DE2628350C3 - Verfahren zur Herstellung von nichtmetallisierbaren Oberflächen auf Schichtstoffen unter Verwendung eines gelösten Antimonkomplexes und Anwendung des Verfahrens - Google Patents
Verfahren zur Herstellung von nichtmetallisierbaren Oberflächen auf Schichtstoffen unter Verwendung eines gelösten Antimonkomplexes und Anwendung des VerfahrensInfo
- Publication number
- DE2628350C3 DE2628350C3 DE2628350A DE2628350A DE2628350C3 DE 2628350 C3 DE2628350 C3 DE 2628350C3 DE 2628350 A DE2628350 A DE 2628350A DE 2628350 A DE2628350 A DE 2628350A DE 2628350 C3 DE2628350 C3 DE 2628350C3
- Authority
- DE
- Germany
- Prior art keywords
- weight
- production
- application
- laminates
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 238000000034 method Methods 0.000 title claims description 23
- 229910052787 antimony Inorganic materials 0.000 title claims description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 title claims description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 27
- 238000005470 impregnation Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 239000003054 catalyst Substances 0.000 claims description 14
- 238000001465 metallisation Methods 0.000 claims description 13
- 231100000614 poison Toxicity 0.000 claims description 13
- 239000002574 poison Substances 0.000 claims description 10
- 239000000654 additive Substances 0.000 claims description 8
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 6
- 229940095064 tartrate Drugs 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000243 solution Substances 0.000 description 20
- 239000007787 solid Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229940049920 malate Drugs 0.000 description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N malic acid Chemical compound OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 150000003464 sulfur compounds Chemical class 0.000 description 2
- NRGHRGHIMYYGGE-UHFFFAOYSA-K C(C(O)CO)(=O)[O-].[Sb+3].C(C(O)CO)(=O)[O-].C(C(O)CO)(=O)[O-] Chemical compound C(C(O)CO)(=O)[O-].[Sb+3].C(C(O)CO)(=O)[O-].C(C(O)CO)(=O)[O-] NRGHRGHIMYYGGE-UHFFFAOYSA-K 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- 208000006558 Dental Calculus Diseases 0.000 description 1
- AEMRFAOFKBGASW-UHFFFAOYSA-M Glycolate Chemical compound OCC([O-])=O AEMRFAOFKBGASW-UHFFFAOYSA-M 0.000 description 1
- JVTAAEKCZFNVCJ-UHFFFAOYSA-M Lactate Chemical compound CC(O)C([O-])=O JVTAAEKCZFNVCJ-UHFFFAOYSA-M 0.000 description 1
- -1 Mucat Chemical compound 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- OMBMSYHTUZQOEY-UHFFFAOYSA-K antimony(3+);2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Sb+3].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O OMBMSYHTUZQOEY-UHFFFAOYSA-K 0.000 description 1
- XCSAHPBBCIBIQD-UHFFFAOYSA-K bis(2-hydroxypropanoyloxy)stibanyl 2-hydroxypropanoate Chemical compound [Sb+3].CC(O)C([O-])=O.CC(O)C([O-])=O.CC(O)C([O-])=O XCSAHPBBCIBIQD-UHFFFAOYSA-K 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Chemically Coating (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2628350A DE2628350C3 (de) | 1976-06-24 | 1976-06-24 | Verfahren zur Herstellung von nichtmetallisierbaren Oberflächen auf Schichtstoffen unter Verwendung eines gelösten Antimonkomplexes und Anwendung des Verfahrens |
| AT380177A AT351885B (de) | 1976-06-24 | 1977-05-27 | Verfahren zum herstellen von metallophoben (metallabweisenden) oberflaechen auf gegen- staenden, insbesondere fuer die herstellung von basismaterial fuer gedruckte schaltungen |
| IT24504/77A IT1077233B (it) | 1976-06-24 | 1977-06-08 | Procedimento per la metallofobizzazione di oggetti,in particolare di materiali isolanti per circuiti stampati |
| GB24333/77A GB1547079A (en) | 1976-06-24 | 1977-06-10 | Methods of producing at least partially metallophobic surfaces on nom-metllic sheet materials |
| SE7707077A SE424005B (sv) | 1976-06-24 | 1977-06-17 | Forfarande for framstellning av metallavvisande ytor pa foremal samt anvendning av forfarandet for tillverkning av tryckta kretsar |
| CA281,246A CA1104010A (en) | 1976-06-24 | 1977-06-23 | Methods of producing at least partially metallophobic surfaces on objects |
| CH773777A CH632299A5 (en) | 1976-06-24 | 1977-06-23 | Process for producing metallophobic surfaces on objects |
| FR7719444A FR2355923A1 (fr) | 1976-06-24 | 1977-06-24 | Procede permettant de rendre metallophobes des objets, en particulier des matieres isolantes de circuits imprimes |
| JP7536177A JPS537538A (en) | 1976-06-24 | 1977-06-24 | Method of producing metallophobic surface on object article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2628350A DE2628350C3 (de) | 1976-06-24 | 1976-06-24 | Verfahren zur Herstellung von nichtmetallisierbaren Oberflächen auf Schichtstoffen unter Verwendung eines gelösten Antimonkomplexes und Anwendung des Verfahrens |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2628350A1 DE2628350A1 (de) | 1977-12-29 |
| DE2628350B2 DE2628350B2 (de) | 1978-04-20 |
| DE2628350C3 true DE2628350C3 (de) | 1978-12-07 |
Family
ID=5981334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2628350A Expired DE2628350C3 (de) | 1976-06-24 | 1976-06-24 | Verfahren zur Herstellung von nichtmetallisierbaren Oberflächen auf Schichtstoffen unter Verwendung eines gelösten Antimonkomplexes und Anwendung des Verfahrens |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS537538A (enExample) |
| AT (1) | AT351885B (enExample) |
| CA (1) | CA1104010A (enExample) |
| CH (1) | CH632299A5 (enExample) |
| DE (1) | DE2628350C3 (enExample) |
| FR (1) | FR2355923A1 (enExample) |
| GB (1) | GB1547079A (enExample) |
| IT (1) | IT1077233B (enExample) |
| SE (1) | SE424005B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4151313A (en) * | 1977-03-11 | 1979-04-24 | Hitachi, Ltd. | Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material |
| JPS6054998A (ja) * | 1983-09-06 | 1985-03-29 | Nikkiso Co Ltd | 気相成長炭素繊維の製造方法 |
| JPS60185818A (ja) * | 1984-03-01 | 1985-09-21 | Nikkiso Co Ltd | 気相法炭素繊維の製造方法 |
| JPS6074599A (ja) * | 1983-09-30 | 1985-04-26 | 株式会社日立製作所 | プリント配線板及びその製造方法 |
| JPS60224816A (ja) * | 1984-04-20 | 1985-11-09 | Nikkiso Co Ltd | 気相成長による炭素繊維の製造方法 |
| FR2564110B1 (fr) * | 1984-05-10 | 1986-09-05 | Lorraine Carbone | Procede de production de fibres de carbone vapo-deposees a partir de methane |
| ES2053566T5 (es) * | 1986-11-20 | 2000-06-01 | Ciba Spec Chem Water Treat Ltd | Productos absorbentes y su fabricacion. |
| JP4794248B2 (ja) * | 2005-09-14 | 2011-10-19 | 卓 新井 | 亜鉛もしくは亜鉛合金製品用表面処理剤 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3775121A (en) * | 1972-08-09 | 1973-11-27 | Western Electric Co | Method of selectively depositing a metal on a surface of a substrate |
-
1976
- 1976-06-24 DE DE2628350A patent/DE2628350C3/de not_active Expired
-
1977
- 1977-05-27 AT AT380177A patent/AT351885B/de not_active IP Right Cessation
- 1977-06-08 IT IT24504/77A patent/IT1077233B/it active
- 1977-06-10 GB GB24333/77A patent/GB1547079A/en not_active Expired
- 1977-06-17 SE SE7707077A patent/SE424005B/xx unknown
- 1977-06-23 CH CH773777A patent/CH632299A5/de not_active IP Right Cessation
- 1977-06-23 CA CA281,246A patent/CA1104010A/en not_active Expired
- 1977-06-24 JP JP7536177A patent/JPS537538A/ja active Pending
- 1977-06-24 FR FR7719444A patent/FR2355923A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| CH632299A5 (en) | 1982-09-30 |
| SE424005B (sv) | 1982-06-21 |
| SE7707077L (sv) | 1977-12-25 |
| FR2355923B1 (enExample) | 1981-10-16 |
| FR2355923A1 (fr) | 1978-01-20 |
| GB1547079A (en) | 1979-06-06 |
| DE2628350B2 (de) | 1978-04-20 |
| JPS537538A (en) | 1978-01-24 |
| ATA380177A (de) | 1979-01-15 |
| AT351885B (de) | 1979-08-27 |
| CA1104010A (en) | 1981-06-30 |
| IT1077233B (it) | 1985-05-04 |
| DE2628350A1 (de) | 1977-12-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OD | Request for examination | ||
| OI | Miscellaneous see part 1 | ||
| C3 | Grant after two publication steps (3rd publication) | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: PHILIPS KOMMUNIKATIONS INDUSTRIE AG, 8500 NUERNBER |
|
| 8339 | Ceased/non-payment of the annual fee |