3650450A (en) * 1969-11-24 1972-03-21 Wells Electronics Means for forming electrical joints between intermediate parts of an elongated conductor and selected conductive element on an electrical assembly
US3734386A (en) * 1971-06-30 1973-05-22 Ibm Wiring apparatus with wire path forming means
JPS5331541B2 (de) * 1972-12-15 1978-09-02
US3960309A (en) * 1974-07-31 1976-06-01 International Business Machines Corporation Fine wire twisted pair routing and connecting system
JPS535089A (en) * 1976-07-06 1978-01-18 Kao Corp Production of high concentration aqueous solution or slurry of surfactant
US4230925A (en) * 1978-08-28 1980-10-28 Mcdonnell Douglas Corporation Circuit board wire bonding and cutting apparatus
US4359623A (en) * 1981-01-05 1982-11-16 Western Electric Company, Inc. Method and apparatus for bonding terminals to electrical devices
JPS5917554A (ja) * 1982-07-22 1984-01-28 Tomoegawa Paper Co Ltd 電子写真感光体
JPS59186283A (ja) * 1983-04-07 1984-10-23 富士通株式会社 マトリツクス自動配線装置
JPS60233898A (ja) * 1984-05-04 1985-11-20 三菱電機株式会社 自動布線方法及びそれに使用する自動布線装置
JPS6284599A (ja) * 1985-10-08 1987-04-18 株式会社東芝 ジヤンパ−配線装置

Also Published As

Publication number Publication date
KR910000600B1 (ko) 1991-01-26
EP0240835A3 (en) 1988-03-02
JPH0344440B2 (de) 1991-07-05
JPS62238700A (ja) 1987-10-19
US4746048A (en) 1988-05-24
EP0240835B1 (de) 1991-04-03
EP0240835A2 (de) 1987-10-14
KR870010767A (ko) 1987-11-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee