SE7810754L - Surt galvaniskt kopparbad - Google Patents

Surt galvaniskt kopparbad

Info

Publication number
SE7810754L
SE7810754L SE7810754A SE7810754A SE7810754L SE 7810754 L SE7810754 L SE 7810754L SE 7810754 A SE7810754 A SE 7810754A SE 7810754 A SE7810754 A SE 7810754A SE 7810754 L SE7810754 L SE 7810754L
Authority
SE
Sweden
Prior art keywords
sour
copper bath
galvanic copper
galvanic
bath
Prior art date
Application number
SE7810754A
Other languages
English (en)
Other versions
SE447275B (sv
Inventor
W Dahms
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of SE7810754L publication Critical patent/SE7810754L/sv
Publication of SE447275B publication Critical patent/SE447275B/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lubricants (AREA)
  • Detergent Compositions (AREA)
SE7810754A 1977-10-17 1978-10-16 Surt galvaniskt kopparbad samt anvendning av detsamma for utfellning av glensande kopparskikt SE447275B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2746938A DE2746938C2 (de) 1977-10-17 1977-10-17 Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades

Publications (2)

Publication Number Publication Date
SE7810754L true SE7810754L (sv) 1979-04-18
SE447275B SE447275B (sv) 1986-11-03

Family

ID=6021780

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7810754A SE447275B (sv) 1977-10-17 1978-10-16 Surt galvaniskt kopparbad samt anvendning av detsamma for utfellning av glensande kopparskikt

Country Status (8)

Country Link
US (1) US4181582A (sv)
JP (1) JPS59596B2 (sv)
CH (1) CH642686A5 (sv)
DE (1) DE2746938C2 (sv)
FR (1) FR2406009A1 (sv)
GB (1) GB2009238B (sv)
IT (1) IT1099997B (sv)
SE (1) SE447275B (sv)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3012168A1 (de) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur galvanischen abscheidung von kupferniederschlaegen
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
WO1984001393A1 (en) * 1982-09-30 1984-04-12 Learonal Inc Electrolytic copper plating solutions
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
DE3240643A1 (de) * 1982-11-04 1984-05-30 LPW-Chemie GmbH, 4040 Neuss Erzeugung von leiterbahnbeschichtungen und leitenden lochwandbeschichtungen auf bzw. in leiterplatten
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
AU554236B2 (en) * 1983-06-10 1986-08-14 Omi International Corp. Electrolyte composition and process for electrodepositing copper
DE3404267A1 (de) * 1984-02-03 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Verfahren zur vollautomatischen steuerung der galvanischen abscheidung von kupferueberzuegen aus sauren kupferbaedern
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
US4673469A (en) * 1984-06-08 1987-06-16 Mcgean-Rohco, Inc. Method of plating plastics
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
DE3836521C2 (de) * 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
US4969979A (en) * 1989-05-08 1990-11-13 International Business Machines Corporation Direct electroplating of through holes
ATE188516T1 (de) 1990-03-19 2000-01-15 Atotech Deutschland Gmbh Wässriges, saures bad zur galvanischen abscheidung von glänzenden und rissfreien kupferüberzügen und verwendung dieses bades
DE4032864A1 (de) * 1990-10-13 1992-04-16 Schering Ag Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination
DE4126502C1 (sv) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5733429A (en) * 1996-09-10 1998-03-31 Enthone-Omi, Inc. Polyacrylic acid additives for copper electrorefining and electrowinning
US6024857A (en) * 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
DE19758121C2 (de) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
JP4793530B2 (ja) * 2001-07-02 2011-10-12 上村工業株式会社 硫酸銅めっき浴
KR100389061B1 (ko) * 2002-11-14 2003-06-25 일진소재산업주식회사 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법
DE10337669B4 (de) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
DE102005011708B3 (de) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages
EP2568063A1 (en) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method
US10106512B2 (en) 2015-04-28 2018-10-23 Dow Global Technologies Llc Metal plating compositions
CN107447237B (zh) * 2016-05-30 2021-04-20 史莱福灵有限公司 具有降低的接触噪声的滑环

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2798040A (en) * 1955-09-15 1957-07-02 Dow Chemical Co Electrowinning of metals
US2888390A (en) * 1956-11-08 1959-05-26 Anaconda Co Electrolytic refining of copper
US2954331A (en) * 1958-08-14 1960-09-27 Dayton Bright Copper Company Bright copper plating bath
US3287236A (en) * 1964-02-14 1966-11-22 Langbein Pfanhausen Werke A G Electrodeposition of copper and solutions therefor
SE322956B (sv) 1966-08-20 1970-04-20 Schering Ag
US3804729A (en) * 1972-06-19 1974-04-16 M & T Chemicals Inc Electrolyte and process for electro-depositing copper
JPS5330279B2 (sv) * 1972-07-19 1978-08-25
JPS4931406A (sv) * 1972-07-20 1974-03-20

Also Published As

Publication number Publication date
FR2406009A1 (fr) 1979-05-11
DE2746938A1 (de) 1979-04-19
US4181582A (en) 1980-01-01
DE2746938C2 (de) 1987-04-09
IT7828812A0 (it) 1978-10-17
SE447275B (sv) 1986-11-03
GB2009238A (en) 1979-06-13
JPS59596B2 (ja) 1984-01-07
GB2009238B (en) 1982-05-26
IT1099997B (it) 1985-09-28
CH642686A5 (de) 1984-04-30
JPS5464025A (en) 1979-05-23
FR2406009B1 (sv) 1982-06-11

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