SE7702857L - Pleteringsforfarande - Google Patents

Pleteringsforfarande

Info

Publication number
SE7702857L
SE7702857L SE7702857A SE7702857A SE7702857L SE 7702857 L SE7702857 L SE 7702857L SE 7702857 A SE7702857 A SE 7702857A SE 7702857 A SE7702857 A SE 7702857A SE 7702857 L SE7702857 L SE 7702857L
Authority
SE
Sweden
Prior art keywords
plating procedure
plating
procedure
Prior art date
Application number
SE7702857A
Other languages
English (en)
Inventor
R V Dafter
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of SE7702857L publication Critical patent/SE7702857L/sv

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/924Electrolytic coating substrate predominantly comprised of specified synthetic resin
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/924Electrolytic coating substrate predominantly comprised of specified synthetic resin
    • Y10S205/926Polyamide or polyimide, e.g. nylon

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SE7702857A 1976-03-25 1977-03-14 Pleteringsforfarande SE7702857L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/670,496 US4021314A (en) 1976-03-25 1976-03-25 Method of depositing a metal on a surface

Publications (1)

Publication Number Publication Date
SE7702857L true SE7702857L (sv) 1977-09-26

Family

ID=24690625

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7702857A SE7702857L (sv) 1976-03-25 1977-03-14 Pleteringsforfarande

Country Status (10)

Country Link
US (2) US4021314A (sv)
JP (1) JPS52117242A (sv)
CA (1) CA1087599A (sv)
DE (1) DE2712992A1 (sv)
FR (1) FR2345529A1 (sv)
GB (1) GB1574053A (sv)
HK (1) HK4481A (sv)
IT (1) IT1116612B (sv)
NL (1) NL7703038A (sv)
SE (1) SE7702857L (sv)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4096043A (en) * 1977-07-11 1978-06-20 Western Electric Company, Inc. Method of selectively depositing a metal on a surface of a substrate
DE3248778A1 (de) * 1982-12-31 1984-07-12 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung metallisierter poroeser festkoerper
US4557957A (en) * 1983-03-18 1985-12-10 W. L. Gore & Associates, Inc. Microporous metal-plated polytetrafluoroethylene articles and method of manufacture
US4563298A (en) * 1983-06-30 1986-01-07 Nalco Chemical Company Metal oxide/silica sols
US4613454A (en) * 1983-06-30 1986-09-23 Nalco Chemical Company Metal oxide/silica sols
DE3407114A1 (de) * 1984-02-28 1985-09-05 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von leiterplatten
JPS621876A (ja) * 1985-06-27 1987-01-07 Agency Of Ind Science & Technol ポリエチレンテレフタレ−ト成形体の金属めつき方法
JPS621877A (ja) * 1985-06-27 1987-01-07 Agency Of Ind Science & Technol ポリエチレンテレフタレ−ト成形体の金属めつき方法
EP0237575A1 (en) * 1985-09-11 1987-09-23 Denki Kagaku Kogyo Kabushiki Kaisha Mold assembly
JPS6263675A (ja) * 1985-09-14 1987-03-20 Agency Of Ind Science & Technol ポリエチレンテレフタレ−トフイルムの強磁性金属めつき方法
JPS6263676A (ja) * 1985-09-14 1987-03-20 Agency Of Ind Science & Technol ポリエチレンテレフタレ−トフイルムの強磁性金属めつき方法
JPS62207875A (ja) * 1986-03-10 1987-09-12 Agency Of Ind Science & Technol 金属めつきされた無機粒子粉末の製造方法
JPS62207878A (ja) * 1986-03-10 1987-09-12 Agency Of Ind Science & Technol 化学めつき用触媒ペ−ストを用いた金属めつき方法
JPS62207877A (ja) * 1986-03-10 1987-09-12 Agency Of Ind Science & Technol プラスチツクスの金属めつき方法
JPS62207876A (ja) * 1986-03-10 1987-09-12 Agency Of Ind Science & Technol ポリ塩化ビニリデン成形体の金属めつき方法
JPS6379975A (ja) * 1986-09-22 1988-04-09 Agency Of Ind Science & Technol 金属めつきされた無機粒子粉末の製造方法
US4910072A (en) * 1986-11-07 1990-03-20 Monsanto Company Selective catalytic activation of polymeric films
US5075037A (en) * 1986-11-07 1991-12-24 Monsanto Company Selective catalytic activation of polymeric films
US5098740A (en) * 1989-12-13 1992-03-24 Norton Company Uniformly-coated ceramic particles
JPH04234437A (ja) * 1990-10-04 1992-08-24 Internatl Business Mach Corp <Ibm> 金属−有機ポリマー結合体の製造方法
GB2253415A (en) * 1991-02-08 1992-09-09 Eid Empresa De Investigacao E Selective process for printed circuit board manufacturing employing noble metal oxide catalyst.
US5419954A (en) * 1993-02-04 1995-05-30 The Alpha Corporation Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof
US5348574A (en) * 1993-07-02 1994-09-20 Monsanto Company Metal-coated polyimide
US5929741A (en) * 1994-11-30 1999-07-27 Hitachi Chemical Company, Ltd. Current protector
JP2001244127A (ja) 2000-02-29 2001-09-07 Murata Mfg Co Ltd 高周波部品および通信装置
US6979478B1 (en) 2002-08-01 2005-12-27 Hilemn, Llc Paint for silver film protection and method
WO2006085669A1 (en) * 2005-02-08 2006-08-17 Fujifilm Corporation Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and tft wiring board using the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3140252A (en) * 1961-12-21 1964-07-07 Socony Mobil Oil Co Inc Hydrocarbon conversion with crystalline acid-metal aluminosilicates
US3470019A (en) * 1965-02-04 1969-09-30 Matthey Bishop Inc Platinum coating composition,process and platinum-coated materials
JPS4329242Y1 (sv) * 1965-10-11 1968-12-02
US3597266A (en) * 1968-09-23 1971-08-03 Enthone Electroless nickel plating
US3671291A (en) * 1969-06-02 1972-06-20 Ppg Industries Inc Electroless process for forming thin metal films
US3698919A (en) * 1969-08-14 1972-10-17 Macdermid Inc Preparation of plastic substrates for electroless plating and solutions therefor
US3817774A (en) * 1969-08-14 1974-06-18 Macdermid Inc Preparation of plastic substrates for electroless plating
US3650913A (en) * 1969-09-08 1972-03-21 Macdermid Inc An electroless plating process employing a specially prepared palladium-tin activator solution
US3622367A (en) * 1970-03-24 1971-11-23 Mobil Oil Corp Contact deposition of platinum and other metals
US3704156A (en) * 1970-07-13 1972-11-28 Du Pont Catalyst solution for electroless plating on nonconductors
US3770785A (en) * 1970-09-24 1973-11-06 Du Pont Bis(dialkylaminomethyl)phenylenedipalladium(ii) compounds
US3769061A (en) * 1971-06-14 1973-10-30 Shipley Co Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating
US3871889A (en) * 1973-10-29 1975-03-18 Enthone Activator solutions, their preparation, and use in electroless plating of surfaces
US3963590A (en) * 1975-02-25 1976-06-15 E. I. Du Pont De Nemours And Company Process for electroplating polyoxymethylene

Also Published As

Publication number Publication date
HK4481A (en) 1981-02-20
FR2345529B1 (sv) 1980-03-07
GB1574053A (en) 1980-09-03
US4097286A (en) 1978-06-27
IT1116612B (it) 1986-02-10
US4021314A (en) 1977-05-03
DE2712992A1 (de) 1978-02-09
NL7703038A (nl) 1977-09-27
CA1087599A (en) 1980-10-14
FR2345529A1 (fr) 1977-10-21
JPS52117242A (en) 1977-10-01

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